MC9S12XHZ256VAG vs S9S12HN64J3VAA 对比

详细并排对比 MC9S12XHZ256VAG 出自 NXP Semiconductors 和 S9S12HN64J3VAA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12XHZ256VAG MC9S12XHZ256VAG - 16-bit MCU 256KB Flash 80MHz 144-LQFP | NXP

MC9S12XHZ256VAG - 16-bit MCU 256KB Flash 80MHz 144-LQFP | NXP

MC9S12XHZ256VAG Nrnd
NXP Semiconductors
S9S12HN64J3VAA S9S12HN64J3VAA - 16-bit S12 MCU, 64KB Flash, 50MHz, QFP-80 | NXP

S9S12HN64J3VAA - 16-bit S12 MCU, 64KB Flash, 50MHz, QFP-80 | NXP

S9S12HN64J3VAA ✓ 量产中

规格对比

参数 MC9S12XHZ256VAG S9S12HN64J3VAA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $15.20 $9.75
Core Architecture HCS12X (16-bit) —
CPU Clock Frequency 80 MHz —
Program Memory (Flash) 256 KB (256K x 8) 64 KB
RAM 12 KB 4 KB
封装 144-LQFP (20x20 mm) QFP-80 (80-pin Quad Flat Package, gull wing)
工作温度 -40C to +105C (Automotive) —
引脚数 144 —
CAN Channels (MSCAN) 4 —
ADC 16-channel, 10-bit —
Display Controller Integrated TFT driver + LCD driver —
Coprocessor XGATE RISC coprocessor —
PWM Channels 8 channels —
Debug Interface BDM (Background Debug Mode) + JTAG BDM (Background Debug Mode)
电源电压 3.15 V to 5.5 V —
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
安装类型 Surface Mount (Gull Wing) Surface Mount
Temperature Grade Automotive (VAG suffix) INDUSTRIAL / AUTOMOTIVE
CPU Core — HCS12 (S12 core)
数据总线宽度 — 16-bit
Maximum CPU Frequency — 50 MHz
Supply Voltage Range — 2.5 V to 5 V
工作温度范围 — -40 C to +105 C
Number of I/O Lines — 85
Terminal Form — GULL WING
Package Code — QFP
Package Shape — SQUARE
Automotive Qualification — Yes (AEC-Q100)
On-Chip ADC — Yes (10/12-bit, multi-channel)
Serial Interfaces — SCI, SPI, I2C
CAN Controller — Yes (CAN 2.0)
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

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