MCF5307CAI90B vs MCF53010CQT240 对比

详细并排对比 MCF5307CAI90B 出自 NXP Semiconductors 和 MCF53010CQT240 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCF5307CAI90B MCF5307CAI90B - ColdFire V3 32-Bit MPU, 90MHz, 208-FQFP | NXP

MCF5307CAI90B - ColdFire V3 32-Bit MPU, 90MHz, 208-FQFP | NXP

MCF5307CAI90B ✓ 量产中
NXP Semiconductors
MCF53010CQT240 MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP

MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP

MCF53010CQT240 ✓ 量产中

规格对比

参数 MCF5307CAI90B MCF53010CQT240
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $25.75 $9.80
Processor Core ColdFire V3 —
Core Architecture 32-bit RISC (M68k-derived ColdFire) ColdFire V3 (Version 3) with EMAC
Maximum Core Frequency 90 MHz 240 MHz
Performance 70 MIPS (Dhrystone 2.1) —
Instruction Set ColdFire V3 + MAC (multiply-accumulate) —
电源电压 3.3 V 3.3 V I/O
Process Technology 0.32 um —
On-chip SRAM 4 KB —
External Memory Bus 32-bit (FPM/EDO/SDRAM DRAM supported) —
DMA Controller 4 channels —
Timers 3 timer modules —
UART 2 UARTs —
I2C 1 I2C interface —
QSPI 1 QSPI port —
Parallel I/O 16-bit general-purpose —
封装 208-FQFP (28 mm x 28 mm) 208-LQFP (28x28 mm)
安装类型 Surface Mount, Gull-Wing Surface Mount
Temperature Grade Commercial —
Core Type — 32-bit MPU (ROMless)
Dhrystone 2.1 MIPS — Up to 211 MIPS @ 240 MHz
Unified Cache — 16 KBytes (instruction/data)
Internal SRAM — 128 KBytes
Program Memory — ROMless (external memory required)
工作温度 — -40C to +85C (industrial)
Ethernet — 10/100 MAC (EMAC)
USB — USB 2.0 Full-Speed OTG
Other Connectivity — CAN, I2C, SPI, UART
Voice Codec — Integrated codec with amplifiers
RoHS 状态 — Compliant
MSL 等级 — 3 (per JEDEC J-STD-020)

数据手册与资源

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