MC9S12DJ128MPVE vs MC9S12DJ128CPVE 对比
详细并排对比 MC9S12DJ128MPVE 出自 NXP Semiconductors 和 MC9S12DJ128CPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S12DJ128CPVE - HCS12 16-bit MCU, 128KB Flash, 112-LQFP | NXP
MC9S12DJ128CPVE Nrnd规格对比
| 参数 | MC9S12DJ128MPVE | MC9S12DJ128CPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $19.25 | $19.75 |
| Core Architecture | HCS12 (16-bit CISC) | — |
| Program Memory (Flash) | 128 KB (128K x 8) | — |
| RAM | 8 KB | — |
| EEPROM | 2 KB | — |
| Maximum CPU Clock | 25 MHz (50 MHz internal bus via PLL, see datasheet) | — |
| 电源电压 | 2.35 V to 2.75 V (single 2.5V nominal) | — |
| Digital I/O Pins | 59 | 20 |
| ADC | 2x 8-channel, 10-bit | — |
| PWM Channels | 8 | 8 |
| SCI (UART) | 2 | — |
| SPI | 1 | — |
| I2C (Inter-IC Bus) | 1 | — |
| 封装 | 112-LQFP (20x20 mm) | 112-LQFP (20 x 20 mm) |
| 工作温度 | -40C to +125C (automotive grade) | — |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Core | — | HCS12 |
| 数据总线宽度 | — | 16 bit |
| 最大时钟频率 | — | 25 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| RAM Size | — | [DATA_NEEDED: RAM size in bytes] |
| Supply Voltage Range | — | [DATA_NEEDED: VDD min/max] |
| 工作温度范围 | — | [DATA_NEEDED: -40C to +85C or -40C to +125C] |
| SCI (UART) Interfaces | — | 2 |
| SPI Interfaces | — | 2 |
| I2C (Inter-IC Bus) Interfaces | — | 1 |
| ADC Channels | — | 2 x 8-channel, 10-bit |
| Enhanced Capture Timer Channels | — | 8 (IC/OC) |
| 生命周期状态 | — | NRND (Not Recommended for New Designs) |