XC3S50A-4TQ144C vs XC3S50A-4TQ144I 对比
详细并排对比 XC3S50A-4TQ144C 出自 AMD 和 XC3S50A-4TQ144I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC3S50A-4TQ144C | XC3S50A-4TQ144I |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| Device Type | Spartan-3A field-programmable gate array (FPGA) | Spartan-3A FPGA |
| System Gates | 55,296 gates | 50,000 gates |
| Nominal System Gate Density | 50,000 gates | — |
| Logic Elements | 1,584 logic elements | — |
| User I/O Count | 108 I/Os | — |
| Package Pin Count | 144 pins | — |
| Package Type | 144-pin TQFP | TQFP-144 surface-mount package |
| 安装类型 | Surface mount | Surface Mount |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | -4 speed grade | -4 |
| Temperature Grade | Commercial grade | — |
| Architecture Blocks | 176 logic array blocks (LABs) or configurable logic cells (CLBs) | — |
| Programmability | Field-programmable digital logic and user I/O | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and capacity] | — |
| 工作温度范围 | [DATA_NEEDED: commercial operating temperature range] | — |
| Supported I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Cells | — | 1,584 cells |
| Configurable Logic Blocks | — | 176 CLBs |
| Block RAM | — | 55,296 bits |
| User I/O | — | 108 I/O |
| Core Supply Voltage | — | 1.14 V to 1.26 V |
| 工作温度 | — | -40°C to 100°C junction temperature |
| 封装 | — | 144-LQFP |
| Programmable Functional Elements | — | 5 elements |
| FPGA Logic Implementation | — | 4-input lookup tables with flip-flop resources |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |