MT53D1024M32D4DT-046 vs MT53D512M32D2DS-053 WT:D 对比

详细并排对比 MT53D1024M32D4DT-046 出自 Micron Technology 和 MT53D512M32D2DS-053 WT:D 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT53D1024M32D4DT-046 MT53D1024M32D4DT-046 - 32Gbit LPDDR4 DRAM 2.133GHz | Micron

MT53D1024M32D4DT-046 - 32Gbit LPDDR4 DRAM 2.133GHz | Micron

MT53D1024M32D4DT-046 ✓ 量产中
Micron Technology
MT53D512M32D2DS-053 WT:D MT53D512M32D2DS-053 WT:D - 16Gb LPDDR4 SDRAM | Micron

MT53D512M32D2DS-053 WT:D - 16Gb LPDDR4 SDRAM | Micron

MT53D512M32D2DS-053 WT:D ✓ 量产中

规格对比

参数 MT53D1024M32D4DT-046 MT53D512M32D2DS-053 WT:D
品牌 Micron Technology Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $21.15 $6.05
存储器类型 SDRAM - Mobile LPDDR4 SDRAM - Mobile LPDDR4
存储容量 32 Gbit (4 GB) 16 Gbit (2 GB)
存储组织 1G x 32 512M x 32
Clock Frequency 2.133 GHz (4266 MT/s) —
接口 LPDDR4 (unified LPDDR4/LPDDR4X die) —
Supply Voltage VDD2/VDDQ 1.1 V (LPDDR4 mode) —
LPDDR4X VDDQ 0.60 V (LPDDR4X mode) —
封装 200-VFBGA (10 mm x 14.5 mm) 200-WFBGA (10 mm x 14.5 mm)
安装类型 Surface Mount Surface Mount
特性 Built-in temperature sensor, auto precharge, write leveling, ZQ calibration, asynchronous reset, data mask Auto self-refresh, built-in temperature sensor, auto precharge, write leveling, ZQ calibration, asynchronous reset, data mask
Operating Temperature (WT:D) -40C to +95C —
Operating Temperature (AAT:D) -40C to +105C —
Grade WT:D (standard), AAT:D (automotive/industrial), AIT:D (automotive) —
Access Type Synchronous, 8n prefetch, burst length 16 —
RoHS 状态 Compliant RoHS Compliant (per DigiKey listing)
Auto Precharge Yes —
Refresh Self-refresh with per-bank refresh support Auto refresh and self refresh
Clock Frequency / Data Rate — 1.866 GHz (1866 MT/s)
Die Configuration — DDP (Double Die Package)
工作温度 — -40C to +85C
Speed Grade — -053
数据总线宽度 — 32 bit
Memory Interface — Parallel, LPDDR4
Self-Refresh — Auto self-refresh with temperature-compensated refresh
电源电压 — [DATA_NEEDED: VDD/VDDQ supply voltage]

数据手册与资源

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