MC9S12XDT512MAA vs MC9S12XDP512MAL 对比

详细并排对比 MC9S12XDT512MAA 出自 NXP Semiconductors 和 MC9S12XDP512MAL 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd
NXP Semiconductors
MC9S12XDP512MAL MC9S12XDP512MAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP

MC9S12XDP512MAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP

MC9S12XDP512MAL Nrnd

规格对比

参数 MC9S12XDT512MAA MC9S12XDP512MAL
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $0.00 $16.40
Core Processor HCS12X HCS12X
Core Size 16-Bit 16-Bit
Maximum Clock Speed 80 MHz —
Program Memory Size 512KB (512K x 8) 512 KB (512K x 8) Flash
Program Memory Type FLASH —
RAM Size 20KB 32 KB
EEPROM Size 4KB 4 KB
Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT, ECT, ADC
Number of I/O 59 91
ADC Resolution 10-bit, 8-channel —
电源电压 [DATA_NEEDED: supply voltage range] 2.35 V to 2.75 V core
工作温度 -40C to +125C (TA) [DATA_NEEDED: operating temperature range]
封装 80-QFP (14x14 mm), Square, Gull Wing 112-LQFP (20x20 mm)
安装类型 Surface Mount Surface Mount
Packaging Method Tray —
无卤 Compliant —
ECCN 3A991.a.2 —
Estimated EOL Date 2028 —
Maximum Speed — 80 MHz
Bus Speed — 40 MHz
ADC Channels — 24-channel 10-bit

数据手册与资源

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