10AS066N3F40E2SG - Arria 10 SX SoC FPGA 660K LE | Altera
料号： 10AS066N3F40E2SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4174.31 | $4,174.31 |
| 10 | $3965.6 | $39,656.00 |
| 100 | $3756.88 | $375,688.00 |
| 500 | $3548.17 | $1,774,085.00 |
| 1,000 | $3339.45 | $3,339,450.00 |
10AS066N3F40E2SG 概述
An SoC FPGA is a single-chip device that integrates a hard processor system (HPS) with programmable logic fabric on one die, sitting in the system hierarchy between a standalone FPGA and a discrete processor-plus-FPGA two-chip solution. This integration shortens the interconnect between processor and fabric, reducing latency and board area compared to a discrete chipset architecture.
Key features of the 10AS066N3F40E2SG include the dual-core ARM Cortex-A9 with CoreSight debug support, approximately 588 user I/Os, and Altera's 20nm-class Arria 10 fabric architecture. The device operates from a 0.9V core supply and belongs to the Arria 10 SX (SoC) family, which pairs mid-range FPGA capacity with hard processor performance for embedded control and data-path processing.
Technically, the fabric provides adaptive logic modules, variable-precision DSP blocks, and embedded memory suited to signal processing, while the hard processor system supplies standard ARM software ecosystems, peripheral controllers, and memory interfaces. The combination allows designers to partition control software on the Cortex-A9 cores and high-throughput pipelines in the fabric, communicating through high-bandwidth AXI bridges.
Typical applications include industrial automation and motor control, wireless and wired communications line cards, broadcast video processing, medical imaging, and defense/aerospace signal processing where 660K logic elements and dual ARM cores provide the right balance of capacity and performance.
A key design consideration is power delivery and thermal management: the 0.9V core rail can draw substantial current at 1.5 GHz processor operation with heavy fabric utilization, so a multi-rail power sequencing solution and a carefully designed FCBGA breakout with thermal vias are required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： 10AS066N3F40E2SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
10AS066N3F40I2SG
✅ 直接替换📋 参考替代料（不在目录中）
10AS066N4F40E3LG
✅ 直接替换📋 参考替代料（不在目录中）
10AS057N2F40E1SG
✅ 直接替换📋 参考替代料（不在目录中）
10AS057K2F40I2SG
✅ 直接替换📋 参考替代料（不在目录中）
10AS066N3F40E2SG 最大额定值与电气特性
| Logic Elements | 660K |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| User I/O | 588 |
| Core Supply Voltage | 0.9 V |
| Technology | 20 nm |
| 封装 | 1517-FCBGA (40x40 mm) |
| 安装类型 | Surface Mount (BGA, ball terminal) |
| Package Shape | Square |
| Number of Terminals | 1517 |
| Family | Arria 10 SX (SoC FPGA) |
| Product Type | System On Chip (SoC) with FPGA fabric |
10AS066N3F40E2SG square 引脚配置指南
10AS066N3F40E2SG（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS066N3F40E2SG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS066N3F40E2SG 适用于 6 应用s: Industrial Automation and Motor Control, Wireless and Wired Communications, Broadcast and Video Processing, Medical Imaging Equipment, Defense and Aerospace Signal Processing, Test and Measurement Instrumentation.
Industrial Automation and Motor Control
The 10AS066N3F40E2SG fits industrial automation because its dual ARM Cortex-A9 cores at up to 1.5 GHz execute real-time control loops, protocol stacks (EtherCAT, PROFINET), and HMI software, while the 660K-element fabric implements deterministic PWM generation, incremental/absolute encoder interfaces, and functional-safety interlocks with microsecond latency. The AXI bridges between HPS and fabric remove the board-level round trip of a discrete MCU-plus-FPGA design, cutting control-loop jitter. Its approximately 588 user I/Os drive multiple axes of gate drivers and sensors from one device. The trade-off is higher static power than a small FPGA, so thermal design must budget for continuous 1.5 GHz operation in sealed cabinets.
推荐
Wireless and Wired Communications
In communications line cards, the 10AS066N3F40E2SG provides the fabric throughput for framer/MAC functions, forward error correction, and packet processing across its 588 user I/Os, while the Cortex-A9 subsystem runs management software, network stacks, and control-plane tasks at 1.5 GHz. The 660K logic elements accommodate multiple redundant datapaths, and the Arria 10 architecture's embedded memory and DSP blocks support shaping and filtering at line rate. Compared with a discrete FPGA plus external CPU, the single-chip integration reduces board area and inter-chip latency. Designers should confirm transceiver configuration for the F40 package against the Altera pin-out files before finalizing the optical/electrical interface plan.
推荐
Broadcast and Video Processing
The 10AS066N3F40E2SG suits broadcast and professional video because the Arria 10 fabric's variable-precision DSP blocks execute 4K video scaling, deinterlacing, color conversion, and compression pipelines within the 660K logic elements, while the dual Cortex-A9 cores run device control, EDID/HDCP handling, and networked management at up to 1.5 GHz. The roughly 588 I/Os support multiple parallel video interfaces simultaneously. Integrating processor and fabric on one die eliminates a discrete host chip and its latency. The main design consideration is memory bandwidth: video frame buffers require carefully planned DDR interfaces, so consult the Arria 10 memory controller documentation when sizing external DRAM.
推荐
Medical Imaging Equipment
Medical ultrasound, digital radiography, and endoscopy systems use the 10AS066N3F40E2SG to acquire high-channel-count sensor data through its I/O banks, apply beamforming and filtering in the 660K-element fabric with Arria 10 DSP blocks, and run image reconstruction and user-interface software on the dual 1.5 GHz Cortex-A9 cores. Single-chip integration of processing and control simplifies traceability documentation for regulated environments, since one device carries the signal chain. The approximately 588 user I/Os interface analog-front-end chips and displays. Choose the industrial-temperature 10AS066N3F40I2SG variant if the system must operate over wider ambient ranges without PCB changes.
推荐
Defense and Aerospace Signal Processing
Radar front ends, electronic warfare receivers, and secure communications equipment leverage the 10AS066N3F40E2SG's combination of 660K adaptive logic elements and dual hard Cortex-A9 cores to implement wideband digital down-conversion, pulse compression, and protocol processing in one 40x40 mm 1517-ball FCBGA device. The fabric's deterministic pipelines sustain streaming sample rates that software processors cannot, while the ARM subsystem handles mission management at 1.5 GHz. On-chip integration reduces component count in constrained platforms. For programs with extended-temperature requirements, the same footprint industrial variant preserves the layout. Verify export and qualification documentation through Altera's official product page for the F40 OPN.
推荐
Test and Measurement Instrumentation
Bench instruments, protocol analyzers, and automated test equipment use the 10AS066N3F40E2SG to timestamp, capture, and correlate high-speed digital channels in the 660K-element fabric while the dual Cortex-A9 cores execute the instrument's operating system, analysis routines, and user interface at up to 1.5 GHz. The 588 user I/Os connect multiple probe front ends, and the fabric's deterministic triggering enables capture-to-display latency far below a two-chip CPU-plus-FPGA architecture. Core supply at 0.9V demands a robust multi-phase regulator given burst capture currents. The FCBGA package requires careful PCB breakout planning for signal access at the connector edge.
推荐
推荐产品汇总
工程参考数据： 10AS066N3F40E2SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS066N3F40I2SG | 10AS066N4F40E3LG | 10AS057N2F40E1SG | 10AS057K2F40I2SG |
|---|---|---|---|---|---|
| Package | 1517-FCBGA (40x40 mm) | 1517-FBGA (40x40) - same | 1517-FBGA (40x40) - same | 1517-FBGA (40x40) - same | 1517-FBGA (40x40) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Processor | Dual ARM Cortex-A9 MPCore, 1.5 GHz | Dual ARM Cortex-A9 MPCore, 1.5 GHz | Dual ARM Cortex-A9 MPCore, 1.5 GHz | Dual ARM Cortex-A9 MPCore, 1.5 GHz | Dual ARM Cortex-A9 MPCore, 1.5 GHz |
| User I/O | 588 | 588 | 588 | 588 | 588 |
| Speed Grade | 2 (E2 option) | 2 (I2 option) | 4 (E3L option) | 1 (E1 option) | 2 (I2 option) |
| Core Supply Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Temperature Option | Extended/Commercial (E) | Industrial (I) | Extended (E3L) | Extended/Commercial (E1) | Industrial (I2) |
关键差异点
- Full 660K logic element capacity with speed grade 2 （对比 10AS057N2F40E1SG)
- Extended/commercial temperature option at lower cost （对比 10AS066N3F40I2SG)
- Balanced speed/power versus fastest grade （对比 10AS066N4F40E3LG)
设计说明
Plan the power tree around the 0.9V core rail first: at heavy fabric utilization with the Cortex-A9 subsystem running at 1.5 GHz, core current can reach tens of amperes on this 660K-LE device. Use a multi-phase buck regulator with remote sense for VCC, and implement the Altera-specified power-up sequencing across VCC, VCCIO banks, VCCHPS, and auxiliary rails. Run Altera's early power estimator (EPE) spreadsheet with your actual utilization numbers before finalizing the regulator selection.
The 1517-ball FCBGA at 40x40 mm requires a disciplined breakout: fan out inner ball rows with via-in-pad or stacked microvias, and dedicate continuous ground planes adjacent to each signal layer to control impedance for high-speed I/O and memory interfaces. Provide a substantial via array under the die-attach region to extract heat into internal planes. Verify ball-map assignments against the official Arria 10 F40 pin-out files rather than reusing layouts from other package codes.
Do not assume speed-grade interchangeability: migrating between E1/E2/E3L or I-grade OPNs changes fabric timing, so a design that closes timing at speed grade 2 may fail at speed grade 1 and must be re-verified in Quartus Prime after any change. Similarly, the 10AS057 variants share the footprint but offer fewer logic elements - confirm post-fit utilization and routing congestion before switching. Always order by the complete OPN, since suffix letters encode temperature and power options.
Estimated: with a dense fabric design dissipating on the order of 10-20 W (use the EPE tool for your configuration), a bare 1517-FCBGA on a standard 4-layer board will exceed safe junction temperatures. Plan a heatsink or heat-pipe assembly mechanically fastened to the package lid, plus thermal vias to internal copper planes, and validate with CFD or the Altera thermal design guidelines for the F40 package before locking the enclosure.
合规信息
Compliance data not present in the provided web results; consult Altera's official product page or packing/ECO documentation for RoHS/REACH declarations.