MC9S12XD256MAL vs MC9S12XDT256MAL 对比

详细并排对比 MC9S12XD256MAL 出自 NXP Semiconductors 和 MC9S12XDT256MAL 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12XD256MAL MC9S12XD256MAL - 16-bit 256KB Flash HCS12X MCU 112-LQFP | NXP

MC9S12XD256MAL - 16-bit 256KB Flash HCS12X MCU 112-LQFP | NXP

MC9S12XD256MAL ✓ 量产中
NXP Semiconductors
MC9S12XDT256MAL MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP

MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP

MC9S12XDT256MAL Nrnd

规格对比

参数 MC9S12XD256MAL MC9S12XDT256MAL
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $17.85 $15.85
Core HCS12X (CISC, 16-bit) —
CPU Clock Speed 80 MHz —
Program Memory 256 KB Flash —
RAM 12 KB —
EEPROM 4 KB —
电源电压 2.35 V to 2.75 V (core) / 5 V (I/O tolerant) 2.5V / 5V
工作温度 -40 °C to +125 °C (automotive grade) -40C to +125C (automotive grade)
Co-processor XGATE RISC, 200 MHz equivalent XGATE peripheral co-processor
I/O Ports 119 —
ADC 16-channel, 12-bit, 2.5 µs conversion 10/12-bit (model dependent)
CAN 5 x msCAN modules —
PWM 8-channel —
Timers 8-channel 16-bit —
SPI 2 —
I2C 2 —
SCI/UART 3 —
封装 112-LQFP (20 x 20 mm) 112-pin LQFP (20x20 mm)
安装类型 Surface Mount Surface Mount
Temperature Grade Automotive —
RoHS 状态 Compliant Compliant
Core Architecture — HCS12X (16-bit CISC)
Program Memory (Flash) — 256KB (256K x 8)
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]
Maximum CPU Clock — 80 MHz
Bus Frequency — 40 MHz (typical, derived from 80MHz core)
Number of I/O Pins — [DATA_NEEDED: I/O count]
Communication Interfaces — CAN, SCI (UART), SPI, I2C
PWM Channels — [DATA_NEEDED: PWM channel count]
Instruction Set Compatibility — Upward compatible with HCS12
Automotive Qualification — AEC-Q100 qualified
MSL 等级 — 3 (per JEDEC J-STD-020)

数据手册与资源

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