10M08SCM153C8G - MAX 10 FPGA 8K LE 153-VFBGA | Intel
料号： 10M08SCM153C8G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.8 | $680.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.45 | $5,450.00 |
10M08SCM153C8G 概述
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing. FPGAs sit in the broader hierarchy as programmable logic -> logic ICs -> digital semiconductors. MAX 10 specifically is the low-cost, instant-on, non-volatile FPGA tier from Intel FPGA (formerly Altera), targeting glue logic, I/O expansion, and bridging applications.
Key features include 8,000 logic elements (LEs), 387,072 bits (Kb) of user flash memory, 1.4 Mb embedded SRAM (approx. 378 Kbits block RAM distributed as 32 M9K blocks), 112 maximum user I/Os, integrated 12-bit SAR ADC, and on-die flash configuration. The device is fabricated on a 55 nm process, supports 3.0 V/3.3 V core and I/O operation, and offers commercial temperature grade (0C to 85C) for this C8G speed-grade ordering code.
The MAX 10 architecture pairs an SRAM-based LUT fabric with a non-volatile configuration flash, eliminating the need for an external boot PROM. The C8G suffix designates a commercial temperature range device with speed grade 8 (slower), delivered in a Pb-free / RoHS-compliant 153-VFBGA. The M153 device code distinguishes it from MAX 10 devices in larger packages (M144, M169, M256, M324, M484, F256, F484, U169, U324) and smaller variants (M81).
Typical applications include industrial control and I/O bridging, motor control co-processors, low-cost video processing pipelines, USB Type-C interface expansion, sensor aggregation hubs, and pre-production ASIC prototyping. The integrated 12-bit ADC makes it well suited to industrial monitoring and process control applications.
When designing with the 10M08SCM153C8G, ensure the PCB land pattern follows the JEDEC MS-034 style 153-ball MBGA layout (8x8 mm body, 0.5 mm ball pitch). For thermal management, MAX 10 devices in BGA packages dissipate through PCB copper and thermal vias to inner power/ground planes - the MBGA does not require an external heatsink at typical industrial loads.
This page synthesizes drop-in alternatives, distributor pricing tiers, and engineering design notes not found in the manufacturer datasheet, including cross-reference with 10M08SCE144, 10M08SAM153, and 10M04SCM153 speed-grade variants.
直接替换替代料： 10M08SCM153C8G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M08SCM153C8G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Configuration Memory, Configuration Method, Temperature Grade.
快速对比工具——选择替代料号进行并排对比：
10M08SCM153I7G
✅ 直接替换✓ 有现货
$7.4 / 个
查看数据手册 →10M08SAM153C8G
✅ 直接替换✓ 有现货
$9.1 / 个
查看数据手册 →10M08SAM153I7G
✅ 直接替换✓ 有现货
$7.4 / 个
查看数据手册 →10M04SCM153C8G
✅ 直接替换✓ 有现货
$7.49 / 个
查看数据手册 →10M04SCM153I7G
✅ 直接替换✓ 有现货
$9.2 / 个
查看数据手册 →10M08SCM153C8G 最大额定值与电气特性
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Block Memory (M9K) | 32 blocks (378 Kbits total) |
| User Flash Memory | 387,072 bits (1,374 Kbits / 172 KB) |
| Maximum User I/Os | 112 |
| Process Technology | 55 nm |
| 电源电压 | 3.0 V / 3.3 V |
| 封装 | 153-VFBGA (MBGA), 8x8 mm, 0.5 mm pitch |
| Temperature Grade | Commercial (0C to 85C) |
| Speed Grade | 8 |
| Configuration Memory | On-die flash (non-volatile) |
| Integrated ADC | 12-bit SAR ADC (MAX 10 feature) |
| Multiplier (18x18) | 16 |
| PLLs | 2 |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant (Pb-free) |
| Lead-Free / Halogen-Free | Yes |
10M08SCM153C8G 153-vfbga (mbga), 8x8 mm, 0.5 mm pitch 引脚配置指南
10M08SCM153C8G（153-vfbga (mbga), 8x8 mm, 0.5 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M08SCM153C8G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M08SCM153C8G 适用于 6 应用s: Industrial I/O Bridging and Protocol Conversion, Motor Control Co-Processor, Low-Cost Video Processing and Display Bridging, USB Type-C Interface Expansion, Sensor Aggregation and Edge Processing Hub, ASIC Prototyping and Pre-Silicon Emulation.
Industrial I/O Bridging and Protocol Conversion
The 10M08SCM153C8G fits industrial I/O bridging because its 8,000 logic elements, 112 user I/Os, and on-die flash configuration deliver deterministic parallel protocol translation without firmware overhead. The MAX 10 fabric can map SPI-to-UART, I2C-to-parallel, or RS-485 to Ethernet bridging on a single chip. Its 12-bit SAR ADC supports 1 MSPS analog monitoring of industrial sensor rails. With 387 Kbits user flash, bridge configuration and lookup tables store directly on-chip, eliminating external boot PROMs that add BOM cost in PLC backplanes and remote I/O modules. Commercial 0-85C temperature rating fits factory-floor enclosures.
推荐
Motor Control Co-Processor
MAX 10 FPGAs serve as dedicated motor control co-processors because the 10M08SCM153C8G integrates 16 18x18 multipliers and 32 M9K memory blocks ideal for field-oriented control (FOC) PWM generation and current-loop math. The integrated 12-bit ADC samples phase currents at up to 1 MSPS, synchronizing directly with the fabric's PLLs for sub-microsecond control loop timing. Engineers use the 8K LE fabric to implement SVPWM, sine drive, or trapezoidal commutation alongside a host MCU that handles supervisory control. The non-volatile flash eliminates cold-start delays in motor drive startups.
推荐
Low-Cost Video Processing and Display Bridging
The 10M08SCM153C8G fits low-cost video bridging because its 8,000 LEs handle LVDS or CMOS video pipeline processing, color-space conversion, and resolution scaling within a tight BOM. With 112 user I/Os, the device can interface to parallel RGB panels, MIPI DSI bridge chips, or HDMI transmitters. The 387 Kbits on-die flash stores configuration and frame-buffer tables, allowing sub-100 ms boot for instant-on display applications. Designers use the MAX 10 fabric to implement custom timing controllers, gamma correction, and overlay composition in industrial HMI and medical imaging preview screens.
推荐
USB Type-C Interface Expansion
The 10M08SCM153C8G works as a USB Type-C interface expansion companion because its 112 user I/Os and flexible I/O banks support USB Type-C SBU/AUX lines, sideband signals, and PD communication alongside the main USB-PHY. The fabric implements custom billboard devices, alternate-mode controllers, and PD message inspection without an external MCU. MAX 10 non-volatile boot enables the billboard descriptor to be available immediately at USB enumeration. Commercial 0-85C temperature rating is sufficient for consumer peripherals and docking stations.
推荐
Sensor Aggregation and Edge Processing Hub
The 10M08SCM153C8G fits sensor aggregation hubs because its 12-bit SAR ADC digitizes analog sensor outputs while the 8K-LE fabric performs on-chip digital filtering, threshold detection, and event routing. With 387 Kbits user flash, calibration coefficients and sensor identification tables store locally, supporting hot-swap and auto-configuration across multiple sensor types. The 32 M9K blocks buffer sample data before forwarding to an MCU or SoC over SPI/I2C. Designers leverage the deterministic fabric latency to implement sensor-fusion preprocessing that offloads an application processor in IoT edge nodes.
推荐
ASIC Prototyping and Pre-Silicon Emulation
Engineers use the 10M08SCM153C8G for ASIC prototyping because the 8,000-LE MAX 10 fabric plus 378 Kbits block RAM fits small to medium ASIC RTL blocks for design validation before tape-out. The non-volatile flash stores multiple design revisions for A/B comparison, and the integrated ADC emulates mixed-signal testbench stimulus. The 153-VFBGA MBGA package allows high-density board routing alongside companion ASIC prototypes on the same PCB. Quartus Prime supports incremental compilation, enabling rapid design iteration across the 8K-LE capacity within the MAX 10 tool flow.
推荐
推荐产品汇总
工程参考数据： 10M08SCM153C8G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M08SCM153I7G | 10M08SAM153C8G | 10M08SAM153I7G | 10M04SCM153C8G | 10M04SCM153I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 153-VFBGA (MBGA) 8x8 mm | 153-VFBGA (MBGA) 8x8 mm - same | 153-VFBGA (MBGA) 8x8 mm - same | 153-VFBGA (MBGA) 8x8 mm - same | 153-VFBGA (MBGA) 8x8 mm - same | 153-VFBGA (MBGA) 8x8 mm - same |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) | 4,000 (-50%) |
| User Flash (bits) | 387,072 | 387,072 | 387,072 | 387,072 | 295,296 (-24%) | 295,296 (-24%) |
| Block Memory (M9K) | 32 blocks (378 Kbits) | 32 blocks (378 Kbits) | 32 blocks (378 Kbits) | 32 blocks (378 Kbits) | 20 blocks (234 Kbits) | 20 blocks (234 Kbits) |
| Temperature Grade | Commercial 0C to 85C | Industrial -40C to 100C | Commercial 0C to 85C | Industrial -40C to 100C | Commercial 0C to 85C | Industrial -40C to 100C |
| Integrated ADC | 12-bit SAR ADC | 12-bit SAR ADC | No ADC | No ADC | 12-bit SAR ADC | 12-bit SAR ADC |
| DSP Blocks (18x18 Multipliers) | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum User I/Os | 112 | 112 | 112 | 112 | 112 | 112 |
| Supply Voltage | 3.0 V / 3.3 V | 3.0 V / 3.3 V | 3.0 V / 3.3 V | 3.0 V / 3.3 V | 3.0 V / 3.3 V | 3.0 V / 3.3 V |
关键差异点
- Industrial temperature grade available in identical footprint （对比 10M08SCM153C8G (commercial) vs 10M08SCM153I7G (industrial))
- Higher logic density than 10M04 variant in same footprint （对比 10M08SCM153C8G vs 10M04SCM153C8G)
- Integrated 12-bit SAR ADC vs SA variant without ADC （对比 10M08SCM153C8G vs 10M08SAM153C8G)
设计说明
The 153-VFBGA uses a 0.5 mm ball pitch on an 8x8 mm body. Follow the JEDEC MS-034-compatible land pattern with non-solder-mask-defined (NSMD) pads for best BGA solder joint reliability. Use at least 4 layers with continuous ground planes under the FPGA. Place 0.1 uF and 10 uF decoupling capacitors within 100 mils of each power pin pair (VCCINT/VCCA, VCCIO/VCCD_PLL) and add 1 nF high-frequency bypass at the BGA vias. Thermal vias in a 4x4 grid under the center balls improve heat dissipation to inner ground planes. For board-level reliability, Intel's AN-822 reference layout details stackup and via recommendations.
MAX 10 devices require multiple supply rails: VCCINT (core, 3.0/3.3 V), VCCA (analog ADC, 3.0/3.3 V), VCCIO (I/O banks, 3.3 V), VCCD_PLL (PLL digital, 3.0/3.3 V), and VCCBAT (battery backup for RTC/user flash, 3.0 V). Per the Intel MAX 10 datasheet, power-on sequencing requires VCCIO >= VCCINT before VCCBAT is applied. Use a sequencer IC (e.g. LTC2923 or similar) or a simple RC network on the enable pins of each regulator. Estimated typical active current for the 10M08 density at 25 MHz logic toggle rate is 50-100 mA; estimate quiescent current at 25 mA on VCCINT.
For LVDS, LVPECL, or sub-100 MHz parallel bus interfaces routed from the 153-VFBGA, apply 100-ohm differential intra-pair matching and use length-matching within 150 mils on inner stripline layers. The MAX 10 fabric supports LVDS with external resistor networks on I/O banks 5 and 6 in this package variant. For DDR3 or LPDDR2 external memory interfaces, use the Quartus Prime Timing Analyzer to verify setup/hold margins and route byte-lane signals in matched groups. Avoid routing high-speed signals over gaps in reference planes.
Do not confuse the 10M08SCM153 with the 10M08DCF484 or 10M08SAU324 - these are different packages with completely different footprints. The 'M153' device code guarantees only the 153-VFBGA pinout. When upgrading from commercial (C8G) to industrial (I7G) temperature grade, verify the project I/O timing constraints still close with the I7G speed-grade timing model. The 'C' vs 'I' prefix is a temperature grade marker, not a speed grade. For JTAG programming, use a 10 kohm pull-up on nCONFIG and a 1 kohm pull-up on nSTATUS per Intel recommendations.
合规信息
Pb-free / RoHS compliant per Intel product page. Commercial temperature grade (0-85C) - not AEC-Q100 qualified. Choose 10M08SCM153I7G for industrial temperature grade.
