MC9S12D64CFUE vs MC9S12D64MFUE 对比

详细并排对比 MC9S12D64CFUE 出自 NXP Semiconductors 和 MC9S12D64MFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12D64CFUE MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE Nrnd
NXP Semiconductors
MC9S12D64MFUE MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE Nrnd

规格对比

参数 MC9S12D64CFUE MC9S12D64MFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $16.20 $8.35
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 64 KB (64K x 8) —
RAM 4 KB —
EEPROM 1 KB —
Number of I/O 59 59
ADC 8-channel, 10-bit 2 x 10-bit, 8 channels each (16 ADC channels total)
电源电压 2.5 V / 5 V 2.5 V / 5 V
封装 80-QFP (14 x 14 mm) 80-QFP (14 x 14 mm), also called PQFP-80
安装类型 Surface Mount Surface Mount (SMD/SMT)
Communication Peripherals 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) —
Timers ECT, TIM, PWM, PIT —
工作温度 [DATA_NEEDED: operating temperature range] —
RoHS 状态 [DATA_NEEDED: RoHS compliance status] Compliant
Packaging Tray —
Core Architecture — HCS12 (16-bit CISC)
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Program Memory Type — Flash
Program Memory Size — 64 KB (64K x 8)
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
工作温度范围 — -40 C to +125 C
Automotive Qualification — AEC-Q100
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

数据手册与资源

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