OSD3358-512M-BAS vs OSD3358-512M-BAS-XB 对比

详细并排对比 OSD3358-512M-BAS 出自 Octavo Systems 和 OSD3358-512M-BAS-XB 出自 Octavo Systems。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Octavo Systems
OSD3358-512M-BAS OSD3358-512M-BAS - AM3358 SiP 1GHz Cortex-A8 512MB DDR3 | Octavo Systems

OSD3358-512M-BAS - AM3358 SiP 1GHz Cortex-A8 512MB DDR3 | Octavo Systems

OSD3358-512M-BAS ✓ 量产中
Octavo Systems
OSD3358-512M-BAS-XB OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB ✓ 量产中

规格对比

参数 OSD3358-512M-BAS OSD3358-512M-BAS-XB
品牌 Octavo Systems Octavo Systems
分类 DSP Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $59.95 $67.20
Processor Core Texas Instruments AM3358 ARM Cortex-A8 —
Maximum CPU Clock 1 GHz 1 GHz
SIMD Engine NEON SIMD —
Graphics Accelerator SGX530 SGX530
On-package DRAM 512 MB DDR3 —
On-package PMIC TPS65217C integrated —
Package Type 400-ball BGA —
Package Size 20 mm x 20 mm (BGA), 1 mm pitch —
Pin Compatibility Superset of TI AM3358 ZCZ 18x18 BGA —
Ethernet 2x 10/100/1000 MAC (external PHY required) 10/100/1000 Mbps (Gigabit)
USB Ports 2x USB 2.0 (host), 1x USB 2.0 (client/OTG) —
Industrial Communication 2x PRU-ICSS —
工作温度 -40C to +85C (industrial) —
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: MSL rating] —
RoHS 状态 Compliant Compliant
Device Type — System-In-Package (SiP)
Integrated Processor — TI Sitara AM3358 ARM Cortex-A8
Onboard DDR3 SDRAM — 512 MB
Power Management IC — TPS65217C (integrated)
工作温度范围 — -40 C to +85 C (industrial)
封装 — 400-ball BGA
PRU-ICSS Subsystems — 2 (industrial-grade)
USB — USB 2.0 High-Speed PHY
CAN — 2x CAN 2.0B
SPI — 2x SPI
I2C — 3x I2C

数据手册与资源

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