10M40DAF256C7G - 40K LE MAX 10 FPGA, 256FBGA | Intel
料号: 10M40DAF256C7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $83.78 | $83.78 |
| 10 | $72.52 | $725.20 |
| 100 | $59.81 | $5,981.00 |
| 500 | $50.22 | $25,110.00 |
| 1,000 | $46.83 | $46,830.00 |
10M40DAF256C7G 概述
An FPGA is a semiconductor device containing programmable logic fabric that can be configured after manufacturing to implement digital circuits, from combinational logic to complex state machines and soft microcontrollers. The MAX 10 family is notable for integrating non-volatile configuration memory on-chip, which means no external SPI flash configuration device is required during board bring-up. In the system hierarchy, this FPGA sits between high-end ASSPs/SoCs and low-density CPLDs, allowing engineers to implement custom I/O, protocol bridging, and real-time control logic while retaining field-upgrade flexibility.
Key features of the 10M40DAF256C7G include 40,000 logic elements, 178 user I/Os, and 1,290,240 RAM bits. The FBGA-256 package has a 17 mm x 17 mm body with 1 mm ball pitch, enabling compact PCB implementation. The device is marked as RoHS compliant in distributor listings and is supplied as non-volatile, configurable FPGA silicon from the MAX 10 portfolio.
From an architecture perspective, the MAX 10 family combines FPGA fabric, embedded memory blocks, and non-volatile configuration flash in one die. The 256-ball package provides a practical balance between I/O count and board area. The 1.2V core supply simplifies power delivery planning compared to some older CPLD/FPGA devices that require multiple auxiliary supplies, while the many I/O pins support parallel interfaces, memory buses, and general-purpose control signals.
Typical applications for this part include industrial motor control, factory automation, IoT edge gateways, display and vision interfaces, remote I/O concentrators, and test-and-measurement equipment. The combination of 40K logic elements and on-chip configurability makes it suitable for designs that need custom logic without the cost or board space of external configuration memory.
One important design consideration is that the commercial-temperature device is rated only from 0C to +85C. For outdoor or cold-start environments, use the industrial-temperature variant, 10M40DAF256I7G, which has the same logic density and FBGA-256 package. Power-supply decoupling should target the 1.2V core rail with low-ESR ceramic capacitors distributed near the BGA package.
This page synthesizes distributor availability, price references, drop-in alternative variants, and practical design notes that are not all consolidated in a single manufacturer datasheet, providing engineers with actionable data for sourcing and design decisions.
直接替换替代料: 10M40DAF256C7G ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号: 10M40DAF256C7G (相同外形与封装尺寸) ——差异在于 Package, Process Technology, DSP Blocks, Operating Temperature, Family.
快速对比工具——选择替代料号进行并排对比:
10M40DAF256I7G
✅ 直接替换✓ 有现货
$65.8 / 个
查看数据手册 →10M40DCF256C7G
✅ 直接替换✓ 有现货
$26.4 / 个
查看数据手册 →10M40DCF256I7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$52.12 / 个
查看数据手册 →10M40DAF256C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$55.2 / 个
查看数据手册 →10M40DCF256C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$71.8 / 个
查看数据手册 →10M40DAF256C7G 最大额定值与电气特性
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | MAX 10 |
| Non-volatile FPGA | Yes |
| Number of Logic Elements | 40000 |
| Total RAM Bits | 1290240 bits |
| Embedded Memory | 1.23 Mbit |
| Number of User I/Os | 178 |
| Core Supply Voltage | 1.2 V |
| Minimum Operating Temperature | 0C |
| Maximum Operating Temperature | +85C |
| 封装 / 外壳 | FBGA-256 (256-LBGA) |
| Package Body Size | 17 mm x 17 mm |
| Package Pitch | 1 mm |
| 安装方式 | SMD/SMT |
| Packaging Type | Tray |
| RoHS 状态 | Compliant |
| Device Option Code | DAF256C7G |
10M40DAF256C7G 1 mm 引脚配置指南
10M40DAF256C7G(1 mm 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据: 10M40DAF256C7G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M40DAF256C7G 适用于 6 应用s: Industrial Motor Control, IoT Edge Computing and Sensor Fusion, LED Display and Video Interface, Factory Automation and Robotics, Remote I/O and Communication Concentrators, Test and Measurement Instruments.
Industrial Motor Control
The Intel 10M40DAF256C7G suits motor-control designs that need deterministic local logic and 178 user I/Os for encoder interfaces, PWM generation, H-bridge control, and safety interlocks. Because MAX 10 is non-volatile, the FPGA begins execution immediately after power-up without waiting for an external configuration device, reducing boot delay in drive panels. Its 40,000 logic elements can host multiple PID controllers, commutation state machines, and overcurrent protection logic, while the 1,290,240 RAM bits buffer position and current samples. The commercial 0C-to-85C rating matches indoor industrial cabinets; designs exposed to -40C should select the I7G variant. The FBGA-256 package supports compact inverter boards when combined with proper via fan-out and 1.2V core decoupling.
IoT Edge Computing and Sensor Fusion
For IoT edge nodes that require flexible sensor timing and protocol conversion, the 10M40DAF256C7G provides 40K logic elements, 178 user I/Os, and non-volatile instant-on operation. The FPGA can preprocess data from temperature, pressure, current, and motion sensors before forwarding results to a host MCU or SoC. Its programmable I/O banks can adapt to different sensor voltage domains while the embedded RAM stores small FIFOs for asynchronous data streams. Unlike MCU-only designs, the MAX 10 device supports deterministic parallel acquisition from multiple sensors in the same clock cycle. For smart building and industrial IoT installations that stay within 0C to +85C, the C7G variant is a cost-effective logic device. The 1.2V core rail should be cleanly separated from I/O banks during PCB layout.
LED Display and Video Interface
The 10M40DAF256C7G is well suited for LED display controllers and video interface boards that must scan many parallel data lines. Its 178 user I/Os allow direct connection to RGB LED drivers, shift registers, and memory buses, while 40,000 logic elements implement scan state machines, gamma correction pipelines, and timing generators. The internal RAM blocks buffer line data between input video streams and the display panel, reducing external memory requirements in smaller panel designs. Non-volatile configuration enables the display controller to start up immediately when power is applied, avoiding configuration delay during unattended public-display operation. For commercial indoor LED walls and signage, the 0C-to-85C temperature rating is generally sufficient, though outdoor cabinets with high ambient temperatures should use industrial-rated variants.
Factory Automation and Robotics
In factory automation, the 10M40DAF256C7G can serve as an I/O expansion and protocol-bridging FPGA between fieldbus PHYs, robot controllers, and sensors. The 40K logic element architecture supports soft UARTs, SPI masters, and a custom parallel register map, while the 178 user I/Os connect to limit switches, actuators, and encoder interfaces. Because MAX 10 stores configuration internally, automated machines can restart quickly after a power glitch; no external configuration flash cable has to be attached on the line. The commercial temperature rating suits controlled factory floors, while the industrial-grade I7G variant is available for unheated production areas. Proper thermal management should still be provided on the 1.2V core, especially in sealed control cabinets.
Remote I/O and Communication Concentrators
The 10M40DAF256C7G can implement a remote I/O concentrator that aggregates digital inputs, analog trigger signals, and low-speed serial links before forwarding them to a central controller. Its non-volatile FPGA fabric starts on power-up, making it appropriate for distributed industrial nodes that must be ready quickly when the network powers on. With 178 I/Os, the device can monitor many discrete field signals and drive relay coils through external transceivers and drivers. The 40K logic element density provides room for protocol timing logic, cyclic redundancy check modules, and a simple soft-core processor if required. Use the FBGA-256 package in compact remote terminal unit designs, and maintain controlled impedance and glitch filtering for long cable connections to the field.
Test and Measurement Instruments
Benchtop instruments such as data loggers, waveform generators, and signal-routing boxes can use the 10M40DAF256C7G for high-speed digital control, trigger logic, and pattern generation. The 40,000 logic elements are sufficient for capture state machines and FIFO control, while 1,290,240 RAM bits provide on-chip data buffering for short acquisitions. The 178 user I/Os allow direct connection to ADCs, DACs, comparators, and front-panel digital interfaces. Non-volatile configuration is beneficial in instruments that must boot quickly when a user presses power. The commercial temperature grade covers typical laboratory environments. During layout, separate analog and digital ground areas and decouple the 1.2V core with multiple ceramic capacitors near the BGA balls.
工程参考数据: 10M40DAF256C7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M40DAF256I7G | 10M40DCF256C7G | 10M40DCF256I7G |
|---|---|---|---|---|
| Package | FBGA-256 (17x17 mm) | FBGA-256 (17x17 mm) | FBGA-256 (17x17 mm) | FBGA-256 (17x17 mm) |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 40000 | 40000 | 40000 | 40000 |
| User I/O | 178 | 178 | 178 | 178 |
| Total RAM Bits | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 |
| Temperature Grade | Commercial 0C to +85C | Industrial, -40C to +100C | Commercial 0C to +85C | Industrial, -40C to +100C |
| Device Option | A (ADC-capable ordering option) | A (ADC-capable ordering option) | C (non-ADC ordering option) | C (non-ADC ordering option) |
| Speed/Temperature Suffix | C7 | I7 | C7 | I7 |
关键差异点
- Commercial 0C-to-85C grade provides lower-cost option for indoor systems (对比 10M40DAF256I7G)
- ADC-capable 'A' option in the part number (对比 10M40DCF256C7G)
- Non-volatile instant-on configuration (对比 10M40DAF256I7G)
设计说明
The 10M40DAF256C7G uses a 1.2V core supply, as shown in the verified distributor specification. Place multiple 100nF ceramic capacitors close to the core-supply balls of the FBGA-256 package and add a 10uF bulk capacitor near the point where 1.2V enters the PCB. Keep the 1.2V plane clean and away from noisier I/O bank supplies to reduce power-supply-induced jitter in high-speed user logic.
The FBGA-256 package has a 17 mm x 17 mm body with 1 mm ball pitch. Use a dog-bone fanout with 0.3 mm or smaller vias for signal escape routing. For the center balls, consider using blind/buried vias if the layer count is low. Confirm the exact ball map from the Intel pin file before final layout; the captured web data does not include the complete BGA pinout.
Do not confuse the commercial C7 grade with the industrial I7 grade. If the end product must start below 0C or operate in an unheated enclosure, select 10M40DAF256I7G or another I7 variant instead of the C7G device. Also verify the MAX 10 device option 'A' versus non-ADC 'C' because Quartus device selection and pin assignments may differ between options even when the package size is identical.
合规信息
RoHS compliance is stated in the Ampheo distributor listing. The 'G' suffix in the Intel part number commonly indicates lead-free/RoHS-compliant finish. No REACH, AEC-Q100, halogen-free, or conflict-minerals statements were found in the captured web data.