5CGXBC7D6F31C7N - Cyclone V GX FPGA, 149.5K LE, 896-FBGA | Intel
料号： 5CGXBC7D6F31C7N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $480 | $480.00 |
| 10 | $432 | $4,320.00 |
| 100 | $384 | $38,400.00 |
| 500 | $345 | $172,500.00 |
| 1,000 | $312 | $312,000.00 |
5CGXBC7D6F31C7N 概述
An FPGA (field-programmable gate array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, dedicated DSP blocks, and on-chip memory that the designer can program after manufacture. Within the broader hierarchy, FPGAs sit alongside CPUs, GPUs, and ASICs as reconfigurable compute fabrics; the Cyclone V family specifically targets cost- and power-sensitive applications requiring moderate logic density and integrated transceivers.
The 5CGXBC7D6F31C7N differentiates itself through 8 integrated transceivers supporting protocols such as PCIe Gen2 and Gigabit Ethernet, 156 18x18 multipliers for DSP workloads, and hard IP for memory controllers (DDR3, LPDDR2). It also integrates hard PCI Express Gen2 controllers and a Hard Memory Controller block, eliminating soft-IP overhead and reducing FPGA logic utilization. The 1.1 V core combined with the 28 nm process typically yields 40-60% lower power than the previous-generation Cyclone IV family at equivalent performance.
Architecturally the device pairs the FPGA fabric with embedded transceiver channels, PLLs, and dedicated PCIe Gen2 IP blocks. Designers access the silicon through Intel Quartus Prime, which provides synthesis, place-and-route, timing analysis, and embedded software toolchains. The 896-pin FBGA package uses Intel's 31 mm × 31 mm FineLine BGA outline, with 1.0 mm ball pitch enabling PCB escape routing with standard 4-layer stack-ups.
Typical deployments include industrial video-processor bridges, machine-vision frame grabbers, motor-control and factory-automation platforms, software-defined radio front ends, and low-cost line cards requiring 1G/10G aggregation. The 480 user I/Os make the device attractive for I/O-intensive aggregator and protocol-conversion designs.
When designing with the 5CGXBC7D6F31C7N, allocate at least four PCB layers for power, ground, and two high-speed signal layers, and place 100 µF + 1 µF + 0.1 µF decoupling groups within 5 mm of each supply pin. Quartus Prime power analysis should be run against the post-fit netlist to verify junction temperature against the -40 °C to +85 °C commercial ambient range.
直接替换替代料： 5CGXBC7D6F31C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CGXBC7D6F31C7N （相同外形与封装尺寸） ——差异在于 Package, Transceivers, Family, Operating Temperature, PLLs.
快速对比工具——选择替代料号进行并排对比：
5CGXBC7D6F27C7N
✅ 直接替换✓ 有现货
$261.55 / 个
查看数据手册 →5CGXBC7C7F23C8N
✅ 直接替换✓ 有现货
$29.7 / 个
查看数据手册 →5CGXBC7B7M15C8N
✅ 直接替换✓ 有现货
$149 / 个
查看数据手册 →5CGXBC7C7U19C8N
✅ 直接替换✓ 有现货
$76.8 / 个
查看数据手册 →5CGXFC7C7F23C8G
✅ 直接替换📋 参考替代料（不在目录中）
5CGXBC7D6F31C7N 最大额定值与电气特性
| Series | Cyclone V GX |
| Family | Cyclone® V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory | 7,880,704 bits |
| User I/O Count | 480 |
| Transceivers | 8 channels up to 3.125 Gbps (6.144 Gbps capable) |
| DSP Blocks | 156 (18x18 multipliers) |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| 封装 | 896-BGA (FineLine BGA, F31) |
| Package Outline | 31 mm × 31 mm |
| Ball Pitch | 1.0 mm |
| 安装类型 | Surface Mount |
| 工作温度 | 0°C to +85°C (Commercial) |
| Hard IP | PCIe Gen2 ×1/×2/×4, DDR3/LPDDR2 controller |
| RoHS 状态 | Compliant |
5CGXBC7D6F31C7N 31 mm × 31 mm 引脚配置指南
5CGXBC7D6F31C7N（31 mm × 31 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CGXBC7D6F31C7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CGXBC7D6F31C7N 适用于 6 应用s: Industrial Machine Vision Frame Grabber, Industrial Motor Control and Factory Automation, Software-Defined Radio Front End, Video Broadcast Aggregation and Routing, IoT Gateway and Edge Compute, Test and Measurement Instrumentation.
Industrial Machine Vision Frame Grabber
The 5CGXBC7D6F31C7N fits machine-vision frame-grabber designs thanks to its 480 user I/Os that ingest parallel Camera Link or CoaXPress streams and its integrated transceivers that serialize the data at up to 3.125 Gbps per channel. With 7.88 Mbit of embedded SRAM, designers can implement 2-3 line buffers directly in the fabric without external memory for sub-megapixel pipelines; for higher resolution, the hard DDR3 controller (up to 800 MT/s) connects directly to a 16-bit-wide DRAM. The 28 nm low-power process keeps total FPGA power below 5 W typical, so a fanless industrial enclosure is feasible. Compared with a soft-IP implementation, the hard PCIe Gen2 controller offloads protocol state to silicon, freeing roughly 10K LEs for vision preprocessing such as Bayer demosaicing or edge detection.
推荐
Industrial Motor Control and Factory Automation
Cyclone V GX devices are widely deployed in industrial servo drives and PLCs. The 5CGXBC7D6F31C7N offers 156 18x18 multipliers, enough to implement field-oriented control (FOC) loops for two-quadrant motor control at 32 kHz PWM. Its PCIe Gen2 hard IP supports EtherCAT and PROFINET slave interfaces via companion ASICs or ASSPs over PCIe. With 480 user I/Os, designers can integrate encoder feedback (incremental, BiSS, SSI, EnDat), PWM outputs, and field-bus interfaces without external logic. Quartus Prime's Qsys integration tool simplifies stacking real-time IP, and the -40°C to +85°C industrial temperature range handles typical factory-floor thermal stress.
推荐
Software-Defined Radio Front End
For software-defined radio front-end applications, the 5CGXBC7D6F31C7N's 8 transceivers (each up to 3.125 Gbps) can digitize multiple IF bands simultaneously and route digital samples to a host processor over PCIe Gen2 ×4. The 7.88 Mbit embedded SRAM buffers short packet bursts while the hard PCIe engine handles DMA handshakes. With 149.5K LEs and 156 multipliers, designers can implement digital down-conversion (DDC), FIR filtering, and FFT blocks directly in fabric. The 28 nm low-power process keeps power dissipation manageable in fanless tower designs. Compared to pure-software SDR, the FPGA offloads DSP tasks and reduces host CPU load by an order of magnitude.
推荐
Video Broadcast Aggregation and Routing
The 5CGXBC7D6F31C7N suits broadcast video aggregation routers that ingest SDI (HD/3G-SDI) streams and re-route them across IP networks. Its 480 I/Os accommodate many parallel SDI inputs, and its transceivers feed 10G Ethernet or SMPTE 2022/2059 IP pipes. The hard DDR3 controller buffers frames before transmission, and 156 DSP blocks handle video scaling and color-space conversion. Designers using the Quartus Prime Pro design suite can leverage the Video and Image Processing (VIP) suite for high-throughput pipelines. Power consumption stays around 4-6 W for moderate channel counts, allowing 1U rackmount aggregation appliances.
推荐
IoT Gateway and Edge Compute
The 5CGXBC7D6F31C7N is ideal for industrial IoT gateways that aggregate sensor data from multiple fieldbuses (Modbus, CAN, RS-485) and publish to cloud backends. With 480 user I/Os, the FPGA can host multiple UART, SPI, and I2C bridges simultaneously while running TLS acceleration in soft logic. The transceivers support cellular modem links via SPI-to-LTE bridges, and the hard PCIe Gen2 IP connects to an ARM- or x86-based application processor. The 1.1 V core voltage combined with 28 nm process keeps idle power around 0.5-1 W, well within thermal envelope for fanless DIN-rail mount enclosures.
推荐
Test and Measurement Instrumentation
The 5CGXBC7D6F31C7N is well matched to test-and-measurement equipment such as protocol analyzers, oscilloscope capture boards, and logic-analyzer heads. With 480 I/Os and 7.88 Mbit memory, designers can implement deep trace buffers or pattern generators. The hard PCIe Gen2 interface transfers captured data to host PC at line rate, while the integrated transceivers support high-speed serial protocols (USB 3.0, SATA, PCIe). Quartus Prime's signal-tap logic analyzer simplifies debug, and the device's deterministic fabric latency aids time-correlated measurements. Compared with off-the-shelf microcontrollers, the FPGA handles parallel multi-channel acquisition where CPUs would bottleneck.
推荐
推荐产品汇总
工程参考数据： 5CGXBC7D6F31C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CGXBC7D6F27C7N | 5CGXBC7C7F23C8N | 5CGXBC7B7M15C8N | 5CGXBC7C7U19C8N | 5CGXFC7C7F23C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (F31, 31x31 mm, 1.0 mm pitch) | BGA (F27) | 484-FBGA (F23) | 484-μBGA (M15) | 484-uBGA (U19) | 484-FBGA (F23) |
| Logic Elements | 149,500 | 149,500 | 149,500 | 149,500 | 149,500 | 149,500 |
| Embedded Memory (bits) | 7,880,704 | 7,880,704 | 7,880,704 | 7,880,704 | 7,880,704 | 7,880,704 |
| Speed Grade | -7 (commercial) | -7 | -8 | -8 | -8 | -8 |
| Family Tier | Cyclone V GX | Cyclone V GX | Cyclone V GX | Cyclone V GX | Cyclone V GX | Cyclone V GT |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Highest user I/O count in Cyclone V GX F31 family （对比 5CGXBC7D6F27C7N)
- Cyclone V GX tier with integrated transceivers （对比 5CEFA9F27C7N)
- Modern 28 nm low-power process node （对比 10M50SAE144C8G)
设计说明
The 5CGXBC7D6F31C7N requires multiple supply rails: 1.1 V VCCINT (core), 1.1 V/1.2 V/2.5 V VCC (I/O banks depending on standard), 2.5 V VCCAUX, and 1.5 V VCCPD. Place a 100 µF bulk + 1 µF + 0.1 µF decoupling group within 5 mm of each supply pin, and ensure the ground plane under the BGA is contiguous. Use Intel's PowerPlay Early Power Estimator (EPE) in Quartus Prime to size regulators and compute worst-case power before committing to PCB stack-up.
Estimated: at the published TJ_max of 100 °C, θ_JA of the 31 mm × 31 mm F31 BGA package is roughly 8 °C/W with a JEDEC JESD51 test board (per Intel package thermal characterization). At a typical 5 W design power, junction temperature rises ~40 °C above ambient; a fanless industrial design requires either a heatsink or substantial PCB copper flooding. Always validate using the post-fit power report from Quartus Prime rather than pre-fit estimates.
The 896-ball F31 FineLine BGA uses 1.0 mm ball pitch. To escape cleanly on a 4-layer PCB, use 4 mil (0.1 mm) trace and space with the via-in-pad technique. Place 8+ thermal vias beneath the central die-up BGA balls to conduct heat to the inner ground plane. Maintain a continuous reference plane under high-speed transceiver channels to control impedance (100 Ω differential ±10%). For multi-gigabit links, keep the transceiver traces shorter than 50 mm and use Micron-class pre-emphasis settings as defined by the Cyclone V GX transceiver user guide.
Common pitfalls with this device: (1) ignoring VCCPD requirements - the 1.5 V pre-driver supply must ramp with or before VCCINT to prevent I/O latch-up; (2) omitting the MSEL configuration pin strapping resistors - the FPGA will fail to configure if MSEL is wrong; (3) using a JTAG programmer without verifying the chain - always include a header for the Intel USB-Blaster II; (4) forgetting to hold nCONFIG low during power-up until supplies stabilize; (5) under-estimating configuration time from large EPCQ flash devices - budget 100+ ms for full configuration.
合规信息
RoHS compliant per Altera/Intel product page; lead-free PBGA packaging. AEC-Q100 not applicable - FPGAs are typically not AEC-Q100 qualified; select the 'I' temperature-suffix variants for industrial and 'A' suffix for automotive-grade screening if required.
