MPC8358ZQAGDDA vs MPC8358VRAGDDA 对比
详细并排对比 MPC8358ZQAGDDA 出自 NXP Semiconductors 和 MPC8358VRAGDDA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8358ZQAGDDA - PowerQUICC II Pro 400MHz CPU | NXP | BGA-668
MPC8358ZQAGDDA ObsoleteNXP Semiconductors
MPC8358VRAGDDA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP
MPC8358VRAGDDA ⚠ 最后一次采购规格对比
| 参数 | MPC8358ZQAGDDA | MPC8358VRAGDDA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $32.00 | $47.85 |
| Processor Type | PowerPC e300 Microprocessor IC (PowerQUICC II Pro) | — |
| Series | MPC83xx | — |
| Core Architecture | PowerPC, 32-bit | — |
| Core Count | 1 | — |
| Core Speed | 400 MHz | — |
| Supply Voltage (Core) | 1.2 V | — |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1 / DDR2 SDRAM with ECC (32-bit) |
| Ethernet | 1 Gbit/s (RGMII/GMII) | — |
| PCI | 32-bit, up to 66 MHz | — |
| USB | USB 2.0 full-speed PHY | — |
| TDM / ATM | Multi-channel TDM / ATM glue | — |
| 工作温度 | 0C to +105C | 0 °C to +105 °C (commercial) |
| 封装 | 668-BGA (PBGA-PGE) 29x29 mm with exposed pad | 668-pin TBGA, 29 mm × 29 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Lead Free Status | Lead Free | — |
| RoHS 状态 | Compliant | Compliant (per DigiKey listing) |
| Packaging | Tray | — |
| Processor Family | — | PowerQUICC II Pro (MPC83xx) |
| Core | — | PowerPC e300, 1 Core, 32-Bit |
| Core Frequency | — | 400 MHz |
| Instruction Set Architecture | — | RISC, 32-Bit Power Architecture |
| Process Technology | — | 0.13 µm CMOS |
| Operating Voltage (Core) | — | 1.8 V |
| Operating Voltage (I/O) | — | 2.5 V / 3.3 V |
| L1 Cache | — | 32 KB instruction + 32 KB data (per core) |
| PCI Interface | — | 32-bit PCI 2.2 |
| Ethernet MAC | — | 10/100/1 Gbit Ethernet |
| USB Interface | — | USB 2.0 Full/Low Speed |
| Serial Interfaces | — | TDM, ATM, UART |
| Security Engine | — | Integrated (IPsec / Kasumi) |