XC6SLX16-3CSG324I vs XC6SLX16-2CSG324I 对比

详细并排对比 XC6SLX16-3CSG324I 出自 AMD 和 XC6SLX16-2CSG324I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC6SLX16-3CSG324I XC6SLX16-3CSG324I - 45nm Spartan-6 FPGA | AMD

XC6SLX16-3CSG324I - 45nm Spartan-6 FPGA | AMD

XC6SLX16-3CSG324I ✓ 量产中
AMD
XC6SLX16-2CSG324I XC6SLX16-2CSG324I - 375 MHz Spartan-6 LX FPGA | AMD

XC6SLX16-2CSG324I - 375 MHz Spartan-6 LX FPGA | AMD

XC6SLX16-2CSG324I ✓ 量产中

规格对比

参数 XC6SLX16-3CSG324I XC6SLX16-2CSG324I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type FPGA FPGA
FPGA Family Spartan-6 LX Spartan-6 LX
Manufacturing Technology 45 nm —
Logic Cells 14,579 cells 14,579 cells
Number of LABs/CLBs 1,139 LABs/CLBs —
Total RAM 589,824 bits —
Number of I/O 232 I/Os —
Internal Frequency 667 MHz 375 MHz
Operating Frequency 400 MHz —
电源电压 1.14 V to 1.26 V —
Speed Grade -3 -2
工作温度范围 -40 °C to 100 °C junction —
Commercial Ambient Temperature 0 °C to 85 °C —
封装 324-ball CSBGA, 19 mm × 19 mm CSBGA-324
Ball Pitch 0.80 mm —
安装类型 Surface mount Surface Mount
Lead-Free Status Lead free —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] Compliant
User I/O Count — 232 I/Os
Supply Voltage Range — 1.14 V to 1.26 V
Package Dimensions — 19 mm x 19 mm
Package Pitch — 0.80 mm
Package Type — Lead-free CSPBGA
工作温度 — -40 C to 85 C
Process Technology — 45 nm
Clock Management Resources — DCM and PLL
Memory Resource Value — 589824

数据手册与资源

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