MCF51AC256BVLKE vs MC9S12XS128MAE 对比

详细并排对比 MCF51AC256BVLKE 出自 NXP Semiconductors 和 MC9S12XS128MAE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCF51AC256BVLKE MCF51AC256BVLKE - ColdFire V1 MCU 256KB Flash 50MHz | NXP LQFP-80

MCF51AC256BVLKE - ColdFire V1 MCU 256KB Flash 50MHz | NXP LQFP-80

MCF51AC256BVLKE ⚠ 最后一次采购
NXP Semiconductors
MC9S12XS128MAE MC9S12XS128MAE - 16-bit 128KB Flash HCS12X MCU 64-LQFP | NXP (Tape & Reel)

MC9S12XS128MAE - 16-bit 128KB Flash HCS12X MCU 64-LQFP | NXP (Tape & Reel)

MC9S12XS128MAE ✓ 量产中

规格对比

参数 MCF51AC256BVLKE MC9S12XS128MAE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $8.95 $16.41
Core ColdFire V1 (32-bit RISC) —
Maximum CPU Frequency 50 MHz —
Program Flash Memory 256 KB —
SRAM 32 KB —
Supply Voltage Range 2.7 V to 5.5 V —
封装 80-pin LQFP (14x14 mm) 64-LQFP (10x10 mm)
工作温度范围 -40 °C to +105 °C (industrial) —
GPIO Count Up to 69 —
ADC 12-bit SAR, up to 16 channels —
ADC Conversion Time 2.5 µs minimum —
SCI (UART) Modules 3 —
SPI Modules 2 —
I2C Modules 2 —
Timers / PWM FlexTimer (FTM) modules with PWM —
Touch Sensing Interface TSI, up to 16 channels —
Low-Power Modes Stop, Wait with peripheral wake-up —
安装类型 Surface Mount (LQFP, gull-wing) Surface Mount
RoHS 状态 Compliant Compliant
无卤 Compliant —
Core Processor — HCS12X
Core Size — 16-Bit
Program Memory Size — 128KB (128K x 8) FLASH
EEPROM Size — 8KB
RAM Size — 8KB
Maximum Clock Speed — 40 MHz
电源电压 — 5 V
Number of I/O — 44
Connectivity — CANbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
工作温度 — -40C to +125C (Industrial/Automotive)
Part Status — Obsolete (per distributor listings)

数据手册与资源

浏览全部产品 创建 BOM 获取报价