MC9S12DT256MPVE vs MC9S12A128BCPV 对比
详细并排对比 MC9S12DT256MPVE 出自 NXP Semiconductors 和 MC9S12A128BCPV 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE Nrnd规格对比
| 参数 | MC9S12DT256MPVE | MC9S12A128BCPV |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $14.36 | $9.95 |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | [DATA_NEEDED: EEPROM size] |
| 数据总线宽度 | 16-bit | — |
| 电源电压 | 2.35 V to 2.75 V (regulated core) | — |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | — |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| 封装 | 112-LQFP (20x20 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +125C (automotive grade) | -40C to +85C (industrial) |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| RoHS 状态 | Compliant | [DATA_NEEDED] |
| 生命周期状态 | NRND (Not Recommended for New Designs) | — |
| Manufacturer | — | NXP USA Inc. |
| Series | — | HCS12 |
| Core Processor | — | HCS12 (16-bit CISC) |
| Core Size | — | 16-Bit |
| Speed | — | 25 MHz |
| Program Memory Size | — | 128 KB (128K x 8) FLASH |
| RAM Size | — | 4 KB |
| Number of I/O | — | 91 |
| 封装 / 外壳 | — | 112-LQFP (20 x 20 mm) |
| Oscillator Type | — | External |
| A/D Channels | — | [DATA_NEEDED: A/D channel count and resolution] |
| Connectivity | — | CAN, SCI, SPI, JTAG/BDM |
| Voltage Supply | — | [DATA_NEEDED: VDD range] |