XC3S50A-4FT256C vs XC3S50A-4FT256I 对比

详细并排对比 XC3S50A-4FT256C 出自 AMD 和 XC3S50A-4FT256I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC3S50A-4FT256C XC3S50A-4FT256C - 50K Spartan-3A FPGA | AMD | 256-FTBGA

XC3S50A-4FT256C - 50K Spartan-3A FPGA | AMD | 256-FTBGA

XC3S50A-4FT256C ⚠ 最后一次采购

规格对比

参数 XC3S50A-4FT256C XC3S50A-4FT256I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 Obsolete
Device Type Field Programmable Gate Array (FPGA) Spartan-3A field-programmable gate array (FPGA)
FPGA Family Spartan-3A —
Approximate Number of Logic Gates 50,000 gates —
Logic Cells 55,296 cells 1,584 logic cells
Number of User I/O 144 I/O —
Core Voltage Range 1.14 V to 1.26 V —
Speed Grade -4 -4 performance grade
Temperature-Grade Suffix C (commercial) —
封装 256-pin FTBGA 256-ball LBGA
Package Type Fine-Pitch Ball Grid Array (FTBGA) —
Number of Terminals 256 balls 256 balls
安装类型 Surface Mount Surface mount
Manufacturer Lead Time 12 weeks —
Product Status Last Time Buy —
Packaging Tray —
RoHS 状态 Non-compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Status Contains lead [DATA_NEEDED: lead-free status]
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP resource count] —
Maximum I/O Performance [DATA_NEEDED: maximum I/O performance] —
工作温度范围 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: numeric industrial temperature range]
Gate Count — 55,296 gates
User I/O — 144 I/O
Temperature Grade — Industrial
Package Code — FT256
Package Body Size — 17 x 17 mm
Package Shape — Square
Terminal Type — Ball
Programmable Logic Element — Configurable Logic Blocks with LUTs and flip-flops
DSP Resource — DSP48A multiply-accumulate slices
Configuration Memory — [DATA_NEEDED: configuration memory type and capacity]
Supply Voltage Range — [DATA_NEEDED: core and I/O supply voltage ranges]
REACH Status — [DATA_NEEDED: REACH compliance status]

数据手册与资源

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