MPC8543VTANGD vs MPC8555VTAPF 对比
详细并排对比 MPC8543VTANGD 出自 NXP Semiconductors 和 MPC8555VTAPF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC8543VTANGD | MPC8555VTAPF |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $152.00 | $152.00 |
| Manufacturer | NXP Semiconductors (Freescale) | — |
| Series | PowerQUICC III | — |
| Core Processor | PowerPC e500 | PowerPC e500 |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Core Architecture | Power Architecture, 7-stage pipeline, dual-issue superscalar | — |
| Core Speed | 800 MHz | — |
| Bus Width | 32-bit | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 256 KB | — |
| Memory Controller | DDR2 SDRAM with ECC, up to 533 MHz data rate | — |
| Ethernet MACs | 4x Gigabit (SGMII/RGMII) | — |
| PCI Express | 2x PCIe interfaces | — |
| Serial RapidIO | 2x SRIO endpoints | — |
| PCI/PCI-X | 1x 32-bit PCI/PCI-X interface | — |
| 工作温度 | 0 °C to +105 °C | -40C to +105C (Industrial / Extended) |
| Core Voltage | 1.0 V (typical) | — |
| I/O Voltages | 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 90 nm CMOS | — |
| Package Type | FCBGA-783 (29x29 mm) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Maximum Core Frequency | — | 833 MHz |
| Co-Processor / DSP | — | Communications; CPM (Communications Processor Module) |
| Memory Controllers | — | DDR, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | Yes (per datasheet) |
| Ethernet | — | Dual 10/100/1000 MAC with TCP/IP acceleration |
| PCI / PCI-X Interfaces | — | Dual PCI/PCI-X |
| Security Engine | — | IPSec / SSL / TLS / 3DES / AES acceleration |
| Local Bus Controller | — | Yes |
| L1 Cache | — | 32 KB Instruction + 32 KB Data |
| 封装 | — | 783-FCPBGA, 29x29 mm |
| Part Status | — | Not For New Designs |