MSC8156SVT1000B vs MSC8256SVT1000B 对比

详细并排对比 MSC8156SVT1000B 出自 NXP Semiconductors 和 MSC8256SVT1000B 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MSC8156SVT1000B MSC8156SVT1000B - SC3850 6-Core DSP, 1 GHz, 783-FCBGA | NXP

MSC8156SVT1000B - SC3850 6-Core DSP, 1 GHz, 783-FCBGA | NXP

MSC8156SVT1000B Nrnd
NXP Semiconductors
MSC8256SVT1000B MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B Obsolete

规格对比

参数 MSC8156SVT1000B MSC8256SVT1000B
品牌 NXP Semiconductors NXP Semiconductors
分类 DSP DSP
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $124.80 $189.00
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale)
Series StarCore MSC815x StarCore MSC8256
Type SC3850 Six-Core Digital Signal Processor SC3850 Six-Core Digital Signal Processor
Core Count 6 x SC3850 —
Core Clock Frequency 1 GHz —
L1 Instruction Cache (per core) 32 KB 32 KB
L1 Data Cache (per core) 32 KB 32 KB
Unified L2 Cache 512 KB (configurable, per subsystem) —
On-Chip RAM 576 KB —
Non-Volatile Memory ROM (96 KB) —
封装 / 外壳 783-FCBGA (29x29 mm) —
Number of Terminals 783 —
Terminal Form Ball —
Packaging Tray —
安装类型 Surface Mount Surface Mount (BGA)
RoHS 状态 [DATA_NEEDED: RoHS status - not in web data] [DATA_NEEDED: RoHS status]
Core Architecture — StarCore SC3850 (VLE, 4-issue)
Number of Cores — 6
Core Clock Speed — 1 GHz
Aggregate Throughput — 1000 MIPS per core (6000 MIPS total)
Data Width — 32-bit / 64-bit
Unified L2 Cache (per core) — 512 KB (configurable to M2 memory in 64 KB increments)
On-Chip RAM (total) — 576 KB
Non-Volatile Memory (ROM) — 96 KB
MMU — Yes (hardware memory management unit)
EPIC (Interrupt Controller) — Yes (Extended Programmable Interrupt Controller)
Timers (per core) — 2 x 32-bit general-purpose
DDR Memory Controller — DDR2/DDR3 with ECC
High-Speed Interfaces — Serial RapidIO, PCI Express, SGMII, RGMII
Peripheral Interfaces — I2C, SPI, UART, GPIO
Security Engine — SEC (cryptographic acceleration)
封装 — 783-FCBGA (29x29 mm)
工作温度 — -40C to +105C (industrial)
MSL 等级 — [DATA_NEEDED: MSL rating]

数据手册与资源

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