MC9S08LL36CLK vs MC9S08PT16VTJ 对比
详细并排对比 MC9S08LL36CLK 出自 NXP Semiconductors 和 MC9S08PT16VTJ 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08LL36CLK | MC9S08PT16VTJ |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.84 | $1.89 |
| Manufacturer | NXP Semiconductors (Freescale) | — |
| Series | S08 / MC9S08LL | — |
| Core | HCS08, 8-bit | — |
| Program Memory Size | 36 KB (36K x 8) FLASH | — |
| RAM Size | 4 KB (4K x 8) | — |
| Maximum CPU Frequency | 40 MHz | 20 MHz |
| Operating Voltage (full speed) | 2.1 V to 3.6 V | — |
| Operating Voltage (to 20 MHz) | 1.8 V to 3.6 V | — |
| Number of I/O Pins | 39 | — |
| Oscillator Type | Internal | — |
| 封装 / 外壳 | 80-LQFP (14 x 14 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Peripherals | LCD driver, PWM, timers, ADC, BDM, watchdog | — |
| 工作温度 | -40 C to +85 C (industrial) | -40 °C to +105 °C |
| Programming Interface | Background Debug Mode (BDM) | — |
| Lead Free / RoHS Status | Compliant | — |
| Core Architecture | — | S08 (HCS08L) 8-bit CISC |
| Program Memory (Flash) | — | 16 KB (16K x 8) |
| RAM | — | 2 KB |
| EEPROM | — | 256 B |
| 电源电压 | — | 2.7 V to 5.5 V |
| 封装 | — | 20-TSSOP |
| Number of I/O | — | 17 (approx., per TSSOP-20) |
| ADC | — | 10-bit, multiple channels |
| Touch Sensing Interface (TSI) | — | Yes, integrated |
| FlexTimer (PWM) | — | Yes, motor-control optimized |
| Communication Interfaces | — | UART, SPI, I2C |
| Interrupt Sources | — | Up to 40 |
| Nested Interrupts | — | Up to 4 levels |
| Debug Interface | — | Background Debug Mode (BDM) |
| Low-Power Modes | — | Run / Wait / Stop (low-uA) |
| RoHS 状态 | — | Compliant |
| 生命周期状态 | — | NRND (Not Recommended for New Designs) |