ATSAMA5D225C-D1M-CUR - ARM Cortex-A5 MPU 500MHz 128Mbit DDR2 | Microchip
料号： ATSAMA5D225C-D1M-CUR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $22.45 | $2,245.00 |
| 500 | $19.95 | $9,975.00 |
| 1,000 | $17.8 | $17,800.00 |
ATSAMA5D225C-D1M-CUR 概述
A microprocessor (MPU) is a fully integrated CPU subsystem - core, caches, memory controller, peripherals, and external memory bus - packaged as a single IC. Unlike microcontrollers (MCUs) that embed Flash and run bare-metal or RTOS code, MPUs require external boot media (QSPI NOR, NAND, eMMC, SD card) and typically run a full operating system (Linux, Yocto, Buildroot, Android). The SAMA5D2 series occupies the upper end of industrial-grade MPUs, balancing high-level OS capability with deep-sleep current suitable for always-on battery-backed systems.
Key features include the 500 MHz Cortex-A5 with NEON media engine, integrated 128 Mbit DDR2 (16-bit data bus), peripheral touch controller, embedded audio subsystem with sample-rate converters, 0.8 mm ball pitch to simplify PCB layout, hardware cryptography (AES, SHA, TRNG), and a simple power-management scheme that supports retention and ultra-low-power modes. The device exposes multiple connectivity options including 10/100 Ethernet MAC, USB HS host/device, CAN-FD, multiple SPI/I2C/UART instances, and LCD TFT controller.
The SiP integration eliminates the DDR2 routing challenge between MPU and discrete DRAM, reducing 4-layer PCB complexity and improving signal integrity for industrial-grade EMC compliance. The 196-ball TFBGA footprint, 0.8 mm pitch, and 11x11 mm body make the part suitable for compact HMI, gateway, and edge-compute designs.
Typical applications include industrial HMI panels, IoT gateways with secure boot, smart-home controllers with touch UI, building-automation bridges, point-of-sale terminals, low-power premium consumer devices, and secure connected embedded peripherals with Yocto or Buildroot Linux.
When designing with the ATSAMA5D225C-D1M-CUR, plan a 4-layer PCB with continuous ground stitching under the BGA, follow the Microchip SAMA5D2 hardware design checklist for DDR2 termination, and ensure boot configuration straps (BMS, JTAG select) are correctly pulled for the selected boot media.
This page synthesizes distributor stock and pricing, drop-in same-package SAMA5D2 family alternatives, and practical design notes not aggregated in any single manufacturer datasheet or distributor catalog page.
直接替换替代料： ATSAMA5D225C-D1M-CUR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAMA5D225C-D1M-CUR （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, RoHS Status, Ethernet, Backup Mode Current.
快速对比工具——选择替代料号进行并排对比：
ATSAMA5D225C-D1M-CU
✅ 直接替换✓ 有现货
$12.6 / 个
查看数据手册 →ATSAMA5D21C-CUR
✅ 直接替换✓ 有现货
$11.65 / 个
查看数据手册 →ATSAMA5D21B-CU
✅ 直接替换✓ 有现货
$9.8 / 个
查看数据手册 →ATSAMA5D23B-CUR
✅ 直接替换✓ 有现货
$10.05 / 个
查看数据手册 →ATSAMA5D28B-CUR
✅ 直接替换✓ 有现货
$12.6 / 个
查看数据手册 →ATSAMA5D28B-CN
✅ 直接替换✓ 有现货
$17.95 / 个
查看数据手册 →ATSAMA5D225C-D1M-CUR 最大额定值与电气特性
| Family | SAMA5D2 Series |
| Core | ARM Cortex-A5 (32-bit, single-core) |
| Maximum CPU Clock | 500 MHz |
| Integrated Memory | 128 Mbit DDR2 SDRAM (16-bit data bus) |
| 封装 | 196-ball TFBGA, 11x11 mm, 0.8 mm pitch |
| 安装类型 | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Security | Arm TrustZone, tamper detection, secure boot, secure data storage |
| Cryptography | AES, SHA, TRNG hardware accelerators |
| Graphics | LCD TFT controller (up to 1024x768) |
| Touch Controller | Peripheral Touch Controller (PTC) |
| Audio | Embedded audio subsystem with sample-rate converters |
| Connectivity | 10/100 Ethernet MAC, USB HS Host/Device, CAN-FD, multiple SPI/I2C/UART |
| RoHS 状态 | Compliant (BGA GREEN) |
| Boot Media Supported | QSPI NOR, NAND, eMMC, SD card |
| Tape & Reel Packaging | Yes (per Mouser listing) |
ATSAMA5D225C-D1M-CUR 196-ball tfbga, 11x11 mm, 0.8 mm pitch 引脚配置指南
ATSAMA5D225C-D1M-CUR（196-ball tfbga, 11x11 mm, 0.8 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAMA5D225C-D1M-CUR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAMA5D225C-D1M-CUR 适用于 6 应用s: Industrial HMI Touch Panels, IoT Edge Gateways, Smart Home Connected Controllers, Building Automation Bridges, Secure Point-of-Sale Terminals, Connected Medical Device Peripherals.
Industrial HMI Touch Panels
The ATSAMA5D225C-D1M-CUR's 500 MHz Cortex-A5, integrated DDR2, Peripheral Touch Controller (PTC), and LCD TFT controller up to 1024x768 directly drive industrial HMI touch panels. Its 0.8 mm BGA pitch enables a 4-layer PCB, lowering enclosure and EMC compliance cost for factory-floor operator interfaces. Hardware AES and secure boot protect intellectual property and runtime integrity. Drop-in alternative ATSAMA5D21C-CUR supports LPDDR2-based low-power variants with the same PCB layout.
推荐
IoT Edge Gateways
The ATSAMA5D225C-D1M-CUR runs Yocto or Buildroot Linux and exposes 10/100 Ethernet, USB HS, and CAN-FD for protocol bridging at the edge. Its integrated DDR2 eliminates external DRAM routing for compact gateway enclosures. Hardware cryptographic accelerators (AES/SHA/TRNG) and Arm TrustZone support secure firmware updates and device identity. Use the SAMA5D2 Xplained board as a software reference platform.
推荐
Smart Home Connected Controllers
The ATSAMA5D225C-D1M-CUR's low-power architecture, peripheral touch support, embedded audio subsystem with sample-rate converters, and integrated DDR2 suit voice-assistant smart home hubs and connected appliance controllers. The industrial temperature grade supports always-on deployments in unconditioned spaces. TrustZone and secure boot prevent unauthorized firmware injection over the air.
推荐
Building Automation Bridges
The ATSAMA5D225C-D1M-CUR's CAN-FD, multiple UARTs, SPI, I2C, and 10/100 Ethernet interfaces serve as a multi-protocol bridge between BACnet, Modbus, KNX, and proprietary field buses. Its 500 MHz performance and Linux support enable on-device analytics while bridging. Industrial-grade silicon meets continuous-operation reliability expectations for building management.
推荐
Secure Point-of-Sale Terminals
The ATSAMA5D225C-D1M-CUR's hardware AES/SHA/TRNG, secure boot, tamper detection, and integrated DDR2 make it suitable for PIN pads and POS terminals where PCI PTS certification demands robust cryptographic isolation. The Cortex-A5 runs Linux-based payment stacks while TrustZone isolates sensitive operations from application code.
推荐
Connected Medical Device Peripherals
The ATSAMA5D225C-D1M-CUR's embedded audio subsystem, touch controller, secure data storage, and Linux capability fit connected medical peripherals like patient-bedside terminals and diagnostic-device HMI. Industrial temperature range and Microchip's product longevity program support long-life medical certifications. Always perform FDA/IEC 60601 qualification for the integrated system.
推荐
推荐产品汇总
工程参考数据： ATSAMA5D225C-D1M-CUR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAMA5D225C-D1M-CU | ATSAMA5D21C-CUR | ATSAMA5D21B-CU | ATSAMA5D23B-CUR | ATSAMA5D28B-CUR |
|---|---|---|---|---|---|---|
| Package | 196-ball TFBGA (11x11) | 196-ball TFBGA (11x11) - same | 196-ball TFBGA (11x11) - same | 196-ball TFBGA (11x11) - same | 196-ball TFBGA (11x11) - same | 196-ball TFBGA (11x11) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz |
| Integrated DRAM | 128 Mbit DDR2 (16-bit) | 128 Mbit DDR2 (16-bit) | 128 Mbit LPDDR2 | 128 Mbit LPDDR2 | 128 Mbit LPDDR2 | 256 Mbit LPDDR2 |
| Package Type | SiP (System-in-Package) | SiP | SiP | SiP | SiP | SiP |
| Security | TrustZone, AES, SHA, TRNG, secure boot | TrustZone, AES, SHA, TRNG | TrustZone, AES, SHA, TRNG | TrustZone, AES, SHA, TRNG | TrustZone, AES, SHA, TRNG | TrustZone, AES, SHA, TRNG |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
关键差异点
- Integrated 128 Mbit DDR2 SDRAM in SiP eliminates external DRAM routing （对比 Bare SAMA5D2 MPU without SiP)
- Same-package drop-in SAMA5D2 family alternatives with different DRAM densities （对比 ATSAMA5D28B-CUR)
- Hardware cryptographic accelerators with Arm TrustZone （对比 ATSAMA5D23B-CUR)
设计说明
The 196-ball TFBGA 0.8 mm pitch enables a 4-layer PCB, but designers must still maintain continuous ground stitching under the BGA and route DDR2 address/command/clock signals with controlled impedance (50 ohm single-ended, 100 ohm differential). Follow Microchip's SAMA5D2 hardware design checklist for VTT termination, decoupling capacitor placement, and length-matching rules for the integrated 128 Mbit DDR2.
Provide separate supply rails for VDDcore, VDDIO, VDDIODDR, and VDDAUD/PLL as documented in the SAMA5D2 datasheet power-supply section. The integrated DDR2 still requires VDDIODDR rail sequencing relative to VDDcore. Use Microchip's recommended PMIC or discrete LDO chain; do not share decoupling between noisy and quiet rails to prevent audio-subsystem noise coupling.
Configure the boot mode straps (BMS, JTAG select, boot media select) with the correct pull-up/pull-down resistors before power-up - incorrect strap values commonly cause the device to boot from the wrong source or refuse to boot entirely. Verify the package marking suffix (CUR vs CU) matches the reel orientation for SMT pick-and-place programming.
Estimated: at 500 MHz CPU utilization with 1.0 V VDDcore, the Cortex-A5 core plus integrated DDR2 dissipates roughly 1.5-2.0 W worst-case. The 196-ball TFBGA's theta_JA is typically 25-35 C/W on a 4-layer PCB with adequate ground stitching, so junction temperature rise is roughly 40-70 C above ambient - acceptable within the -40C to +85C industrial range if airflow is provided in sealed enclosures.
合规信息
RoHS-compliant 'BGA GREEN' per Mouser listing. Industrial temperature grade (not AEC-Q100 qualified - choose automotive SAMA5D2 variants for AEC-Q100). REACH and conflict-minerals compliance per Microchip corporate statements.
