MCF5274LVM166 vs MCF5274LCVM166 对比

详细并排对比 MCF5274LVM166 出自 NXP Semiconductors 和 MCF5274LCVM166 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCF5274LVM166 MCF5274LVM166 - 166MHz ColdFire V2 MPU | NXP | Industrial

MCF5274LVM166 - 166MHz ColdFire V2 MPU | NXP | Industrial

MCF5274LVM166 Nrnd
NXP Semiconductors
MCF5274LCVM166 MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP

MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP

MCF5274LCVM166 Nrnd

规格对比

参数 MCF5274LVM166 MCF5274LCVM166
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $0.00 $16.20
Product Type 32-bit ColdFire V2 integrated microprocessor —
Processor Speed 166 MHz —
Processor Architecture ColdFire V2 —
Program Memory ROMless ROMless (external boot)
RAM Size 64K x 8 —
I/O Count 61 I/O —
封装 196-LBGA, 15 x 15 mm 196-LBGA (15x15 mm)
Terminal Type Ball —
Number of Terminals 196 —
安装类型 Surface mount Surface Mount (BGA)
Oscillator Type External —
工作温度 0C to +70C [DATA_NEEDED: exact operating temperature range]
Temperature Grade Commercial Industrial
Supply Classification NRND —
Core Type 32-bit RISC processor —
Application Class Cost-sensitive, power-conscious embedded processing —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant (per distributor listing)
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Core — ColdFire V2 (MCF527x family)
Core Architecture — 32-bit RISC (ColdFire)
Maximum Core Frequency — 166 MHz
Core Supply Voltage — 1.5 V
I/O Supply Voltage — 3.3 V
RAM — [DATA_NEEDED: internal SRAM size]
Ethernet — 10/100 Fast Ethernet MAC (integrated PHY on selected family members)
USB — USB 2.0 Full-Speed Device/Host (integrated PHY on selected family members)
Cryptography — Hardware crypto accelerator (DES / 3DES / AES / SHA-1)
External Memory Bus — SDRAM / SRAM / ROM controller
DMA Channels — [DATA_NEEDED: number of DMA channels]
Serial Peripherals — UART, I2C, QSPI

数据手册与资源

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