MC9S12XDG128MAA vs MC9S12XDT512MAA 对比

详细并排对比 MC9S12XDG128MAA 出自 NXP Semiconductors 和 MC9S12XDT512MAA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12XDG128MAA MC9S12XDG128MAA - 16-bit HCS12X MCU, 128KB Flash, 80MHz, 80-QFP | NXP

MC9S12XDG128MAA - 16-bit HCS12X MCU, 128KB Flash, 80MHz, 80-QFP | NXP

MC9S12XDG128MAA ✗ 停产
NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd

规格对比

参数 MC9S12XDG128MAA MC9S12XDT512MAA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 不推荐新设计
库存状态 有库存 有库存
单价(USD) $10.45 $0.00
Core Architecture HCS12X (16-bit CISC, enhanced) —
CPU Core S12X with XGATE co-processor —
Maximum CPU Frequency 80 MHz (40 MHz bus) —
Program Memory (Flash) 128 KB (128K x 8) —
RAM 12 KB —
EEPROM [DATA_NEEDED: EEPROM size] —
Operating Voltage 2.5 V or 5 V (single supply with internal regulator) —
封装 80-pin QFP (14 x 14 mm), MAA suffix 80-QFP (14x14 mm), Square, Gull Wing
安装类型 Surface Mount Surface Mount
GPIO Count [DATA_NEEDED: GPIO count] —
ADC 8/10/12-bit, multi-channel [DATA_NEEDED: channel count] —
CAN Modules (msCAN) Multiple msCAN 2.0 A/B [DATA_NEEDED: number] —
Communication Interfaces CAN, SCI, SPI, I2C, J1850 —
Timers ECT (Enhanced Capture Timer), PIT, RTI [DATA_NEEDED: count] —
工作温度 -40C to +125C (industrial / automotive grade) -40C to +125C (TA)
MSL 等级 [DATA_NEEDED: MSL] —
RoHS 状态 Compliant —
Background Debug Mode Yes (BDM, single-wire) —
Instruction Set Compatibility Upward-compatible with HCS12, instruction queue, enhanced indexed addressing —
Core Processor — HCS12X
Core Size — 16-Bit
Maximum Clock Speed — 80 MHz
Program Memory Size — 512KB (512K x 8)
Program Memory Type — FLASH
RAM Size — 20KB
EEPROM Size — 4KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
ADC Resolution — 10-bit, 8-channel
电源电压 — [DATA_NEEDED: supply voltage range]
Packaging Method — Tray
无卤 — Compliant
ECCN — 3A991.a.2
Estimated EOL Date — 2028

数据手册与资源

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