MT40A512M8RH-075E:B vs K4A4G085WD-BCPB 对比

详细并排对比 MT40A512M8RH-075E:B 出自 Micron Technology 和 K4A4G085WD-BCPB 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT40A512M8RH-075E:B MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B ✓ 量产中
Samsung Electronics
K4A4G085WD-BCPB K4A4G085WD-BCPB - 4Gb DDR4 SDRAM x8 1.2V | Samsung

K4A4G085WD-BCPB - 4Gb DDR4 SDRAM x8 1.2V | Samsung

K4A4G085WD-BCPB ✓ 量产中

规格对比

参数 MT40A512M8RH-075E:B K4A4G085WD-BCPB
品牌 Micron Technology Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.15 $0.00
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit 4 Gb
存储组织 512M x 8 512M x 8
数据速率 2666 MT/s (DDR4-2666) —
Clock Frequency 1333 MHz (1.33 GHz) —
VDD Supply Voltage 1.2 V +/-60 mV —
VDDQ Supply Voltage 1.2 V +/-60 mV —
VPP Supply Voltage 2.5 V, -125 mV/+250 mV —
接口类型 Parallel —
I/O Structure 1.2V pseudo open-drain —
基准电压 On-die internal adjustable VREFDQ generation —
封装 78-FBGA (9 x 10.5 mm), TFBGA FBGA-78 (PB)
安装类型 Surface Mount Surface Mount (BGA)
工作温度 [DATA_NEEDED: operating temperature range (standard grade)] [DATA_NEEDED: operating temperature range]
Refresh Refresh max interval extension at extended TC temperature range (125C capable per family features) [DATA_NEEDED: refresh specification]
Speed Grade Suffix -075E —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant (PB lead-free suffix)
Packaging Option Suffix :B (ball map B designation per Mouser listing) —
Die Generation — D-die
电源电压 — 1.2 V
接口 — DDR4 (Double Data Rate 4)
Speed Grade / Data Rate — [DATA_NEEDED: speed grade / data rate]
CAS 延迟 — [DATA_NEEDED: CAS latency]
无卤 — [DATA_NEEDED: halogen-free status]
Datasheet Pages — 66 pages (K4A4G085WD family datasheet)

数据手册与资源

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