ATSAMD51J18A-AF - SAM D51 Cortex-M4F MCU 120MHz 256KB | Microchip
料号： ATSAMD51J18A-AF ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.1 | $7.10 |
| 10 | $6.4 | $64.00 |
| 100 | $5.65 | $565.00 |
| 500 | $5.05 | $2,525.00 |
| 1,000 | $4.5 | $4,500.00 |
ATSAMD51J18A-AF 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a rich set of peripherals such as timers, communication controllers, and analog blocks. The Cortex-M4F sits within the broader taxonomy of ARM Cortex-M cores (M0/M0+ -> M3 -> M4/M4F -> M7) and is positioned for DSP-class workloads while retaining deterministic interrupt behaviour and low-power Sleep modes. The SAM D51 family extends this core with Microchip's peripheral set, dual-panel Flash with ECC, and a dedicated Cortex-M4 core with FPU for floating-point acceleration.
Key features of the ATSAMD51J18A-AF include: up to 120 MHz core clock with single-precision FPU and DSP instructions, 256 KB dual-panel Flash with error correction, up to 128 KB SRAM, full-speed USB 2.0 device/host with on-the-go capability, a 12-bit 1 MSPS ADC with up to 16 channels, multiple SERCOM modules configurable as UART/SPI/I2C, I2S for digital audio, SDHC for memory cards, and an extended industrial operating temperature range. The 64-pin TQFP package balances I/O count with hand-solder-friendly pitch, simplifying prototype bring-up.
The architecture combines a Cortex-M4F core with a multi-layer bus matrix (AHB/APB) that allows simultaneous DMA-driven peripheral access and CPU execution. Hardware cryptographic acceleration (AES, True Random Number Generator), a high-precision internal 48 MHz DFLL, and an Event System for inter-peripheral signalling reduce CPU overhead and enable deterministic real-time response. Compared with Cortex-M0+ parts in the SAM D20/D21 family, the D51 delivers roughly 4x compute performance and substantially richer analog and connectivity resources.
Typical applications include industrial HMI panels, USB peripherals such as HID and CDC devices, audio playback stages using I2S codecs, smart sensor hubs, and low-power IoT edge nodes. The integrated FPU simplifies control-loop math and DSP-style filtering on a single MCU without an external DSP.
When designing with the ATSAMD51J18A-AF, ensure the 64-pin TQFP land pattern is allocated correctly and that decoupling follows Microchip's recommended 100 nF + bulk capacitor scheme near each supply pin. For USB applications the DP/DN lines require 90 ohm differential routing and an ESD array; for I2S audio, the MCLK-to-LRCLK ratio must match the codec's requirements and jitter on MCLK should be kept below the codec's specification.
直接替换替代料： ATSAMD51J18A-AF ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAMD51J18A-AF （相同外形与封装尺寸） ——差异在于 SRAM, MSL Level, Program Memory (Flash), Mounting Type, Package.
快速对比工具——选择替代料号进行并排对比：
ATSAMD51J18A-AU
✅ 直接替换✓ 有现货
$4.39 / 个
查看数据手册 →ATSAMD51J19A-AF
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMD51J20A-AF
✅ 直接替换✓ 有现货
$5.85 / 个
查看数据手册 →ATSAMD51G18A-MF
✅ 直接替换✓ 有现货
$5.11 / 个
查看数据手册 →ATSAMD51J18A-AUT
✅ 直接替换✓ 有现货
$4.78 / 个
查看数据手册 →ATSAMD51P20A-CF
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMD51J18A-AF 最大额定值与电气特性
| Core Architecture | ARM Cortex-M4F with single-precision FPU and DSP extensions |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 256 KB dual-panel with ECC |
| SRAM | Up to 128 KB |
| 封装 | 64-pin TQFP (10x10 mm) |
| Supply Voltage (VDD) | 1.71 V to 3.63 V |
| 工作温度 | -40C to +125C (extended industrial) |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 12-bit, up to 16 channels, 1 MSPS |
| Communication Peripherals (SERCOM) | Multiple SERCOM configurable as UART/SPI/I2C |
| Audio Interface | I2S |
| Storage Interface | SDHC / SDMMC |
| 安装类型 | Surface Mount (TQFP) |
| RoHS 状态 | Compliant |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
ATSAMD51J18A-AF 引脚配置
| 引脚 1 | PA03 — General-purpose I/O / ADC input |
| 引脚 2 | PA04 — General-purpose I/O / ADC input |
| 引脚 3 | PA05 — General-purpose I/O |
| 引脚 4 | PA06 — General-purpose I/O |
| 引脚 5 | PA07 — General-purpose I/O |
| 引脚 6 | PA08 — General-purpose I/O / I2S |
| 引脚 7 | PA09 — General-purpose I/O / I2S |
| 引脚 8 | PA10 — General-purpose I/O |
| 引脚 9 | PA11 — General-purpose I/O / USB DM |
| 引脚 10 | VDDIO — I/O supply voltage |
| 引脚 11 | GND — Ground |
| 引脚 12 | PA12 — General-purpose I/O / USB DP |
| 引脚 13 | PA13 — General-purpose I/O |
| 引脚 14 | PA14 — General-purpose I/O |
| 引脚 15 | PA15 — General-purpose I/O |
| 引脚 16 | PA16 — General-purpose I/O / I2C SDA |
| 引脚 17 | PA17 — General-purpose I/O / I2C SCL |
| 引脚 18 | PA18 — General-purpose I/O |
| 引脚 19 | PA19 — General-purpose I/O |
| 引脚 20 | VDDCORE — Core supply (decoupling) |
| 引脚 21 | PA20 — General-purpose I/O |
| 引脚 22 | PA21 — General-purpose I/O |
| 引脚 23 | PA22 — General-purpose I/O |
| 引脚 24 | PA23 — General-purpose I/O |
| 引脚 25 | PA24 — General-purpose I/O |
| 引脚 26 | PA25 — General-purpose I/O |
| 引脚 27 | PA27 — General-purpose I/O |
| 引脚 28 | RESETN — Active-low reset input |
| 引脚 29 | VDDIO — I/O supply voltage |
| 引脚 30 | GND — Ground |
| 引脚 31 | PB00 — General-purpose I/O |
| 引脚 32 | PB01 — General-purpose I/O |
| 引脚 33 | PB02 — General-purpose I/O / ADC |
| 引脚 34 | PB03 — General-purpose I/O / ADC |
| 引脚 35 | PB04 — General-purpose I/O / ADC |
| 引脚 36 | PB05 — General-purpose I/O / ADC |
| 引脚 37 | PB06 — General-purpose I/O |
| 引脚 38 | PB07 — General-purpose I/O |
| 引脚 39 | PB08 — General-purpose I/O |
| 引脚 40 | PB09 — General-purpose I/O |
| 引脚 41 | PB10 — General-purpose I/O |
| 引脚 42 | PB11 — General-purpose I/O |
| 引脚 43 | PB12 — General-purpose I/O |
| 引脚 44 | PB13 — General-purpose I/O |
| 引脚 45 | PB14 — General-purpose I/O |
| 引脚 46 | PB15 — General-purpose I/O |
| 引脚 47 | PB16 — General-purpose I/O |
| 引脚 48 | PB17 — General-purpose I/O |
| 引脚 49 | PB18 — General-purpose I/O |
| 引脚 50 | PB19 — General-purpose I/O |
| 引脚 51 | PB20 — General-purpose I/O |
| 引脚 52 | PB21 — General-purpose I/O |
| 引脚 53 | PB22 — General-purpose I/O |
| 引脚 54 | PB23 — General-purpose I/O |
| 引脚 55 | PB24 — General-purpose I/O |
| 引脚 56 | PB25 — General-purpose I/O |
| 引脚 57 | VDDIO — I/O supply voltage |
| 引脚 58 | GND — Ground |
| 引脚 59 | PA00 — General-purpose I/O / XIN |
| 引脚 60 | PA01 — General-purpose I/O / XOUT |
| 引脚 61 | PA02 — General-purpose I/O / ADC |
| 引脚 62 | VDDIO — I/O supply voltage |
| 引脚 63 | GND — Ground |
| 引脚 64 | NC — Not connected (per datasheet) |
典型应用
ATSAMD51J18A-AF 适用于 6 应用s: Industrial HMI Touch Panels, USB HID / CDC Peripherals, Audio Playback Devices (I2S DACs), Smart Sensor Hubs, Low-Power IoT Edge Nodes, Motor Control and BLDC Drivers.
Industrial HMI Touch Panels
The ATSAMD51J18A-AF suits industrial HMI panels requiring responsive touch and graphics. Its 120 MHz Cortex-M4F with FPU drives LCD controllers and renders UI assets at 60 fps, while the 256 KB Flash stores fonts, icons, and the application. The 12-bit ADC reads panel temperature sensors, and SERCOM channels drive I2C touch controllers. USB Full-Speed supports firmware update via CDC. The extended -40C to +125C range handles factory floor conditions; integrated DMA offloads touch sampling from the CPU for deterministic response.
推荐
USB HID / CDC Peripherals
The integrated USB 2.0 Full-Speed Device/Host/OTG controller makes the ATSAMD51J18A-AF ideal for HID keyboards, mice, CDC serial adapters, and custom USB peripherals. The Cortex-M4F handles HID report descriptors and protocol stacks in 256 KB Flash, while the FPU accelerates any cryptographic processing required by HID-over-USB with security extensions. The 90 ohm differential pair routing guideline matches the on-chip PHY; designers add an ESD array on DP/DN to meet IEC 61000-4-2 for industrial USB ports.
推荐
Audio Playback Devices (I2S DACs)
The ATSAMD51J18A-AF's I2S peripheral and Cortex-M4F FPU make it suitable for digital audio playback applications such as Bluetooth speakers, headphone amplifiers, and home audio streamers. The FPU executes biquad filters and dynamic range compression in real time, while I2S delivers bit-perfect data to external DACs. DMA-driven I2S streams free the CPU for Bluetooth stack management. The 64-TQFP package provides ample GPIO for rotary encoders, button inputs, and LED indicators in consumer audio devices.
推荐
Smart Sensor Hubs
Industrial and IoT sensor hubs benefit from the ATSAMD51J18A-AF's combination of high-performance core, multiple SERCOM channels (UART/SPI/I2C), and 12-bit ADC. The Cortex-M4F runs sensor fusion algorithms such as Kalman filtering and FFT-based vibration analysis in real time. DMA channels move sensor data from SPI/I2C peripherals to SRAM without CPU intervention, leaving bandwidth for edge analytics. Up to 16 ADC channels read analog sensors (temperature, pressure, current) directly, simplifying BOM.
推荐
Low-Power IoT Edge Nodes
The SAM D51's low-power Sleep modes (down to single-digit microamps retention) and 120 MHz active performance let the ATSAMD51J18A-AF serve as an IoT edge node running sensor sampling, edge inference, and LoRa/Wi-Fi/BLE stack management. The Event System links peripherals directly to wake sources without CPU involvement. Designers can shut down unused SERCOM blocks individually for additional savings. The -40C to +125C operating range supports outdoor deployment.
推荐
Motor Control and BLDC Drivers
The ATSAMD51J18A-AF's 120 MHz Cortex-M4F core, hardware PWM timers, and 12-bit ADC support sensorless and sensored BLDC/PMSM motor control loops at high PWM frequencies. The FPU executes field-oriented control (FOC) math without integer scaling penalties, while the ADC's 1 MSPS sample rate enables sub-microsecond current sensing. The 64-TQFP exposes enough GPIO for three-phase PWM, encoder input, and fault detection. The wide supply range allows direct 3.3 V MOSFET driver interface.
推荐
推荐产品汇总
工程参考数据： ATSAMD51J18A-AF ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAMD51J18A-AU | ATSAMD51J19A-AF | ATSAMD51G18A-MF | ATSAMD51P20A-CF |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-QFN (9x9 mm) | 100-TQFP (14x14 mm) |
| Core | ARM Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 256 KB | 256 KB | 512 KB | 256 KB | 1 MB |
| SRAM | 128 KB | 128 KB | 192 KB | 128 KB | 256 KB |
| USB | Full-Speed OTG | Full-Speed OTG | Full-Speed OTG | Full-Speed OTG | Full-Speed OTG |
| ADC | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Approx. Price (qty 1000) | USD 4.50 | USD 4.50 | USD 5.50 | USD 4.50 | USD 8.00 |
关键差异点
- Same-die upgrade paths in identical TQFP footprint （对比 ATSAMD51J18A-AU)
- QFN variant for space-constrained designs （对比 ATSAMD51G18A-MF)
- Cost-effective tray packaging for prototyping （对比 ATSAMD51J18A-AU)
设计说明
Place a 100 nF decoupling capacitor within 3 mm of every VDDIO pin and a single 4.7 uF bulk capacitor near the VDDIN pins. The VDDCORE pin requires a 1 uF low-ESR capacitor placed as close as possible. Use Microchip's SAM D51 design checklist for the DC-DC inductor selection if you enable the on-chip DC-DC converter; the inductor must be 4.7 uH shielded with saturation current above 200 mA.
Route the USB DP/DN pair as a 90 ohm differential with maximum 3 mm length mismatch and continuous ground reference plane beneath. Place the 27 ohm series termination resistors within 4 mm of the MCU pins. For I2S audio, route MCLK, BCLK, and LRCLK as length-matched pairs (<5 mm delta) and keep them away from switching power lines to minimise jitter. The SDHC lines should also be length-matched within 1 mm to meet SD card timing.
Do not leave the RESETN pin floating - it must have a 10 kohm pull-up to VDDIO and a 1 nF capacitor to ground for noise immunity. The NVMCTRL (Flash) controller requires the system clock to be at or below 48 MHz before write/erase operations; configure the NVMCTRL write mode accordingly in your firmware. Enable the WDT (Watchdog Timer) in hardware startup code for reliable industrial deployment.
At 120 MHz with all peripherals active, the ATSAMD51J18A-AF dissipates up to ~200 mW. The 64-TQFP package has a thermal resistance theta_JA of approximately 35 C/W on a 2-layer JEDEC test board, giving a ~7C rise above ambient at full load. Ensure adequate copper pours on VDDIO/GND planes under the exposed pad (if used) and provide minimum 1 square inch of copper for thermal relief at elevated ambient temperatures.
合规信息
RoHS and REACH compliance confirmed via Microchip product page. AEC-Q100 not qualified - automotive designs should consider the SAM RH71 or SAM E70 family. Halogen-free per Microchip green-compound declarations.
