MC9S12XDT256VAL vs S912XET512J2VAGR 对比
详细并排对比 MC9S12XDT256VAL 出自 NXP Semiconductors 和 S912XET512J2VAGR 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S12XDT256VAL | S912XET512J2VAGR |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $9.20 | $1.00 |
| Product Type | 16-bit Microcontroller (MCU) | — |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor | 16-bit HCS12X (S12X core) |
| CPU Instruction Set | CISC, upward-compatible with HCS12 | — |
| Maximum CPU Frequency | 80 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| Data Memory (RAM) | [DATA_NEEDED: RAM size, datasheet shows 16 KB] | — |
| EEPROM | 4 KB | [DATA_NEEDED: EEPROM Size] |
| ADC | 16-channel, 10-bit | — |
| CAN Controllers (msCAN) | [DATA_NEEDED: msCAN count] | — |
| General-Purpose I/O | Up to 91 GPIO | — |
| PWM Channels | 8 channels | — |
| Supply Voltage - Core | 2.5 V | — |
| Supply Voltage - I/O | 5 V | — |
| 工作温度 | -40C to +105C (VAL = Automotive grade) | -40C to +105C |
| 封装 | 112-LQFP (20 x 20 mm) | 144-LQFP (LFQFP), 20x20 mm square |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | 3 | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS Status] |
| 生命周期状态 | NRND (Not Recommended for New Designs) | — |
| Core Frequency | — | 50 MHz |
| Flash Memory | — | 512 KB (512K x 8) |
| Qualification | — | Automotive Qualified |
| Temperature Grade | — | Industrial (per distributor listing) |
| Terminal Form | — | Gull Wing |
| Number of Terminals | — | 144 |
| Package Shape | — | Square |
| 电源电压 | — | [DATA_NEEDED: Supply Voltage Range] |
| RAM | — | [DATA_NEEDED: RAM Size] |
| Communication Interfaces | — | SPI, SCI (per distributor listing); CAN/LIN availability [DATA_NEEDED: CAN/LIN Channels] |
| Watchdog Timer | — | Yes (watchdog OSC/Timer per distributor listing) |