MPC8314VRAD vs MPC8314CVRADDA 对比
详细并排对比 MPC8314VRAD 出自 NXP Semiconductors 和 MPC8314CVRADDA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8314CVRADDA - PowerQUICC II Pro SoC, 266MHz e300, 620-HBGA | NXP
MPC8314CVRADDA Nrnd规格对比
| 参数 | MPC8314VRAD | MPC8314CVRADDA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 不推荐新设计 |
| Core Architecture | PowerPC e300c3 (32-bit) | PowerPC e300c3, 32-bit |
| Core Frequency | 266 MHz | — |
| Number of Cores | 1 | — |
| L1 Cache (I/D) | 16 KB / 16 KB | — |
| Memory Controller | DDR1/DDR2 with ECC (32-bit) | DDR1/DDR2 with ECC |
| Ethernet MACs | 2x 10/100/1000 Mbps (RGMII) | — |
| USB | USB 2.0 Host/Device | USB 2.0 High-Speed host/device |
| PCI Controllers | 2x PCI 2.3 | — |
| UART | 4x UART | — |
| I2C / SPI | 2x I2C, 1x SPI | — |
| Encryption Accelerator | Hardware encryption engine (SEC 2.0) | — |
| 工作温度 | -40C to +105C (extended) | -40 C to +105 C |
| 封装 | 620-TEPBGA II (29 x 29 mm) | 620-HBGA (29x29 mm), exposed pad |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Core Frequency | — | 266 MHz |
| Core Count | — | 1 |
| Ethernet | — | Dual 10/100/1000 MAC (RGMII/SGMII) |
| PCI | — | 32-bit PCI 2.3 |
| PCI Express | — | 1-lane PCIe (endpoint/RC) |
| TDM Interface | — | Multi-channel TDM/HDLC |
| Local Bus | — | 16-bit, NAND/NOR flash |
| Encryption (SEC) | — | Not enabled (NON-ENCRYPT variant) |
| 电源电压 | — | 1.0 V core, 3.3 V I/O (typical) |
| 数据总线宽度 | — | 32-bit |
| Processor Series | — | MPC83xx (PowerQUICC II Pro) |