S9S08QD2J1MSC vs MC9S08SE4CRL 对比
详细并排对比 S9S08QD2J1MSC 出自 NXP Semiconductors 和 MC9S08SE4CRL 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | S9S08QD2J1MSC | MC9S08SE4CRL |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.89 | $0.45 |
| Core | HCS08 (S08) 8-bit CISC | — |
| Program Memory (Flash) | 2 KB (2K x 8) | — |
| RAM Size | 128 bytes | [DATA_NEEDED: RAM size] |
| Maximum CPU Frequency | 16 MHz | — |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 5.5 V | — |
| 工作温度 | -40C to +125C (Automotive Grade) | [DATA_NEEDED: operating temperature range] |
| Number of I/O Pins | 4 | — |
| 封装 | 8-pin SOIC (SOIC-8) | 28-PDIP (0.600 inch, 15.24 mm) |
| 安装类型 | Surface Mount | Through Hole |
| Peripherals | LVD, POR, PWM, WDT | [DATA_NEEDED: peripheral set detail] |
| Connectivity | - | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | Background Debug Mode (BDM) |
| EEPROM | None (Flash-based) | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| AEC-Q100 | Qualified (Automotive) | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Frequency | — | 20 MHz |
| Internal Bus Frequency | — | 10 MHz |
| Program Memory Type | — | FLASH |
| Program Memory Size | — | 4 KB (4K x 8) |
| 电源电压 | — | 3.3 V / 5 V |
| Instruction Set | — | CISC (HC08 object-code compatible) |
| Series | — | S08SE (S08SE8 series) |
| Manufacturer Family | — | Freescale S08 5V MCU portfolio |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Packaging | — | Tube |
| Pin Pitch | — | 2.54 mm |