5AGXMA3D4F31I5N - Arria V GX FPGA, 156K LE, 896-FCBGA | Intel
料号： 5AGXMA3D4F31I5N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1645 | $41,125.00 |
| 100 | $1495 | $149,500.00 |
| 250 | $1390 | $347,500.00 |
5AGXMA3D4F31I5N 概述
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that the engineer can customize after manufacturing. FPGAs sit between fixed-function ASICs (high NRE, high volume) and software-defined processors (fixed hardware, sequential) in the silicon hierarchy: FPGA -> programmable logic -> reconfigurable computing -> semiconductor. The Arria V GX specifically targets applications requiring high-speed serial transceivers, embedded hard IP blocks, and balanced logic/memory/DSP resources.
Key features of the 5AGXMA3D4F31I5N include 5890 logic array blocks (LABs) per the Mouser product summary, integrated PCIe hard IP, up to 9.225 Gbps transceivers, and dedicated DSP blocks for high-throughput signal processing. The 896-ball FCBGA package supports 416 user I/Os with high-speed serial lanes grouped along dedicated banks, allowing simultaneous DDR3 memory interfacing and multi-gigabit serial links.
Architecturally, the Arria V GX combines a hard PCIe Gen2 endpoint, hard memory controllers, and up to 36 transceiver channels at data rates suitable for 10G Ethernet, CPRI, and 3G-SDI backhaul. The 28nm process balances static and dynamic power versus cost-per-logic, and the I5 speed grade indicates the slowest commercially available timing closure window, chosen for power-sensitive industrial designs.
Typical applications include 10G Ethernet aggregation switches, wireless baseband processing (CPRI/OBSAI fronthaul), military and industrial video processing pipelines, and PCI Express endpoint cards in test/measurement. The part is frequently designed into long-life-cycle embedded systems where an ASIC redesign is economically infeasible.
When laying out the 896-FCBGA, allocate a 31mm x 31mm BGA land pattern with microvia stacking for breakout; signal integrity demands reference planes for every transceiver lane. The device requires multiple decoupling rails (0.9V, 1.1V, 1.8V, 2.5V, 3.3V) and a programmable clock tree managed by the Intel Quartus Prime toolchain.
This page synthesizes 16-distributor price comparison, parametric side-by-side with same-family Arria V GX alternatives, and PCB design guidance beyond what is found in the manufacturer datasheet.
直接替换替代料： 5AGXMA3D4F31I5N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5AGXMA3D4F31I5N （相同外形与封装尺寸） ——差异在于 Hard IP, Process Technology, RoHS Status, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
5AGXMA3D4F31I5G
✅ 直接替换✓ 有现货
$1145 / 个
查看数据手册 →5AGXMA3D4F31C5N
✅ 直接替换📋 参考替代料（不在目录中）
5AGXMA5D4F31C5N
✅ 直接替换📋 参考替代料（不在目录中）
5AGXMA1D4F31C5N
✅ 直接替换📋 参考替代料（不在目录中）
5AGXMA3D4F31I3N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5AGXMA3D4F31I5N 最大额定值与电气特性
| Family | Arria V GX |
| Logic Elements (LE) | 156000 |
| Logic Array Blocks (LABs) | 5890 |
| Total RAM Bits | 11746304 |
| User I/O Count | 416 |
| Operating Frequency (max) | 622 MHz |
| Process Technology | 28 nm CMOS |
| Core Voltage | 1.1 V |
| Package Type | 896-ball FCBGA (PBGA896) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +100C (industrial, I5 speed grade) |
| Speed Grade | I5 |
| RoHS 状态 | RoHS Compliant |
| Hard IP | PCIe Gen2 endpoint |
5AGXMA3D4F31I5N 896-ball fcbga (pbga896) 引脚配置指南
5AGXMA3D4F31I5N（896-ball fcbga (pbga896) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5AGXMA3D4F31I5N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5AGXMA3D4F31I5N 适用于 6 应用s: 10G Ethernet Aggregation Switch, Wireless CPRI/OBSAI Fronthaul, Broadcast Video Processing (3G-SDI), PCI Express Endpoint Card, Industrial Test and Measurement, Military/Aerospace Embedded Systems.
10G Ethernet Aggregation Switch
The 5AGXMA3D4F31I5N fits 10G Ethernet aggregation switches with 156000 logic elements and high-speed serial transceivers sufficient for four SFP+ ports running 10.3125 Gbps. Engineers use the hard PCIe Gen2 endpoint to attach a host CPU while dedicating FPGA fabric to L2/L3 forwarding. Industrial temperature grade supports outdoor cabinet deployments.
推荐
Wireless CPRI/OBSAI Fronthaul
The 5AGXMA3D4F31I5N serves CPRI fronthaul baseband processing with 416 user I/Os supporting CPRI line rates up to 9.8304 Gbps. Its 28nm Arria V GX fabric delivers real-time RE/MAP processing for LTE and 5G NR radio units. Industrial temperature grade meets outdoor radio unit thermal requirements.
推荐
Broadcast Video Processing (3G-SDI)
The 5AGXMA3D4F31I5N handles broadcast video pipelines processing 3G-SDI at 2.97 Gbps per link with up to 36 transceivers supporting multiple SDI streams simultaneously. The 11746304-bit embedded RAM buffers frame-rate conversion look-up tables, while 5890 LABs handle chroma/luma processing. I5 speed grade is adequate for 1080p60 processing.
推荐
PCI Express Endpoint Card
The 5AGXMA3D4F31I5N's integrated PCIe Gen2 hard IP makes it a natural choice for accelerator and DSP PCIe cards with x4/x8 lane configurations at 5 Gbps. The 156K LE fabric hosts user-defined accelerators while the hard IP handles the PCIe protocol stack. 416 user I/Os expose expansion headers for custom daughter cards.
推荐
Industrial Test and Measurement
The 5AGXMA3D4F31I5N powers industrial oscilloscopes and signal analyzers requiring 156K LE for waveform DSP and 416 I/Os for parallel ADC/DAC interconnects. Industrial temperature grade supports factory-floor deployments. The 1.1V core with low-power I5 grade keeps chassis thermal load manageable in fanless instruments.
推荐
Military/Aerospace Embedded Systems
The 5AGXMA3D4F31I5N's industrial -40C to +100C temperature range and ruggedized 896-FCBGA package suit it for avionics, naval, and ground-vehicle embedded computing platforms. The 156000 logic elements host MIL-1553, ARINC 429, and custom signal-processing IP. Intel's long-life-cycle program supports defense programs exceeding 10 years.
推荐
推荐产品汇总
工程参考数据： 5AGXMA3D4F31I5N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5AGXMA3D4F31I5G | 5AGXMA3D4F31C5N | 5AGXMA5D4F31C5N | 5AGXMA1D4F31C5N |
|---|---|---|---|---|---|
| Package | 896-FCBGA (PBGA896) | 896-FCBGA - same | 896-FCBGA - same | 896-FCBGA - same | 896-FCBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 156000 | 156000 - identical | 156000 - identical | higher (MA5) | lower (MA1) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Commercial (0C to +85C) | Commercial | Commercial |
| Speed Grade | I5 (slowest industrial) | I5 - identical | C5 - commercial speed | C5 - commercial speed | C5 - commercial speed |
| RoHS Compliance | Yes (N suffix) | No (G suffix = leaded) | Yes | Yes | Yes |
| User I/O Count | 416 | 416 - identical | 416 - identical | 416 - identical | 416 - identical |
| Core Voltage | 1.1 V | 1.1 V - identical | 1.1 V - identical | 1.1 V - identical | 1.1 V - identical |
关键差异点
- Industrial temperature grade with same silicon footprint （对比 5AGXMA3D4F31C5N)
- RoHS-compliant solder balls （对比 5AGXMA3D4F31I5G)
- Lowest-power Arria V GX speed grade （对比 5AGXMA3D4F31I3N)
设计说明
Estimated: The 896-FCBGA package requires a 31mm x 31mm BGA land pattern with 1.0mm ball pitch. Stack microvias directly under BGA pads; use a 4-6 layer stack-up with dedicated GND and 1.1V power planes. Trace length matching to within 150 mil between byte lanes; use 100-ohm differential pairs for transceiver channels with continuous reference planes for the entire lane length.
The 5AGXMA3D4F31I5N requires five decoupling rails (0.9V, 1.1V, 1.8V, 2.5V, 3.3V) plus PLL analog supplies. Place a 100uF bulk capacitor per rail within 25mm of the package, with 0.1uF and 1uF ceramics within 2mm of each power pin. Estimated idle power at I5 grade is approximately 3-5W, scaling to 8-12W at full transceiver utilization.
Estimated: At full transceiver load (24 lanes at 6 Gbps) and 100% logic utilization, junction temperature may approach 95C with standard FR-4 thermal vias. Use 0.5mm thermal-via pitch under the central die flag and at least 4 thermal vias per BGA pad in the inner array. Add a heat spreader (31mm x 31mm copper) bonded to the package lid for industrial deployments.
Group transceivers in adjacent banks to minimize routing congestion; reserve bank 3A and 3B for 1.5V/1.8V LVDS and bank 7/8 for high-speed serial. Place reference clocks within 25mm of dedicated clock input pins with controlled-impedance routing (50-ohm SE, 100-ohm diff).
合规信息
RoHS compliance per distributor listings (N suffix = lead-free). AEC-Q100 not applicable - FPGAs are not automotive-qualified at this family. REACH and conflict-mineral declarations available from Intel product compliance portal.
