MPC8569VTANKGB vs MPC8569EVJANKGB 对比
详细并排对比 MPC8569VTANKGB 出自 NXP Semiconductors 和 MPC8569EVJANKGB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8569VTANKGB - PowerQUICC III MPU, 800MHz, e500v2 SoC | NXP
MPC8569VTANKGB ✓ 量产中NXP Semiconductors
MPC8569EVJANKGB - PowerQUICC III 800MHz SoC | NXP FCBGA-783
MPC8569EVJANKGB ⚠ 最后一次采购规格对比
| 参数 | MPC8569VTANKGB | MPC8569EVJANKGB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 最后采购期 |
| Architecture | PowerQUICC III, 32-bit Power Architecture e500v2 | — |
| Core | e500v2 (single core) | Power Architecture e500v2 |
| Maximum Core Frequency | 800 MHz | — |
| MIPS (estimated Dhrystone) | 2799 MIPS at 1.33 GHz (estimated; lower at 800 MHz) | — |
| Physical Addressing | 36-bit | — |
| FPU | Double-precision Floating Point + SPE | — |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Integrated Peripherals | SRIO, PCIe, GbE, QE, Security Engine | — |
| 封装 | 783-FCPBGA (29x29 mm) | 783-FCBGA (29x29 mm) |
| 安装类型 | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| 工作温度 | 0C to 105C (junction) | 0C to +105C |
| Supply Voltages | 1.5V / 1.8V / 2.5V / 3.3V (multi-rail) | — |
| Process Technology | 0.04 um (90 nm) | — |
| RoHS 状态 | [DATA_NEEDED: rohs compliance flag from input data] | ROHS3 Compliant |
| Series | MPC85xx (PowerQUICC III) | — |
| Family | — | PowerQUICC III (MPC85xx) |
| Core Count | — | 1 |
| 数据总线宽度 | — | 32-bit |
| 最大时钟频率 | — | 800 MHz |
| On-chip Peripherals | — | QUICC Engine, GbE, DDR2/DDR3 controller, SEC, SRIO, PCIe, DMA |
| Serial Interfaces | — | Serial RapidIO, PCI Express, GbE, I2C, SPI, UART |
| Security Engine | — | SEC (DES/3DES/AES/SHA/RSA) |
| L1 Cache (I/D) | — | [DATA_NEEDED: L1 cache size per core] |
| 电源电压 | — | 1 V nominal (multi-rail) |
| Lead Free Status | — | Lead Free / ROHS3 Compliant per part data |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |