MC9S12DT256CPVE vs MC9S12DT256MFUE 对比

详细并排对比 MC9S12DT256CPVE 出自 NXP Semiconductors 和 MC9S12DT256MFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd
NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ 量产中

规格对比

参数 MC9S12DT256CPVE MC9S12DT256MFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $20.85 $19.20
Core Processor HCS12 (CPU12 CISC) —
Core Size 16-bit —
最大时钟频率 25 MHz —
Program Memory Size 256 KB (256K x 8) Flash —
RAM Size 12 KB —
EEPROM Size 4 KB —
数据总线宽度 16-bit 16-bit
电源电压 2.35 V to 2.75 V (core), 5 V I/O tolerant typical —
Number of I/O Pins 91 91
ADC 2x 8-channel, 10-bit 16-channel, 10-bit (per family)
PWM Channels 8 channels —
Connectivity CAN, I2C, SCI (UART), SPI —
Timers 8-channel Enhanced Capture Timer (ECT) —
封装 112-pin LQFP (20x20 mm) —
工作温度 -40C to +85C (industrial, per 'P' suffix family) —
安装类型 Surface Mount Surface Mount
RoHS 状态 [DATA_NEEDED: RoHS status from manufacturer] [DATA_NEEDED: RoHS status]
Debug Interface BDM (Background Debug Mode) —
Watchdog COP (Computer Operating Properly) watchdog —
Core Architecture — HCS12 (CPU12), 16-bit CISC
Maximum CPU Frequency — 25 MHz
Flash Memory — 256 KB (256K x 8)
RAM — [DATA_NEEDED: RAM size]
EEPROM — [DATA_NEEDED: EEPROM size]
Operating Supply Voltage (Core) — 2.35 V to 2.75 V
I/O Supply Voltage — 5V-tolerant I/O on VDDR/VSSR
Package Type — 80-QFP (PQFP/LQFP-80, 14x14 mm)
Terminal Form — GULL WING
Number of Terminals — 80
Temperature Grade — Automotive
MSL 等级 — [DATA_NEEDED: MSL level]
On-chip CAN Module — MSCAN (CAN 2.0A/B)
PWM Module — 8-channel 16-bit PWM
Communication Peripherals — SCI, SPI, IIC, BDLC

数据手册与资源

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