MC9S12XDT256VAL vs MC9S12XDT512MAA 对比
详细并排对比 MC9S12XDT256VAL 出自 NXP Semiconductors 和 MC9S12XDT512MAA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S12XDT256VAL | MC9S12XDT512MAA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.20 | $0.00 |
| Product Type | 16-bit Microcontroller (MCU) | — |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor | — |
| CPU Instruction Set | CISC, upward-compatible with HCS12 | — |
| Maximum CPU Frequency | 80 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| Data Memory (RAM) | [DATA_NEEDED: RAM size, datasheet shows 16 KB] | — |
| EEPROM | 4 KB | — |
| ADC | 16-channel, 10-bit | — |
| CAN Controllers (msCAN) | [DATA_NEEDED: msCAN count] | — |
| General-Purpose I/O | Up to 91 GPIO | — |
| PWM Channels | 8 channels | — |
| Supply Voltage - Core | 2.5 V | — |
| Supply Voltage - I/O | 5 V | — |
| 工作温度 | -40C to +105C (VAL = Automotive grade) | -40C to +125C (TA) |
| 封装 | 112-LQFP (20 x 20 mm) | 80-QFP (14x14 mm), Square, Gull Wing |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | 3 | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| RoHS 状态 | Compliant | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| 电源电压 | — | [DATA_NEEDED: supply voltage range] |
| Packaging Method | — | Tray |
| 无卤 | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |