XC6SLX16-2CSG225I vs XC6SLX16-2CSG225C 对比

详细并排对比 XC6SLX16-2CSG225I 出自 AMD 和 XC6SLX16-2CSG225C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC6SLX16-2CSG225I XC6SLX16-2CSG225I - Spartan-6 LX 14,579-Cell FPGA | AMD

XC6SLX16-2CSG225I - Spartan-6 LX 14,579-Cell FPGA | AMD

XC6SLX16-2CSG225I ✓ 量产中
AMD
XC6SLX16-2CSG225C XC6SLX16-2CSG225C - 14,579-LC Spartan-6 FPGA | AMD

XC6SLX16-2CSG225C - 14,579-LC Spartan-6 FPGA | AMD

XC6SLX16-2CSG225C ✓ 量产中

规格对比

参数 XC6SLX16-2CSG225I XC6SLX16-2CSG225C
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type Field Programmable Gate Array (FPGA) Spartan-6 LX field-programmable gate array
FPGA Family Spartan-6 LX —
Logic Cells 14,579 cells 14,579 cells
Configurable Logic Blocks 1,139 CLBs —
Hardware Multipliers 24 multipliers —
User I/O 144 I/O 160 I/O
Internal Frequency 667 MHz 667 MHz
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V —
Speed Grade -2 -2
Temperature Grade Industrial, 0 C to 85 C Commercial grade
封装 225-LFBGA CSBGA, 0.8 mm pitch —
Package Pin Count 225 pins —
Package Type LFBGA, CSPBGA 225-ball CSPBGA
Programmability Programmable FPGA —
Product Status Active —
RoHS 状态 [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Block RAM — 589,824 bits
Package Designation — 225-LFBGA
Package Dimensions — 19 mm × 19 mm
Ball Pitch — 0.80 mm
工作温度 — 0°C to +85°C
Multiplier Architecture — 18×18 multiplier with 48-bit accumulator
Arithmetic Features — Pipelining and cascading
DSP Support — Pre-adder-assisted filter implementation
Interface Feature — Low-cost 33 MHz, 32-bit and 64-bit PCI support
Lead-Free Status — Lead-free package
安装类型 — Surface-mount CSPBGA

数据手册与资源

浏览全部产品 创建 BOM 获取报价