XC6SLX16-3CSG324C vs XC6SLX16-2CSG324C 对比
详细并排对比 XC6SLX16-3CSG324C 出自 AMD 和 XC6SLX16-2CSG324C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX16-3CSG324C | XC6SLX16-2CSG324C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | Spartan-6 LX field-programmable gate array | Field Programmable Gate Array (FPGA) |
| Logic Cells | 14,579 cells | 14,579 cells |
| LABs and CLBs | 1,139 LABs and CLBs | — |
| Embedded RAM | 589,824 bits | — |
| User I/O | 232 I/O | — |
| Internal Frequency | 667 MHz | 667 MHz |
| Process Technology | 45 nm | 45 nm |
| 工作电源电压 | 1.14 V to 1.26 V | — |
| 工作温度 | 0 °C to 85 °C | 0°C to 85°C |
| 封装 | 324-CSPBGA | 324-LFBGA/CSPBGA; retrieved sources also state CSBGA-484 |
| Package Ball Count | 324 balls | — |
| 安装类型 | Surface Mount | — |
| Package Body Dimensions | [DATA_NEEDED: verified CSG324 package body dimensions] | — |
| Package Ball Pitch | [DATA_NEEDED: verified CSG324 ball pitch] | — |
| Lead-Free Status | Lead-free | Lead-free package description in retrieved data |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification] |
| FPGA Family | — | Spartan-6 LX |
| I/O Count | — | 232 I/Os |
| 电源电压 | — | 1.2 V |
| Speed Grade | — | -2 |
| Package Dimensions | — | 19 mm x 19 mm |
| Package Pitch | — | 0.80 mm |
| Manufacturer | — | AMD, formerly Xilinx |
| 引脚数量 | — | 324-ball package designation in distributor listing; retrieved specification also states 484 pins |
| Lifecycle Context | — | Spartan-6 family described as mature in retrieved cross-reference material |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Conflict Minerals Status | — | [DATA_NEEDED: conflict-minerals status] |