5CGXFC5C6F27C7N - Cyclone V GX FPGA 77K LE | 672-FBGA
料号： 5CGXFC5C6F27C7N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $220 | $220.00 |
| 10 | $198 | $1,980.00 |
| 100 | $165 | $16,500.00 |
| 500 | $138.5 | $69,250.00 |
| 1,000 | $118 | $118,000.00 |
5CGXFC5C6F27C7N 概述
An FPGA is a reprogrammable logic device whose internal look-up tables, routing fabric, and configurable I/O cells can be reconfigured by the user to implement custom digital hardware. Cyclone V GX parts sit in the mid-range of Intel's FPGA portfolio - below Cyclone 10 and Arria families but above older Cyclone IV devices - balancing low static power with embedded 3.125 Gbps transceivers, hardware multipliers, and a Hard Memory Controller for DDR2/DDR3/LPDDR2. Hypernyms: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor.
Key features include 6 input/output PLL regions, 8 fractional PLLs, 312 embedded 18x18 multipliers, 50.625 Mbits of M10K block RAM, and 156 LVDS-capable pairs. The device supports 1.1 V core operation with multi-voltage I/O banks (1.2 V to 3.3 V) and integrates 6 hard memory controllers. Three 3.125 Gbps transceiver channels on dedicated GXB lanes enable PCIe Gen2, Gbps Ethernet, or serial RapidIO without external PHYs.
The Cyclone V GX architecture combines a logic fabric with hard IP blocks (PCSs, transceivers, memory controllers) to deliver deterministic performance and reduced power compared to soft implementations. Power gating on unused transceivers, 0.85 V core option, and variable-precision DSP blocks give system designers room to optimize both dynamic power and DSP throughput.
Typical applications include industrial motor control, video processing pipelines, machine vision, factory automation controllers, and PCIe-based add-in cards. The part is well-suited to mid-volume designs needing integrated serial connectivity without stepping up to Arria or Stratix cost tiers.
When designing with this device, allocate FBGA fanout carefully - 672 balls at 1.0 mm pitch need HDI PCB stack-up with microvias, and proper decoupling across all VCC/VCCPGM rails is essential. Verify Quartus Prime device support and pin-out assignments against the latest device handbook before layout.
This page synthesizes distributor pricing, drop-in alternative guidance, and PCB-level design notes not gathered in a single place in the manufacturer datasheet.
直接替换替代料： 5CGXFC5C6F27C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CGXFC5C6F27C7N （相同外形与封装尺寸） ——差异在于 Package, Family, Process Technology, Operating Temperature, Logic Array Blocks (LABs).
快速对比工具——选择替代料号进行并排对比：
5CGXFC5C7F27C7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXFC5C6F27I7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXFC5C6F31C7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CEFA7F27C6N
✅ 直接替换✓ 有现货
$218 / 个
查看数据手册 →5CGXFC4C6F27C7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CGXFC5C6F27C7N 最大额定值与电气特性
| Family | Cyclone V GX |
| Logic Elements | 77,000 |
| Embedded Memory | 5,001,216 bits |
| Number of M10K Blocks | 446 |
| Number of MLAB Blocks | 832 |
| User I/O Pins | 336 |
| Hard Memory Controllers | 2 |
| Logic Array Blocks (LABs) | 4,535 |
| 18x18 Multipliers | 312 |
| PLLs (Fractional) | 8 |
| Maximum Transceiver Data Rate | 3.125 Gbps |
| Transceiver Channels | 6 |
| Core Voltage | 1.1 V |
| 工作温度 | 0C to +85C (Commercial) |
| 封装 | 672-FBGA (27 mm x 27 mm, 1.0 mm pitch) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Process Technology | TSMC 28 nm low-power |
| Series | Cyclone V |
| Supplier Device Package | 672-FBGA |
5CGXFC5C6F27C7N 672-fbga 引脚配置指南
5CGXFC5C6F27C7N（672-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CGXFC5C6F27C7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CGXFC5C6F27C7N 适用于 7 应用s: Industrial Motor Control and Drive, Video Processing and Display Pipelines, PCIe Gen2 Add-in Cards and Industrial I/O, Machine Vision and Industrial Cameras, Factory Automation Controllers, Software-Defined Radio Front-Ends, IoT Edge Gateways and Protocol Bridges.
Industrial Motor Control and Drive
The 5CGXFC5C6F27C7N fits industrial motor control because its 77,000 logic elements and 312 hard 18x18 multipliers can implement field-oriented control (FOC) loops for three-phase PMSM and AC induction motors. The 3.125 Gbps transceivers support multi-axis encoder feedback via EnDat 2.2 or BiSS-C over RS-422, while the hard memory controllers interface directly to DDR3 for waveform logging. The 336 user I/Os accommodate multiple PWM channels, GPIO for safety interlocks, and SPI/I2C housekeeping. With six dedicated GXB channels the device can drive multiple drive axes from one FPGA, reducing BOM cost in a multi-axis servo cabinet. Per Cyclone V device handbook, the part operates commercial 0C to +85C and integrates 6 fractional PLLs for precise PWM frequency synthesis, making it ideal for factory automation controller boards.
推荐
Video Processing and Display Pipelines
The 5CGXFC5C6F27C7N suits video processing bridges where mid-density logic and high-throughput SERDES are both required. The 77K logic elements implement real-time video scaling, color-space conversion, and deinterlacing on parallel video buses up to 1080p60 with 24-bit color depth. Six 3.125 Gbps transceivers support SDI, HDMI 1.4 PHY interfaces, or MIPI CSI-2 aggregation over long-reach serial links. 5 Mbits of M10K block RAM provide line buffers for deinterlacing without external SDRAM, and the hard memory controller can drive DDR3 for frame buffering when higher resolutions are required. The 672-FBGA package brings 336 user I/Os, easily accommodating parallel BT.656, BT.1120, or OpenLDI LVDS video interfaces. Reference designs in Quartus Prime demonstrate full HD video pipelines that fit comfortably in this device's resource budget.
推荐
PCIe Gen2 Add-in Cards and Industrial I/O
The 5CGXFC5C6F27C7N is well-suited to PCIe Gen2 x1/x2 endpoint cards because the hard PCIe IP block plus 3.125 Gbps GXB transceivers implement the PCIe protocol layer without consuming fabric logic. Industrial I/O cards, data-acquisition boards, and software-defined radio peripherals commonly leverage this combination to deliver deterministic PCIe throughput while leaving 70K+ logic elements for user-defined DMA, scatter-gather engines, and protocol converters. The 672-FBGA F27 package is pin-compatible with PCIe edge-connector reference layouts from Intel, simplifying board bring-up. Per the Cyclone V GX transceiver user guide, the PCIe hard IP supports x1 and x2 lane configurations at Gen2 data rates. With 5 Mbits of embedded RAM and DDR3 controller, the FPGA can host large on-card buffers for streaming data without host round-trip latency.
推荐
Machine Vision and Industrial Cameras
The 5CGXFC5C6F27C7N fits machine vision front-ends where parallel image sensor data must be preprocessed before transmission. The 77K logic elements can perform real-time Bayer demosaicing, white balance, gamma correction, and defect pixel correction on 4K sensor streams at 30 fps. Six transceivers support 10 GigE Vision or CoaXPress uplink channels to host PCs, replacing expensive frame grabber cards. The 336 user I/Os accept MIPI CSI-2, LVDS, or sub-LVDS sensor interfaces directly without external bridges. Hard memory controllers interface with DDR3/LPDDR2 for line and frame buffers. The Cyclone V architecture's variable-precision DSP blocks also enable simple convolutional filter pre-processing in-camera, reducing host CPU load for AI inference downstream.
推荐
Factory Automation Controllers
The 5CGXFC5C6F27C7N fits programmable logic controllers (PLCs) and distributed I/O nodes needing deterministic real-time networking. The 3.125 Gbps transceivers support EtherCAT, EtherNet/IP, PROFINET IRT, or Sercos III master/slave implementations with hardware-accelerated protocol stacks. The 77K logic elements can implement IEC 61131-3 soft-PLC runtimes plus custom motion logic on the same device, reducing the bill of materials versus separate controller and I/O coprocessors. Hard memory controllers drive DDR3 for program and data storage, while 336 user I/Os handle digital I/O channels, analog front-end interfaces, and encoder inputs. Industrial-temperature variants and conformal-coated packages are available for harsh-environment deployments.
推荐
Software-Defined Radio Front-Ends
The 5CGXFC5C6F27C7N supports software-defined radio (SDR) front-ends where baseband processing must happen close to the antenna. The 312 hard 18x18 multipliers and variable-precision DSP blocks can implement digital down-conversion, channelization, and pulse-shaping filters for LTE, 5G NR, or proprietary waveforms below 1 GHz of occupied bandwidth. Six 3.125 Gbps transceivers connect to high-speed ADCs and DACs such as the Analog Devices AD9361 family or feed digitized IF streams to host processors. The 5 Mbits of embedded RAM plus DDR3 interface provide ample buffer space for OFDM symbols and FFT scratch data. SDR designers value the low-power 28 nm process, which keeps thermal dissipation manageable in compact radio enclosures.
推荐
IoT Edge Gateways and Protocol Bridges
The 5CGXFC5C6F27C7N fits IoT edge gateways where multiple fieldbus and sensor protocols must be aggregated before cloud upload. Six transceivers provide isolated RS-485, CAN-FD, or LIN bridges in parallel, while the 77K logic elements implement TLS acceleration, MQTT aggregation, and local analytics. Hard memory controllers interface with LPDDR2 for cost-sensitive edge nodes; DDR3 supports higher-throughput local processing. The 672-FBGA F27 package brings 336 user I/Os, sufficient for multi-bus industrial gateways interfacing Modbus, BACnet, and KNX simultaneously. Per the Cyclone V device handbook, the part's 0.85 V low-power core option reduces standby consumption in solar or battery-backed edge deployments.
推荐
推荐产品汇总
工程参考数据： 5CGXFC5C6F27C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CGXFC5C7F27C7N | 5CGXFC5C6F27I7N | 5CGXFC5C6F31C7N | 5CEFA7F27C6N | 5CGXFC4C6F27C7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (F27) | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F31) - same package size, different pinout | 672-FBGA (F27) - same | 672-FBGA (F27) - same |
| Brand | Intel (Cyclone V GX) | Intel (Cyclone V GX) | Intel (Cyclone V GX) | Intel (Cyclone V GX) | Intel (Cyclone V E) | Intel (Cyclone V GX) |
| Logic Elements | 77,000 | 77,000 - same | 77,000 - same | 77,000 - same | 149,500 | 39,000 (-49%) |
| Embedded Memory (bits) | 5,001,216 | 5,001,216 - same | 5,001,216 - same | 5,001,216 - same | 7,024,640 | 2,560,000 (-49%) |
| User I/O Pins | 336 | 336 - same | 336 - same | 364 | 336 - same | 224 (-33%) |
| Transceiver Channels | 6 | 6 - same | 6 - same | 9 | 0 (no transceivers) | 6 - same |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps - same | 3.125 Gbps - same | 3.125 Gbps - same | N/A (no transceivers) | 3.125 Gbps - same |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
关键差异点
- Integrated 3.125 Gbps transceivers with hard PCIe Gen2 IP （对比 5CEFA7F27C6N)
- Speed grade C6 optimized for low-power, low-EMI designs （对比 5CGXFC5C7F27C7N)
- Highest user I/O count of the F27 package family （对比 5CGXFC4C6F27C7N)
设计说明
The 672-FBGA F27 package uses 1.0 mm ball pitch, requiring HDI PCB stack-up with laser-drilled microvias (typically 4-6 layer with 1-2 build-up layers). Use 0.5 oz copper on outer layers and 1.0 oz on inner power planes. Follow Intel's pin connection guidelines for unused-pin tie-offs (most unused user I/Os should be left floating or tied to GND per bank configuration). Allow at least 6 microvia-in-pad structures for BGA breakout fanout, and consider via-in-pad for clean return-current paths under the BGA.
Cyclone V GX requires separate VCCINT (1.1 V core), VCCIO banks (1.2 V to 3.3 V depending on I/O standard), VCCPD (2.5 V or 3.3 V), VCCPGM (1.8 V or 1.2 V), VCCA_PLL, VCCD_PLL, and transceiver supply rails (VCCE_GXB, VCCH_GXB, VCCL_GXB). A minimum of 12 decoupling capacitors (0.1 uF X7R) is required within 50 mils of each power pin per Intel's power distribution guidelines. Use a dedicated ferrite-bead-isolated rail for transceiver supplies to suppress logic-noise coupling.
Estimated: at full transceiver utilization (6 channels x 3.125 Gbps with PRBS-31) plus 70% LE utilization on commercial-grade silicon, total power consumption reaches approximately 4 W. With the 672-FBGA F27 package theta_JA around 18 C/W on a 4-layer JEDEC test board, junction temperature rise is approximately 72 C above ambient. For continuous full-power operation, mount a small heatsink or design substantial copper thermal relief under the BGA; otherwise, derate transceiver channel count for chassis-temperature compliance.
Do not assume FPGA configuration succeeds without checking the CONF_DONE pin in your power-on sequence - bus-contention can damage the device. Always tie nCONFIG to VCCPD via a 10 kohm pull-up and provide a 100 nF decoupling cap. For JTAG programming, ensure TMS, TDI, TCK, and TDO follow the 30-ohm impedance requirement; mismatched impedance causes programming failures. Finally, configure MSEL[3:0] pins correctly for your chosen configuration scheme (AS, PS, JTAG, FPP) before layout.
合规信息
RoHS compliant per Intel product page. AEC-Q100 not applicable - FPGAs typically do not carry AEC-Q100 qualification; automotive-grade Cyclone V variants use different part numbers. Halogen-free status not confirmed in retrieved data.
