XC6SLX75-3FG676C vs XC6SLX75-3FG676I 对比
详细并排对比 XC6SLX75-3FG676C 出自 AMD 和 XC6SLX75-3FG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX75-3FG676C | XC6SLX75-3FG676I |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | Unknown |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| Device Family | Spartan-6 LX | — |
| Logic Cells | 74,637 cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs | 5,831 CLBs |
| Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Speed Grade | -3 | -3 |
| 电源电压 | [DATA_NEEDED: supply voltage] | — |
| 工作温度 | 0°C to 85°C (32°F to 185°F) | — |
| Package Type | 676-BGA | — |
| Package Description | FBGA-676 | — |
| Package Dimensions | 27 mm × 27 mm | — |
| Ball Pitch | 1.0 mm | 1 mm |
| Terminal Count | 676 terminals | 676 terminals |
| Package Family | FBGA | — |
| 安装类型 | Surface mount | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Block RAM | [DATA_NEEDED: block RAM resources] | — |
| DSP Resources | [DATA_NEEDED: DSP resources] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| FPGA Family | — | Spartan-6 LX |
| Maximum Frequency | — | 862 MHz |
| I/O Count | — | 408 I/O |
| 封装 | — | 676-ball FCBGA |
| Package Body Size | — | 27 mm x 27 mm |
| Temperature Grade | — | Industrial |
| Surface-Mount Type | — | Ball Grid Array (BGA) |
| Verified Distributor Price | — | USD 67.1347 per unit |
| LCSC Availability | — | In stock |
| Automotive Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |