MC9S12A256CCPV vs MC9S12B64CFUE 对比
详细并排对比 MC9S12A256CCPV 出自 NXP Semiconductors 和 MC9S12B64CFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP
MC9S12B64CFUE ⚠ 最后一次采购规格对比
| 参数 | MC9S12A256CCPV | MC9S12B64CFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Unknown | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $10.10 |
| Product Type | 16-bit HCS12 microcontroller | — |
| Product Family | MC9S12A256 | — |
| 最大时钟频率 | 25 MHz | — |
| Flash Memory | 256 KB (256K x 8) | 64 KB |
| Data Path | 16-bit | — |
| CPU | HCS12 core | — |
| External Bus | 8-bit narrow mode supported by the verified family description | — |
| 封装 | 112-LQFP (20 mm x 20 mm) | 80-QFP (14x14 mm) |
| Package Family | LQFP | — |
| 安装类型 | Surface Mount | Surface Mount |
| System Integration Module | Manages system resource mapping, clock generation, interrupt control, and bus interfacing | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| 电源电压 | [DATA_NEEDED: supply voltage range] | 5 V (typical) |
| RAM Memory | [DATA_NEEDED: RAM size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | 1 KB |
| Timer Resources | [DATA_NEEDED: timer configuration] | — |
| Communication Interfaces | [DATA_NEEDED: communication peripheral list] | — |
| GPIO | [DATA_NEEDED: GPIO count and multiplex details] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Pinout | [DATA_NEEDED: complete manufacturer pin list] | — |
| Core | — | HCS12 (S12 CISC, 16-bit) |
| RAM | — | 2 KB |
| Maximum CPU Frequency | — | 25 MHz |
| 工作温度范围 | — | 0C to +70C (commercial 'C' grade) |
| ADC | — | 8-channel, 10-bit |
| CAN Module | — | 1x MSCAN 2.0A/B |
| SCI/SPI | — | 2x SCI, 1x SPI |
| Timers | — | 16-bit Timer + 8-bit PWM + PIT |
| I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Terminal Finish | — | Matte Tin (Sn) |
| Peak Reflow Temperature | — | 260C (max 40 s) |