MPC8360VVAGDGA vs MPC8360ECVVAGDGA 对比

详细并排对比 MPC8360VVAGDGA 出自 NXP Semiconductors 和 MPC8360ECVVAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8360VVAGDGA MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360VVAGDGA ✗ 停产
NXP Semiconductors
MPC8360ECVVAGDGA MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA ✓ 量产中

规格对比

参数 MPC8360VVAGDGA MPC8360ECVVAGDGA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 有效
Core Architecture PowerPC e300 (Power Architecture technology) Power Architecture (PowerPC), 32-bit
Core Frequency 400 MHz —
Number of Cores 1 1
数据总线宽度 32-bit —
Series MPC83xx (PowerQUICC II Pro) —
Core Supply Voltage (Vcore) 1.2 V —
I/O Supply Voltage 1.8 / 2.5 / 3.3 V —
工作温度范围 0C to +105C -40C to +105C
封装 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) 740-TBGA (37.5 x 37.5 mm)
安装类型 Surface Mount Surface Mount (BGA)
Memory Interface DDR1 / DDR2 memory controller —
PCI Interface 32-bit PCI v2.3 Yes (PCI 2.2)
Ethernet 1 x 10/100/1000 Mbps MAC (RGMII) —
USB 1 x USB 2.0 (host/device) —
Communications Engine QUICC Engine (HDLC / ATM / TDM) —
Serial Interfaces UART, I2C, SPI, TDM —
Lead Free / RoHS No-Pb (non-ENC, NO-PB variant per Mouser listing) —
Processor Type — PowerPC e300 Microprocessor IC MPC83xx
Maximum Core Frequency — 400 MHz
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Unified Cache — 256 KB
Memory Controller — DDR1/DDR2 with ECC
Ethernet MAC — Gigabit Ethernet (10/100/1000)
USB Interface — USB 2.0 Full-Speed
Security Engine — Integrated SEC (IPsec/SSL acceleration)
Communication Engine — QUICC Engine with TDM/ATM/HDLC
Operating Voltage (Core) — 1.2 V
Lead-Free Status — Lead-Free / RoHS compliant
Silicon Revision — 2.x (denoted by 'E' suffix)
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

浏览全部产品 创建 BOM 获取报价