ATSAM3S1AB-MUR - 64MHz Cortex-M3 64KB Flash MCU | Microchip
料号： ATSAM3S1AB-MUR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.92 | $3.92 |
| 10 | $3.53 | $35.30 |
| 100 | $3.15 | $315.00 |
| 500 | $2.86 | $1,430.00 |
| 1,000 | $2.61 | $2,610.00 |
ATSAM3S1AB-MUR 概述
A microcontroller (MCU) is an integrated circuit that combines a processor core, program memory, data memory, and peripherals such as timers, serial interfaces, and analog-to-digital converters on a single chip. Within the embedded-systems hierarchy, the SAM3S family sits in the ARM Cortex-M3 class of 32-bit microcontrollers, positioned above 8-bit MCUs like the PIC16 line and optimized for cost-sensitive, medium-performance control and connectivity tasks.
Key features include the high-performance Cortex-M3 core with nested vectored interrupt controller, single-cycle hardware multiply and divide, operating from a supply range of 1.62 V to 3.6 V. The SAM3S1A series integrates peripheral DMA on the PIOs, allowing parallel data capture from devices not compliant with standard memory-read protocols, such as low-cost image sensors, with DMA offloading the CPU. The device is available in 48-pin QFP and QFN packages and is pin-to-pin compatible with the SAM3N1A family, providing a migration path.
Technically, the SAM3S1AB operates in industrial temperature ranges, and its 48-VFQFN exposed-pad package provides thermal and grounding advantages: the exposed pad soldered to the PCB ground plane reduces junction-to-ambient thermal resistance and improves signal integrity and EMI performance versus leaded packages.
Typical applications include consumer and industrial human-machine interfaces, sensor data acquisition with parallel capture and DMA, low-power portable devices, and embedded control in metering and building automation.
Design consideration: keep the exposed thermal pad connected to a solid ground pour with multiple vias, as it is both the primary ground return and thermal path.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： ATSAM3S1AB-MUR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAM3S1AB-MUR （相同外形与封装尺寸） ——差异在于 RoHS Status, Flash Memory, Package, Packaging, Pin Compatibility.
快速对比工具——选择替代料号进行并排对比：
ATSAM3N1AB-MU
✅ 直接替换✓ 有现货
$2.98 / 个
查看数据手册 →ATSAM3S2AA-MUR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.49 / 个
查看数据手册 →ATSAM3S4AA-MUR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.85 / 个
查看数据手册 →ATSAM3N4BA-MU
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.48 / 个
查看数据手册 →ATSAM3S1AB-MUR 最大额定值与电气特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit Single-Core |
| 最大时钟频率 | 64 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| 封装 | 48-QFN (7x7 mm) with Exposed Pad |
| Package Code | HVQCCN (48-VFQFN Exposed Pad) |
| 安装类型 | Surface Mount |
| Temperature Grade | Industrial |
| DMA | Peripheral DMA, PIO parallel data capture mode |
| Pin-to-Pin Compatibility | Compatible with SAM3N1A family |
| Product Family | SAM3S |
| Packaging | Tape & Reel (MRL B) |
| RoHS 状态 | Compliant (Green) |
ATSAM3S1AB-MUR hvqccn (48-vfqfn exposed pad) 引脚配置指南
ATSAM3S1AB-MUR（hvqccn (48-vfqfn exposed pad) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAM3S1AB-MUR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAM3S1AB-MUR 适用于 6 应用s: Low-Cost Image Sensor Data Acquisition, Industrial Control and Automation, Portable and Battery-Powered Devices, Metering and Building Automation, Human-Machine Interface (HMI) Panels, Embedded Sensor Nodes and IoT Endpoints.
Low-Cost Image Sensor Data Acquisition
The ATSAM3S1AB-MUR fits imaging subsystems because its PIO controller offers a dedicated parallel data capture mode for external devices that do not follow standard memory-read protocols, exactly the interface style of low-cost CMOS image sensors. According to Microchip's product page, the integrated DMA controller moves captured frames into SRAM without CPU intervention, so a 64 MHz Cortex-M3 can sustain modest frame rates while still running processing or communication tasks. In a typical design, the sensor's pixel clock and line signals drive the PIO capture port, and DMA fills buffers in the 16 KB SRAM in ping-pong fashion. Because the part runs from a single 1.62 V to 3.6 V supply, it can share the sensor's 3.3 V rail directly. The trade-off is the modest 16 KB SRAM, which limits buffer depth and suits low-resolution sensors rather than high-resolution video.
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Industrial Control and Automation
The ATSAM3S1AB-MUR suits industrial control nodes because it combines a deterministic 64 MHz ARM Cortex-M3 core with industrial temperature grade qualification, allowing deployment on factory floors where ambient temperatures exceed commercial limits. The 64 KB Flash accommodates modbus-style communication stacks, PID control loops, and state machines with headroom, while the 48-pin QFN (7x7 mm) footprint keeps board area compact in dense control modules. Peripheral DMA offloads routine data movement such as ADC sample buffering and UART receive, keeping interrupt latency low for time-critical control tasks. The exposed-pad QFN provides robust grounding that improves EMI robustness in electrically noisy environments with motors and contactors. With a 1.62 V to 3.6 V supply range, designers can power it from industrial 3.3 V rails derived from 24 V buses. Firmware migration within the pin-compatible SAM3S/SAM3N families lets product variants reuse one PCB layout.
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Portable and Battery-Powered Devices
The ATSAM3S1AB-MUR is a strong fit for portable battery-powered products because it operates from 1.62 V to 3.6 V, allowing direct operation from a single lithium cell across its discharge curve without a regulator. The 64 MHz Cortex-M3 delivers ample processing for user interfaces, and the SAM3S family provides low-power modes that are entered and exited via the interrupt controller for duty-cycled operation. The compact 48-pin QFN (7x7 mm) with exposed pad saves PCB area in handheld enclosures, and the exposed pad doubles as thermal path in sealed housings with no airflow. Peripheral DMA reduces CPU wake-ups, which lowers average current draw when streaming sensor data into SRAM. Designers should budget for the 16 KB SRAM when sizing display frame buffers, or step to the same-footprint ATSAM3S2AA-MUR when more RAM or Flash is needed without redesigning the board.
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Metering and Building Automation
For energy metering and building automation nodes, the ATSAM3S1AB-MUR provides the balance of compute, memory, and peripherals these applications demand. The 64 KB Flash holds metering firmware, communication protocols, and calibration tables, while the 64 MHz Cortex-M3 core with single-cycle multiply/divide accelerates RMS and energy accumulation math. Peripheral DMA keeps ADC sampling and UART metering-bus communication running without CPU load, preserving timing accuracy. The industrial temperature grade supports rooftop, basement, and outdoor enclosure installations where commercial parts would be marginal. The 48-pin QFN exposed-pad package improves ground integrity for sensitive analog front ends in noisy switch-mode environments, and the 1.62 V to 3.6 V supply range tolerates battery-backed operation during mains failures. Pin-to-pin family compatibility across the SAM3S line lets metering vendors scale Flash and SRAM per product tier with a single PCB.
推荐
Human-Machine Interface (HMI) Panels
The ATSAM3S1AB-MUR works well in HMI panels and user-interface controllers because its 64 MHz Cortex-M3 core can drive segment or small graphic displays, scan keypads, and manage touch or rotary inputs simultaneously. The PIO parallel capture with DMA offloads input scanning and data routing, keeping the CPU available for menu logic and communication. The 48-pin QFN (7x7 mm) provides enough GPIO for display buses, backlight PWM, buzzer, and multiple encoder inputs while keeping the controller footprint small behind the panel. Industrial temperature rating makes it suitable for appliances, POS terminals, and machinery fascias. Its 64 KB Flash is sufficient for icon-based UIs with localization tables; graphics-heavy designs can migrate to the same-footprint ATSAM3S4AA-MUR with 256 KB Flash without PCB changes. The wide 1.62 V to 3.6 V supply simplifies power design in 3.3 V and lithium-cell systems alike.
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Embedded Sensor Nodes and IoT Endpoints
The ATSAM3S1AB-MUR serves as the main controller in wired sensor nodes and IoT endpoints that connect via UART, SPI, or I2C to radios and sensor front ends. The 64 MHz Cortex-M3 executes protocol stacks and data filtering with margin, while peripheral DMA streams ADC samples and serial traffic into the 16 KB SRAM without CPU polling, reducing power in duty-cycled nodes. The 1.62 V to 3.6 V operating range matches lithium primary cells and 3.3 V rails, and the industrial temperature grade covers unconditioned environments. The exposed-pad 48-pin QFN delivers solid grounding for mixed analog-digital layouts typical of sensor boards. For nodes needing over-the-air update headroom or log buffering beyond 64 KB Flash and 16 KB SRAM, the pin-compatible ATSAM3S2AA-MUR and ATSAM3S4AA-MUR offer 128 KB and 256 KB Flash respectively on the identical PCB footprint, preserving the mechanical design and certification baseline.
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推荐产品汇总
工程参考数据： ATSAM3S1AB-MUR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAM3N1AB-MU | ATSAM3S2AA-MUR | ATSAM3S4AA-MUR | ATSAM3N4BA-MU |
|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) Exposed Pad | 48-QFN (7x7 mm) - same footprint | 48-QFN (7x7 mm) - same footprint | 48-QFN (7x7 mm) - same footprint | 48-QFN (7x7 mm) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Clock | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 256 KB | 256 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Peripheral DMA / PIO Parallel Capture | Yes (SAM3S feature) | No (SAM3N family) | Yes (SAM3S family) | Yes (SAM3S family) | No (SAM3N family) |
| Pin-to-Pin Compatibility | Reference part | Pin-to-pin compatible per Microchip | Same-family same-footprint | Same-family same-footprint | Same-family same-footprint |
关键差异点
- PIO parallel data capture with DMA （对比 ATSAM3N1AB-MU)
- Balanced 64 KB Flash / 16 KB SRAM at entry price （对比 ATSAM3S2AA-MUR)
- QFN exposed-pad thermal/EMI performance （对比 ATSAM3S1AB-AU (LQFP variant))
设计说明
The 48-QFN (7x7 mm) exposed pad is the device's primary ground return and thermal path. Create a dedicated ground island under the pad with an array of stitching vias (typically 5x5 or as spacing allows) connecting to the internal ground plane. Do not route signals under the pad region. Insufficient exposed-pad soldering is the most common cause of intermittent ground and elevated EMI issues with QFN microcontrollers, so ensure adequate paste aperture segmentation (typically 60-80% coverage split into multiple apertures) to prevent voiding during reflow.
Power the ATSAM3S1AB-MUR from a clean 3.3 V rail within its 1.62 V to 3.6 V operating range. Place a 0.1 uF ceramic decoupling capacitor at each VDD pin pair, as close to the pins as possible, plus one bulk capacitor of 4.7 uF to 10 uF near the device. If the board also drives an image sensor or radio, add local ferrite isolation to keep switching and RF noise off the MCU supply. Verify brown-out detector thresholds are enabled so that the 16 KB SRAM contents remain valid through supply dips.
Do not assume the ATSAM3S1AB-MUR (-MUR, 48-QFN) is interchangeable with the ATSAM3S1AB-AU (-AU, 48-LQFP): they are electrically identical but use different packages and footprints, per FindIC comparison data. Second, if substituting with the pin-compatible ATSAM3N1AB-MU to ride out shortages, remember the SAM3N lacks the SAM3S peripheral DMA parallel-capture mode; any firmware using PIO capture or DMA must be reworked. Finally, flash-programming tools must be configured for the correct SAM3S1AB device ID before mass production.
合规信息
Mouser lists the part as 'QFN, Green, IND TEMP, MRL B', indicating RoHS/Green packaging and industrial temperature grade. REACH, halogen-free, and conflict-minerals status were not stated in the provided data.
