ATSAMA5D23B-CU - Cortex-A5 500MHz MPU, 196-TFBGA | Microchip
料号： ATSAMA5D23B-CU ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.4 | $18.40 |
| 10 | $16.55 | $165.50 |
| 100 | $14.7 | $1,470.00 |
| 500 | $13.25 | $6,625.00 |
| 1,000 | $11.9 | $11,900.00 |
ATSAMA5D23B-CU 概述
A microprocessor unit (MPU) is a system-on-chip class processor that integrates CPU cores, memory controllers, and a wide peripheral set on a single die. The ATSAMA5D23B-CU sits in the broader hierarchy of embedded ARM cores (Cortex-A5 -> ARMv7-A architecture -> application processor) and within the Microchip SAMA5D2 family of low-power MPUs. This part family targets industrial HMI, IoT edge gateways, and battery-powered connected devices where Linux- or RTOS-class compute is required without the power envelope of a full Cortex-A7/A9.
Key features include an ARM Cortex-A5 core at up to 500 MHz with NEON SIMD and TrustZone, 128 KB on-chip SRAM, 16-bit DDR2/LPDDR/LPDDR2 controller, and an advanced peripheral set including dual EMAC, dual CAN-FD, USB HS, LCD controller with 2D acceleration, QSPI, and a 12-bit ADC. Power management is simplified by a single 1.2V core supply and integrated LDO/LDO switchover options. The class-leading 5 uA backup current enables long battery-life designs and wake-on-interrupt operation.
Architecturally, the ATSAMA5D23B-CU implements an ARMv7-A Cortex-A5 with a 32 KB instruction cache, 32 KB data cache, and NEON media engine. The on-chip peripheral DMA (PDC) and dedicated bus matrix allow concurrent data movement across multiple interfaces without CPU intervention, enabling smooth multimedia HMI rendering at low clock frequencies.
Typical applications include industrial human-machine interfaces (HMI), smart energy gateways, building automation controllers, portable medical data terminals, and connected IoT edge nodes. The integrated LCD controller with 2D accelerator makes it especially suited for graphical touch panel applications.
When designing with the ATSAMA5D23B-CU, careful attention to PCB layout is required for the 0.8 mm pitch BGA. Use microvia stack-ups on at least four layers, with a continuous ground plane under the package for thermal dissipation. Decoupling requires 100 nF capacitors within 1 mm of each dedicated power pin pair to maintain signal integrity for the DDR2 interface.
This page synthesizes distributor stock and pricing data, SAMA5D2 family drop-in alternatives, and PCB design considerations not found in the standalone datasheet PDF.
直接替换替代料： ATSAMA5D23B-CU ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAMA5D23B-CU （相同外形与封装尺寸） ——差异在于 Package, Ethernet, USB, External Memory Support, Backup Mode Current.
快速对比工具——选择替代料号进行并排对比：
ATSAMA5D21B-CU
✅ 直接替换✓ 有现货
$9.8 / 个
查看数据手册 →ATSAMA5D21C-CUR
✅ 直接替换✓ 有现货
$11.65 / 个
查看数据手册 →ATSAMA5D22B-CUR
✅ 直接替换✓ 有现货
$9.1 / 个
查看数据手册 →ATSAMA5D22C-CU
✅ 直接替换✓ 有现货
$7.14 / 个
查看数据手册 →ATSAMA5D27C-CU
✅ 直接替换✓ 有现货
$11.9 / 个
查看数据手册 →ATSAMA5D23B-CU 最大额定值与电气特性
| Core Architecture | ARM Cortex-A5 (ARMv7-A) |
| Maximum Core Frequency | 500 MHz |
| Core Count | 1 |
| Internal SRAM | 128 KB |
| External Memory Interface | 16-bit DDR2/LPDDR/LPDDR2 |
| 封装 | 196-TFBGA (11x11 mm) |
| Ball Pitch | 0.8 mm |
| 电源电压 | 1.2 V core |
| 工作温度 | -40C to +85C (industrial) |
| Backup Current | 5 uA typical |
| Graphics | Integrated LCD controller with 2D accelerator |
| Ethernet | Dual 10/100 EMAC |
| USB | USB 2.0 High-Speed Host + Device |
| CAN | Dual CAN-FD |
| ADC | 12-bit, 16-channel |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
ATSAMA5D23B-CU 196-tfbga (11x11 mm) 引脚配置指南
ATSAMA5D23B-CU（196-tfbga (11x11 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAMA5D23B-CU.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAMA5D23B-CU 适用于 6 应用s: Industrial Human-Machine Interface (HMI), Smart Energy Metering Gateway, IoT Edge Gateway and Sensor Hub, Building Automation Controller, Portable Medical Data Terminal, Connected Industrial Printer / Labeling.
Industrial Human-Machine Interface (HMI)
The ATSAMA5D23B-CU's 500 MHz ARM Cortex-A5 core, integrated LCD controller with 2D hardware acceleration, and dual 10/100 EMAC make it a strong fit for industrial HMI panels with 4.3 to 7 inch TFT touchscreens. Its 128 KB of on-chip SRAM reduces latency for real-time UI rendering while the external DDR2 controller drives display frame buffers smoothly. The SAMA5D2 family supports the Linux mainline kernel, enabling Chromium-based HMI runtimes. Compared to Cortex-M7 MCUs, the ATSAMA5D23B-CU adds full Linux, Qt/GTK GUI stacks, and easy network connectivity. Power dissipation of roughly 0.6W at full load is acceptable in fanless panel designs.
推荐
Smart Energy Metering Gateway
With 5 uA typical backup current, dual CAN-FD bus interfaces, and dual 10/100 Ethernet MACs, the ATSAMA5D23B-CU suits smart energy gateways that aggregate data from multiple metering buses. The Cortex-A5 core runs Linux with full TCP/IP stacks and supports TLS 1.3 for secure AMI backhaul. The DDR2/LPDDR2 controller provides ample memory for protocol buffers and local analytics. Industrial -40C to +85C operation matches outdoor meter enclosure environments. The same 196-TFBGA footprint shared across the SAMA5D2 family lets manufacturers stock one PCB for several product tiers.
推荐
IoT Edge Gateway and Sensor Hub
The ATSAMA5D23B-CU combines Cortex-A5 Linux compute with hardware accelerators (LCD, EMAC, CAN-FD, USB HS) that are ideal for IoT edge gateways aggregating BLE/Zigbee/LoRa sensor traffic. The 196-TFBGA package and 0.8 mm pitch fit compact DIN-rail or fanless industrial housings. Linux mainline support enables Docker/container deployment of analytics workloads at the edge, and the 5 uA backup mode lets the gateway maintain RTC wake scheduling on battery backup. Drop-in alternatives like the ATSAMA5D27C-CU provide 696 MHz headroom for AI inference at the edge.
推荐
Building Automation Controller
Building automation controllers rely on the ATSAMA5D23B-CU's mix of fieldbus support (CAN-FD, RS-485 via UART, dual Ethernet) and graphics capability for touch panels in HVAC, lighting, and access control. The Cortex-A5 runs BACnet, KNX, or Modbus stacks under Linux. Industrial temperature operation and the 11x11 mm BGA package fit small control cabinets. The SAMA5D2 family's PMIC companion and 5 uA backup current simplify UPS-style operation during grid events.
推荐
Portable Medical Data Terminal
Medical handheld terminals benefit from the ATSAMA5D23B-CU's balance of low power, integrated LCD, and USB HS for docking stations. The Cortex-A5 runs secure Linux builds for HIPAA-compliant patient data handling, with TrustZone support for credential isolation. The 5 uA backup current lets the device sleep for weeks between shifts. The 196-TFBGA package is small enough for handheld form factors and supports extended -40C to +85C operation for clinical and field environments.
推荐
Connected Industrial Printer / Labeling
Industrial label printers and signage controllers use the ATSAMA5D23B-CU for its USB HS host (driving printers/scanners), dual Ethernet for plant networks, and the LCD controller for operator panels. The DDR2 interface supports large font and graphics caches. Linux support simplifies deployment of CUPS, PostScript interpreters, or vendor-specific RIP firmware. Drop-in 196-TFBGA compatibility with the ATSAMA5D27C-CU enables a single PCB for entry and high-end printer models.
推荐
推荐产品汇总
工程参考数据： ATSAMA5D23B-CU ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAMA5D21B-CU | ATSAMA5D21C-CUR | ATSAMA5D22B-CUR | ATSAMA5D22C-CU | ATSAMA5D27C-CU |
|---|---|---|---|---|---|---|
| Package | 196-TFBGA (11x11 mm) | 196-TFBGA (11x11 mm) - same | 196-TFBGA (11x11 mm) - same | 196-TFBGA (11x11 mm) - same | 196-TFBGA (11x11 mm) - same | 196-TFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 |
| Maximum Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 696 MHz |
| On-chip SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Integrated DDR2 | No (external required) | No (external required) | No (external required) | No (external required) | No (external required) | 128 MB integrated DDR2 |
| Backup Current | 5 uA | 5 uA | 5 uA | 5 uA | 5 uA | 5 uA |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Silicon Revision | B | B | C | B | C | C |
关键差异点
- Drop-in compatibility across the SAMA5D2 family for a single PCB design （对比 ATSAMA5D27C-CU)
- 5 uA backup current enables multi-year battery life （对比 ATSAM3U4CA-CU)
- Industrial -40C to +85C operating range with full Linux support （对比 Consumer Cortex-A5 MPUs (e.g., SAMA5D4 family))
- Integrated LCD controller with 2D acceleration reduces BOM cost （对比 ATSAMA5D22B-CUR)
设计说明
The 196-ball TFBGA at 0.8 mm pitch requires a microvia PCB stack-up for reliable assembly. Use at least a 4-layer board with via-in-pad, 0.4 mm laser-drilled microvias, and a continuous ground plane directly under the BGA to provide thermal spreading and reference return paths for the DDR2 interface. Per Microchip SAMA5D2 hardware design guidelines, the trace length from the MPU balls to the external DDR2/LPDDR2 memory must be length-matched to within 25 mil for the byte lanes.
The ATSAMA5D23B-CU requires a 1.2V core supply capable of delivering approximately 600 mA at full 500 MHz load. Decoupling requires one 100 nF ceramic capacitor per power pin pair placed within 1 mm of the ball, plus bulk 4.7 uF and 10 uF capacitors at the regulator output. For backup mode, the SAMA5D2 family supports an integrated backup LDO that maintains RTC and a 32 kHz crystal oscillator while drawing only 5 uA, so route the backup supply pin to a small coin-cell or supercap.
Estimated: at 1.2V core and 500 MHz with typical industrial activity, the ATSAMA5D23B-CU dissipates approximately 0.6W. Without the exposed thermal pad properly soldered to inner copper planes, junction temperature can rise 30-40C above ambient in a sealed enclosure. Microchip recommends at least four 5x5 mm thermal via arrays stitched to an inner ground plane under the central BGA balls to keep junction rise below 25C.
A common mistake is using wrong boot configuration: the ATSAMA5D23B-CU samples the BMS (Boot Mode Select) pins at reset to choose between SD card, QSPI flash, NAND, and SPI flash boot sources. Always strap these pins through 10K resistors with clean ground references - floating boot pins can cause silent boot failures. Also, the SAMA5D2 family requires firmware to enable the DDR2 controller PHY before first access; trying to boot Linux without programming the MPDDRC will result in no console output.
Route the DDR2 byte lanes as a matched group, keeping each byte's DQS, DQ, and DM signals within 25 mil of each other. Place the DDR2 reference voltage (VREF) decoupling capacitor within 200 mil of the MPU pin and keep the VREF trace away from switching signals. The 2D LCD controller output bus should be routed on inner layers with a continuous ground reference to avoid crosstalk into the touch-sensing ADC channels.
合规信息
RoHS compliant per Microchip product page and Heisener distributor listing. Industrial -40C to +85C grade. Not AEC-Q100 qualified - automotive designs should evaluate the SAMA5D27C automotive variant.