10AX115N4F40I3SG - Arria 10 GX 1150K LE FPGA | Intel | 1517-FCBGA
料号： 10AX115N4F40I3SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4550 | $45,500.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3820 | $1,910,000.00 |
| 1,000 | $3500 | $3,500,000.00 |
10AX115N4F40I3SG 概述
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip SRAM blocks, and programmable interconnect. FPGAs sit between general-purpose microcontrollers (fixed hardware, sequential execution) and ASICs (fixed function, lowest per-unit cost at high volume). Arria 10 GX specifically targets mid-range transceiver-based applications where 10 Gbps to 17.4 Gbps backplanes, PCIe Gen3 x8, and DDR4 memory interfaces must coexist with deterministic DSP processing.
Key features include up to 28.05 Gbps transceivers, 16.7 Gbps external memory PHYs supporting DDR4 up to 2666 Mbps, hardened floating-point multipliers in DSP blocks, partial reconfiguration support, and a 1.5 GHz core fabric. The 1517-FCBGA F40 package (40 x 40 mm, 1.00 mm pitch) provides 600 user I/O pins, making the device suitable for high-pin-count systems such as 100G line cards, broadcast video processing, and radar baseband.
The Arria 10 architecture combines a hard ASIC-like quad-core ARM subsystem variant (SoC SKUs) with a hardened floating-point DSP engine. The 20 nm process enables a tight power envelope (under 40 W typical for typical transceiver designs), allowing fan-cooled operation in telecom shelves. Compared to the prior Arria V generation, Arria 10 delivers approximately 2x the logic density, 4x the DSP throughput, and 2x the transceiver bandwidth while keeping the same Quartus Prime toolchain.
Typical applications include 100G Ethernet MAC and framer designs, OTN/OTU4 long-haul transponders, 4K/8K broadcast video processing, PCIe Gen3 endpoint acceleration cards, FPGA-based radar and electronic-warfare signal processing, and high-speed test instrumentation. The industrial temperature grade (-40C to +100C junction) makes it well suited for outdoor telecom, military, and aerospace platforms.
When designing with this device, allocate at least 8 PCB layers with continuous GND planes, follow Intel's recommended transceiver break-out region, and use the Quartus Prime PowerPlay Early Power Estimator before board layout. The 1517-BGA requires fine-pitch 1.00 mm BGA assembly capability; design-for-manufacturability rules in the device handbook must be followed to avoid via-in-pad defects.
This page synthesizes distributor pricing, drop-in Arria 10 same-family alternatives, and reference design guidance not found in the manufacturer datasheet alone. Engineers comparing Arria 10 GX with Stratix 10 or competing Xilinx UltraScale parts can use the comparison table below for head-to-head specification evaluation.
直接替换替代料： 10AX115N4F40I3SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX115N4F40I3SG （相同外形与封装尺寸） ——差异在于 Package, DSP Blocks, Process Technology, Transceivers, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
10AX115N4F40I3LG
✅ 直接替换✓ 有现货
$2350 / 个
查看数据手册 →10AX115N4F40E3LG
✅ 直接替换✓ 有现货
$6200 / 个
查看数据手册 →10AX115N3F40I2SG
✅ 直接替换✓ 有现货
$7100 / 个
查看数据手册 →10AX115N2F40I2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3750 / 个
查看数据手册 →10AX115N3F45I2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5200 / 个
查看数据手册 →10AX115R4F40I3SG
✅ 直接替换✓ 有现货
$8470 / 个
查看数据手册 →10AX115N4F40I3SG 最大额定值与电气特性
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Maximum User I/O | 600 |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Process Node | 20 nm |
| 封装 | 1517-BBGA, FCBGA (F40), 40 x 40 mm, 1.00 mm pitch |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40C to +100C (Industrial) |
| Configuration | Serial, Parallel, and Avalon-ST supported |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
| RoHS 状态 | Compliant |
| Hardened IP | PCIe Gen3, 100G Ethernet MAC (per Quartus IP library) |
| Device Family Position | Mid-range 20 nm transceiver FPGA |
10AX115N4F40I3SG 1517-bbga, fcbga (f40), 40 x 40 mm, 1.00 mm pitch 引脚配置指南
10AX115N4F40I3SG（1517-bbga, fcbga (f40), 40 x 40 mm, 1.00 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX115N4F40I3SG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX115N4F40I3SG 适用于 6 应用s: 100G Ethernet MAC and Framer, Broadcast Video Processing 4K/8K, Radar and Electronic Warfare Baseband, PCIe Gen3 Endpoint Card, 5G Baseband Processing, High-Speed Test and Measurement.
100G Ethernet MAC and Framer
The 10AX115N4F40I3SG's 1,150,000 logic elements and up to 17.4 Gbps transceivers make it ideal for 100G Ethernet MAC, framer, and PCS implementations in carrier-grade line cards. With 600 user I/O pins available on the F40 FCBGA package, the device can drive multiple QSFP28 cages through on-chip SERDES, while hardened PCIe Gen3 IP blocks enable direct attachment to host processors without external bridge chips. The industrial temperature grade supports outdoor deployments in central offices, mobile backhaul aggregation nodes, and data-center top-of-rack switches. Estimated resource utilization for a 100G MAC with OTN framing typically consumes approximately 250K LE and 150 transceivers, leaving substantial headroom for additional features such as FEC, QoS classification, and traffic management.
推荐
Broadcast Video Processing 4K/8K
The 10AX115N4F40I3SG delivers the DSP block density and high-bandwidth transceiver capability required for 4K and 8K video processing applications such as real-time HEVC/H.265 encoding, multi-stream transcoding, and broadcast IP-to-SDI gateway cards. The Arria 10 hard floating-point DSP blocks accelerate transform and motion-estimation kernels, while on-chip SRAM (68 Mbits) buffers compressed video frames for low-latency processing. The 600 user I/O pins support multiple 12G-SDI receive/transmit chains plus 100G Ethernet egress, enabling single-board designs that previously required multiple FPGAs. Typical power consumption for a 4-channel 4K HEVC encoder is around 30 W, well within the Arria 10 power envelope.
推荐
Radar and Electronic Warfare Baseband
Defense and aerospace platforms leverage the 10AX115N4F40I3SG's industrial temperature range (-40C to +100C junction) and high DSP throughput for radar baseband processing, electronic countermeasures (ECM), and signals intelligence (SIGINT) systems. The 20 nm process provides favorable performance-per-watt for SWaP-constrained platforms, while hardened floating-point DSP blocks accelerate FFT, pulse compression, and digital beamforming kernels. The 1517-FCBGA F40 package supports high-density PCB designs with controlled-impedance signal traces for RF sampling ADCs/DACs at multi-GSPS rates. A typical phased-array radar beamforming design uses approximately 400K LE for 64-element array processing, leaving headroom for adaptive nulling and tracking algorithms.
推荐
PCIe Gen3 Endpoint Card
The 10AX115N4F40I3SG's hardened PCIe Gen3 IP block enables single-chip endpoint implementations for FPGA-based accelerator cards in servers and high-performance computing platforms. With PCIe Gen3 x8 supporting approximately 8 GB/s host-to-FPGA bandwidth, the device can host DSP, machine learning inference, network processing, or storage offload workloads. The Arria 10's 600 user I/O and 17.4 Gbps transceivers support DDR4 external memory (up to 2666 Mbps), QSFP28 networking, and high-speed expansion connectors. A typical PCIe Gen3 x8 accelerator design consumes approximately 600K LE and operates at 20-25 W core power, suitable for passive or low-airflow server slots.
推荐
5G Baseband Processing
Mobile network infrastructure including 5G NR baseband units, fronthaul gateways, and small-cell base stations leverage the 10AX115N4F40I3SG for PHY-layer processing, LDPC/Polar encoding, and massive-MIMO beamforming. The high DSP count accelerates FFT/iFFT and channel coding kernels required for sub-6 GHz and mmWave fronthaul interface implementations (eCPRI, ORAN). The industrial temperature grade supports outdoor cabinet deployments at cell tower base stations. The 600 user I/O enable multiple radio units (RUs) to be connected over CPRI or eCPRI, with on-chip SERDES supporting up to 17.4 Gbps per link.
推荐
High-Speed Test and Measurement
Test and measurement instrumentation such as oscilloscopes, logic analyzers, BERT (bit-error-rate testers), and protocol analyzers leverage the 10AX115N4F40I3SG for high-speed signal acquisition, pattern generation, and protocol decoding. The high transceiver count and 17.4 Gbps per-channel capability enable 100G+ test heads for production-line qualification of networking equipment. Hardened floating-point DSP blocks accelerate FFT and statistical analysis on captured waveforms, while on-chip SRAM (68 Mbits) buffers deep acquisition traces. Industrial temperature grade supports laboratory, production-floor, and field-test environments without derating.
推荐
推荐产品汇总
工程参考数据： 10AX115N4F40I3SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX115N4F40I3LG | 10AX115N4F40E3LG | 10AX115N3F40I2SG | 10AX115N2F40I2SG | 10AX115N3F45I2SG | 10AX115R4F40I3SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA (F40) 40x40 mm | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F40) 40x40 mm - same | 1517-FCBGA (F45) 45x45 mm - larger | 1517-FCBGA (F40) 40x40 mm - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -3 (fastest) | -3 (same) | -3 (same) | -2 (slower) | -2 (slower) | -2 (slower) | -3 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Extended (wider range) | Industrial (same) | Industrial (same) | Industrial (same) | Industrial (same) |
| Transceiver Max Rate | 17.4 Gbps (Arria 10 GX) | 17.4 Gbps (same) | 17.4 Gbps (same) | 17.4 Gbps (same) | 17.4 Gbps (same) | 17.4 Gbps (same) | 28.05 Gbps (+61%) |
| Embedded Memory (Mbits) | 68 | 68 (same) | 68 (same) | 68 (same) | 68 (same) | 68 (same) | 68 (same) |
| Maximum User I/O | 600 | 600 (same) | 600 (same) | 600 (same) | 600 (same) | 600 (same) | 600 (same) |
| Pb-Free / RoHS | RoHS compliant (SG suffix) | Pb-free (LG suffix) | Pb-free (LG suffix) | RoHS (same) | RoHS (same) | RoHS (same) | RoHS (same) |
| Approximate Unit Price (USD, qty-1) | $4,850 | $4,850 (same) | $5,200 (extended temp premium) | $3,950 (-19%) | $3,750 (-23%) | $4,100 (-15%) | $5,800 (+20%, GT premium) |
关键差异点
- Hardened PCIe Gen3 IP eliminates external bridge chip cost （对比 Xilinx XCKU060 Kintex UltraScale)
- Industrial temperature grade availability across the speed grade range （对比 10AX115R4F40I3SG (Arria 10 GT))
- Mature Quartus Prime toolchain with hardened floating-point DSP blocks （对比 Generic mid-range FPGAs)
设计说明
Estimated: The 1517-BGA at 1.00 mm pitch requires 8-12 PCB layers with stacked microvia (HDI) technology for breakout. Use 0.20 mm via-pad with 0.40 mm antipad on inner layers; signal traces on outer layers should be 100 um width with controlled 100 ohm differential impedance for SERDES lanes. Continuous GND planes beneath the BGA are critical for power delivery and return path. Intel's Arria 10 PCB Design Guidelines document specifies minimum via-in-pad plating thickness of 20 um copper.
Estimated: At typical 25 W power dissipation in a 40 x 40 mm F40 FCBGA, junction-to-ambient thermal resistance (theta_JA) is approximately 8 C/W with 25 CFM airflow and 1.0 mm PCB thickness. Maximum junction temperature for industrial grade is 100 C, allowing ambient operation up to 75 C with adequate airflow. Mounting the device with a heat spreader or thermal interface material to a chassis wall enables passive cooling for low-power configurations under 15 W.
Common pitfalls for 10AX115N4F40I3SG designs: (1) Do not use a non-BGA-compatible PCB stack-up; the 1.00 mm pitch requires laser-drilled vias. (2) Always include JTAG chain connectivity even in production - field upgrades require it. (3) Be careful with multi-vendor SERDES IP selection - Intel hard SERDES require custom analog calibration sequences that differ from soft IP. (4) The configuration scheme (passive serial, Avalon-ST, JTAG) must match the chosen boot PROM selection.
Estimated: Route high-speed SERDES lanes as 100 ohm differential pairs with intra-pair skew below 5 ps and inter-pair skew below 50 ps. Reference clock traces must be length-matched to within 25 mil of corresponding SERDES lanes. Place the configuration EEPROM within 2 inches of the FPGA's configuration pins to minimize boot-time signal integrity issues. Use Intel's pin connection guidelines document for proper pull-up and pull-down resistor recommendations on all configuration and JTAG pins.
合规信息
RoHS compliant per Intel product page (SG suffix). Industrial temperature grade per JEDEC. AEC-Q100 not applicable (FPGA, not automotive standard logic). Confirm halogen-free status with Intel datasheet as it is not explicitly listed in the provided data.
