XC6SLX75-3FG676I vs XC6SLX75-2FG676I 对比

详细并排对比 XC6SLX75-3FG676I 出自 AMD 和 XC6SLX75-2FG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX75-3FG676I XC6SLX75-2FG676I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Unknown Unknown
库存状态 有库存 有库存
单价(USD) $0.00 $0.00
Device Type Field Programmable Gate Array (FPGA) FPGA
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Maximum Frequency 862 MHz —
I/O Count 408 I/O —
Process Technology 45 nm CMOS —
封装 676-ball FCBGA 676-BGA
Package Body Size 27 mm x 27 mm —
Ball Pitch 1 mm —
Terminal Count 676 terminals —
Temperature Grade Industrial —
Speed Grade -3 —
Surface-Mount Type Ball Grid Array (BGA) —
Verified Distributor Price USD 67.1347 per unit —
LCSC Availability In stock —
RoHS 状态 [DATA_NEEDED: RoHS status] unknown
REACH Status [DATA_NEEDED: REACH status] unknown
Lead-Free Status [DATA_NEEDED: lead-free status] —
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Stated Internal Frequency — 667 MHz
Maximum Inputs or Outputs — 400 I/O
Reported Package Dimensions — 23 mm x 23 mm
Reported Package Pitch — 1 mm
Temperature Designation — I (industrial)
工作温度 — 0 C to 85 C; conflicting source also reports -40 C to 100 C
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Programmable Architecture — Field-configurable digital logic
安装类型 — Surface mount
Manufacturer — AMD / Xilinx
AEC-Q100 Status — unknown

数据手册与资源

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