S9S08AW60E5MFGE vs MC9RS08KB12CSG574 对比

详细并排对比 S9S08AW60E5MFGE 出自 NXP Semiconductors 和 MC9RS08KB12CSG574 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ 量产中
NXP Semiconductors
MC9RS08KB12CSG574 MC9RS08KB12CSG574 - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP

MC9RS08KB12CSG574 - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP

MC9RS08KB12CSG574 ⚠ 最后一次采购

规格对比

参数 S9S08AW60E5MFGE MC9RS08KB12CSG574
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $6.05 $1.85
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] [DATA_NEEDED: RAM size]
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
电源电压 3 V / 3.3 V / 5 V —
封装 44-pin LQFP (10 x 10 mm) 16-SOIC
I/O Pins [DATA_NEEDED: GPIO count] —
ADC Multi-channel 10-bit (per family) —
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels —
Debug Interface BDM (Background Debug Mode) —
工作温度 -40C to +125C (automotive range) —
安装类型 Surface Mount Surface Mount
Family S08 / MC9S08AW60 series RS08KB
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Core — RS08 (8-bit)
Program Memory — 12 KB (12K x 8) Flash
Maximum CPU Frequency — 20 MHz
引脚数量 — 16
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
工作温度范围 — [DATA_NEEDED: operating temperature range]
MSL 等级 — [DATA_NEEDED: MSL level]
RoHS 状态 — [DATA_NEEDED: RoHS status]
Lead-Free — [DATA_NEEDED: lead-free status]
无卤 — [DATA_NEEDED: halogen-free status]
数据总线宽度 — 8-bit
Number of I/O — [DATA_NEEDED: GPIO count]

数据手册与资源

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