S9S08AW16AE0VLD vs S9S08AW32E5MPUE 对比

详细并排对比 S9S08AW16AE0VLD 出自 NXP Semiconductors 和 S9S08AW32E5MPUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08AW16AE0VLD S9S08AW16AE0VLD - 8-bit MCU, 16KB Flash, 40MHz, Auto QFP-44 | NXP

S9S08AW16AE0VLD - 8-bit MCU, 16KB Flash, 40MHz, Auto QFP-44 | NXP

S9S08AW16AE0VLD ⚠ 最后一次采购
NXP Semiconductors
S9S08AW32E5MPUE S9S08AW32E5MPUE - Automotive 8-bit MCU, 32KB Flash, 40MHz | NXP

S9S08AW32E5MPUE - Automotive 8-bit MCU, 32KB Flash, 40MHz | NXP

S9S08AW32E5MPUE ✓ 量产中

规格对比

参数 S9S08AW16AE0VLD S9S08AW32E5MPUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $4.92 $3.95
Core Architecture HCS08 (8-bit CISC) —
CPU Frequency 40 MHz —
Internal Bus Frequency 20 MHz —
Program Memory (Flash) 16 KB —
RAM 1 KB —
Operating Voltage 2.7 V to 5.5 V —
工作温度 -40 °C to +105 °C (Automotive Grade) —
封装 44-LQFP (10x10 mm) —
安装类型 Surface Mount —
ADC [DATA_NEEDED: ADC resolution and channel count] —
Timers [DATA_NEEDED: timer module count] —
Communication Interfaces SCI (UART), SPI —
Debug Interface Single-wire Background Debug Mode (BDM) —
Breakpoint Capability Single breakpoint during in-circuit debugging —
Instruction Set HC08 instruction set with added BGND instruction —
Automotive Qualification Yes (AEC-Q100 grade implied by -40/+105 °C range and S9 prefix) —
RoHS 状态 Compliant Compliant
MSL 等级 [DATA_NEEDED: MSL level] —
Core — HCS08 S08 (enhanced 8-bit)
Core Size — 8-bit
最大时钟频率 — 40 MHz
Program Memory Size — 32 KB (32K x 8) Flash
RAM Size — 2 KB (2K x 8)
Number of I/O Pins — 54
封装 / 外壳 — 64-LQFP (10x10 mm)
安装方式 — SMD/SMT
工作温度范围 — -40C to +125C
Connectivity — I2C, SCI (UART), SPI
On-chip Peripherals — LVD, POR, PWM, WDT
Oscillator Type — Internal/External (per datasheet)
Series — S08 / MC9S08AW
Qualification — Automotive (E5 suffix)
Supply Voltage (typical) — [DATA_NEEDED: supply voltage range]
EEPROM Size — Not available on this variant
数据总线宽度 — 8-bit

数据手册与资源

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