MCF5329CVM240 vs MCF53281CVM240 对比

详细并排对比 MCF5329CVM240 出自 NXP Semiconductors 和 MCF53281CVM240 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCF5329CVM240 MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 Nrnd
NXP Semiconductors
MCF53281CVM240 MCF53281CVM240 - ColdFire V3 MPU, 240MHz, 256-MAPBGA | NXP

MCF53281CVM240 - ColdFire V3 MPU, 240MHz, 256-MAPBGA | NXP

MCF53281CVM240 Nrnd

规格对比

参数 MCF5329CVM240 MCF53281CVM240
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $25.60 $25.20
Core Architecture ColdFire V3 (VLRISC) Version 3 ColdFire
Core Bit Width 32-bit —
最大时钟频率 240 MHz —
On-chip SRAM 32 KB —
Unified Cache 16 KB write-back —
Program Memory Type ROMless (external memory bus required) ROMless (external memory required)
Number of I/O Lines 94 —
封装 256-LBGA (MAPBGA) 256-MAPBGA (17x17 mm)
安装类型 Surface Mount Surface Mount
电源电压 1.5 V core / 3.3 V I/O (typical, refer to datasheet) —
工作温度 -40C to +85C (industrial) —
Oscillator Type External External
LCD Controller Integrated (TFT/STN, first integrated LCD on ColdFire) —
Ethernet 10/100 MAC integrated —
USB USB 2.0 Full-Speed OTG —
Debug Interface JTAG/BDM/OnCE JTAG (IEEE 1149.1), BDM
Packaging Tray Tray
RoHS 状态 Compliant [DATA_NEEDED: RoHS status from NXP product page]
Core — ColdFire V3 (variable-length RISC, 32-bit)
Maximum Core Frequency — 240 MHz
On-chip Program Memory — None
RAM Size — 32K x 8 (256 Kbit on-chip SRAM)
Number of I/O — 94
Integrated LCD Controller — Yes (first LCD controller integrated on ColdFire family)
Operating Temperature Grade — Industrial
Lead-Free — [DATA_NEEDED: lead-free status]
Connectivity — Ethernet MAC, USB OTG, CAN

数据手册与资源

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