MCF54455VR266 vs MCF54454VR266 对比

详细并排对比 MCF54455VR266 出自 NXP Semiconductors 和 MCF54454VR266 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCF54455VR266 MCF54455VR266 - Coldfire V4 32-Bit MPU, 266MHz, 360-TEPBGA | NXP

MCF54455VR266 - Coldfire V4 32-Bit MPU, 266MHz, 360-TEPBGA | NXP

MCF54455VR266 ⚠ 最后一次采购
NXP Semiconductors
MCF54454VR266 MCF54454VR266 - Coldfire V4 MPU, 266MHz, 360-TEPBGA | NXP

MCF54454VR266 - Coldfire V4 MPU, 266MHz, 360-TEPBGA | NXP

MCF54454VR266 ✗ 停产

规格对比

参数 MCF54455VR266 MCF54454VR266
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 停产
库存状态 有库存 有库存
单价(USD) $16.43 $17.20
Core Architecture ColdFire V4 (32-bit RISC, MMU) —
Core Frequency 266 MHz —
Instruction Set Width 32-bit —
On-chip Program Memory ROMless (external boot required) —
On-chip SRAM [DATA_NEEDED: internal SRAM size in KB] —
External Memory Bus 32-bit address/data; SDRAM/DDR, SRAM, NOR flash —
Supply Voltage (Core/IO) 1.8 V / 2.5 V / 3.3 V (mixed) —
Ethernet 10/100 MAC (eNet) —
USB USB 2.0 On-The-Go (USB OTG) —
PCI PCI v2.3 bus controller —
Serial Connectivity UART, I2C, SPI, SSI/I2S, FlexCAN —
MMU Yes (supports protected OS / Linux) —
工作温度 0C to +70C (industrial grade variants may exist) [DATA_NEEDED: operating temperature range]
封装 360-TEPBGA (23x23 mm) 360-TEPBGA (23x23 mm)
安装类型 Surface Mount, BGA Surface Mount
MSL 等级 [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL level]
RoHS 状态 Compliant per NXP product page Compliant
Core Processor — ColdFire V4
Core Size — 32-Bit
Maximum Clock Speed — 266 MHz
Program Memory Type — ROMless (external flash required)
Number of I/O — 132
Connectivity — I2C, SPI, SSI, UART/USART, USB OTG
Peripherals — DMA, WDT (Watchdog Timer)
电源电压 — 1.8V / 2.5V / 3.3V
MMU (Memory Management Unit) — Yes
FPU (Floating-Point Unit) — Present (this variant)
Ethernet MAC — Integrated
PCI Interface — Integrated
USB OTG — Integrated

数据手册与资源

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