MPC8358ZQAGDDA vs MPC8358VRAGDGA 对比
详细并排对比 MPC8358ZQAGDDA 出自 NXP Semiconductors 和 MPC8358VRAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8358ZQAGDDA - PowerQUICC II Pro 400MHz CPU | NXP | BGA-668
MPC8358ZQAGDDA Obsolete规格对比
| 参数 | MPC8358ZQAGDDA | MPC8358VRAGDGA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $32.00 | $65.00 |
| Processor Type | PowerPC e300 Microprocessor IC (PowerQUICC II Pro) | PowerPC e300 Microprocessor IC MPC83xx |
| Series | MPC83xx | — |
| Core Architecture | PowerPC, 32-bit | Power Architecture (e300), 32-bit |
| Core Count | 1 | — |
| Core Speed | 400 MHz | — |
| Supply Voltage (Core) | 1.2 V | — |
| Memory Controller | DDR1 / DDR2 with ECC | — |
| Ethernet | 1 Gbit/s (RGMII/GMII) | 2x 10/100/1000 (one RGMII, one SGMII/GMII), 1 GbE MAC |
| PCI | 32-bit, up to 66 MHz | — |
| USB | USB 2.0 full-speed PHY | USB 2.0 Full/Low Speed |
| TDM / ATM | Multi-channel TDM / ATM glue | — |
| 工作温度 | 0C to +105C | 0 C to +105 C |
| 封装 | 668-BGA (PBGA-PGE) 29x29 mm with exposed pad | — |
| 安装类型 | Surface Mount | Surface Mount |
| Lead Free Status | Lead Free | Lead Free |
| RoHS 状态 | Compliant | Compliant |
| Packaging | Tray | Tray |
| Core Clock Speed | — | 400 MHz |
| Number of Cores | — | 1 |
| Core Voltage | — | 1.2 V |
| I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| 封装 / 外壳 | — | 668-PBGA-PGE (29x29) with exposed pad |
| Memory Interface | — | DDR1 / DDR2 SDRAM controller with ECC |
| PCI Interface | — | 32-bit PCI 2.3 |
| WAN Interfaces | — | TDM (T1/E1/HSSI), ATM UTOPIA, 4 channels |
| Security Engine | — | AES, DES, 3DES, PKE |
| Process Technology | — | 0.13 micrometer CMOS |
| Family | — | MPC83xx PowerQUICC II Pro |