MPC8250ACZQIHBC vs MPC8270CVRMIBA 对比
详细并排对比 MPC8250ACZQIHBC 出自 NXP Semiconductors 和 MPC8270CVRMIBA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
规格对比
| 参数 | MPC8250ACZQIHBC | MPC8270CVRMIBA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $99.50 | $88.75 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | PowerQUICC II (MPC82xx) |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | — |
| Clock Speed | 200 MHz | 266 MHz |
| Number of Cores | 1 (CPU) + 1 CPM | — |
| 数据总线宽度 | 64-Bit | 64-Bit |
| Supply Voltage (Core) | 1.8 V | 1.5 V |
| Supply Voltage (I/O) | 3.3 V | — |
| 工作温度 | -40C to +105C (industrial) | -40 C to +105 C |
| Package Type | TEPBGA / Plastic BGA | 516-PBGA (27 x 27 mm, 1 mm pitch) |
| 引脚数量 | 516 | — |
| Package Dimensions | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Process Technology | 0.25 um CMOS | — |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL 等级 | 3 (168 hours) | [DATA_NEEDED: MSL moisture sensitivity level] |
| Lead Free | Yes (per datasheet package code) | — |
| Architecture | — | PowerPC G2_LE |
| Core | — | 1 Core, 32-Bit |
| I/O Voltage | — | 3.3 V |
| Integrated Peripherals | — | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART |
| Process Node | — | 0.13 µm (HiP7) |
| Height (max) | — | 2.25 mm |
| RoHS 状态 | — | Lead-Free / Compliant (per package marking) |
| Ethernet Speed | — | 10/100 Mbps (3 ports) |
| USB Version | — | USB 2.0 |
| Product Status | — | End of Life (EOL) - Discontinuance issued |