BCM56873A0KFSBG - 2.0T 20x100GbE Ethernet Switch | Broadcom
料号： BCM56873A0KFSBG ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
| 3,000 | $0 | $0.00 |
BCM56873A0KFSBG 概述
An Ethernet switch ASIC is a semiconductor that receives Ethernet frames on multiple ports, inspects their destination information, applies configured forwarding or filtering policies, and transmits frames through the appropriate output ports. In the broader networking hierarchy, BCM56873A0KFSBG belongs to the Ethernet switch ASIC, network processor, communications semiconductor, and semiconductor device categories. Its 2.0T switching class is intended to support modern data-center traffic profiles with high port density and aggregate bandwidth.
The verified distributor description identifies the BCM56873A0KFSBG as a 2.0T, 20 × 100GbE multilayer switch. The 20-port configuration supports dense high-speed Ethernet interfaces, while the multilayer-switch positioning indicates support for traffic-management functions beyond simple port forwarding. Because the supplied data does not include detailed electrical limits, pin names, clocking details, power characteristics, or software-support information, those parameters remain explicitly marked for datasheet review.
Typical deployments include data-center leaf and spine fabrics, cloud infrastructure, high-performance computing interconnects, storage networks, and telecom aggregation equipment. In these applications, switching capacity, port count, and forwarding architecture determine how efficiently multiple 100GbE links can be consolidated. The part should be selected only when the system design is specifically prepared for the BCM56873A0KFSBG package, electrical requirements, reference interfaces, and Broadcom software or firmware ecosystem.
The most important design verification steps are to obtain the exact manufacturer datasheet and confirm package dimensions, ball assignments, supply rails, power sequencing, thermal limits, reference-clock requirements, SerDes interfaces, and supported protocols. Do not infer pin compatibility or replacement suitability from distributor descriptions alone. This page separates verified data from missing technical information rather than estimating values that were not supplied.
直接替换替代料： BCM56873A0KFSBG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
BCM56771A0KFSBG
✅ 直接替换📋 参考替代料（不在目录中）
BCM56873A0KFSBG 最大额定值与电气特性
| Product Type | 2.0T multilayer Ethernet switch ASIC |
| Aggregate Switching Capability | 2.0T |
| Ethernet Port Configuration | 20 × 100GbE |
| Port Count | 20 ports |
| Per-Port Data Rate | 100GbE per port |
| Device Category | Ethernet switch IC |
| Switching Architecture | Multilayer switch |
| Application Domain | Data-center and cloud networking |
| Manufacturer | Broadcom |
| Manufacturer Product Classification | Signal Switches, Multiplexers, Decoders and Logic ICs |
| 安装类型 | Surface mount |
| RoHS 状态 | ROHS3 compliant |
BCM56873A0KFSBG standard 引脚配置指南
BCM56873A0KFSBG（standard 封装）的引脚配置。 该模拟元件具有输入、输出和电源引脚。请参阅制造商数据手册以了解失调调零、补偿和使能引脚配置。适用于信号调理和放大器电路。
暂无详细引脚数据： BCM56873A0KFSBG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
BCM56873A0KFSBG 适用于 6 应用s: Data-Center Leaf Switching, Spine and Fabric Aggregation, Cloud Network Interconnect, High-Performance Computing Interconnect, Storage Network Switching, Telecom and Carrier Ethernet Aggregation.
Data-Center Leaf Switching
BCM56873A0KFSBG fits data-center leaf-switch designs that require 20 high-speed 100GbE connections and a 2.0T switching class. It can provide the forwarding foundation for servers, storage nodes, and top-of-rack traffic entering a fabric. The part is appropriate only when the board design follows the exact Broadcom reference interface, power, thermal, and package requirements. Because the verified data does not specify lane rates beyond the 100GbE port description, SerDes configuration, loss targets, or clocking, those details must be confirmed from the manufacturer documentation before layout release.
Spine and Fabric Aggregation
The 20 × 100GbE interface configuration makes BCM56873A0KFSBG relevant to spine-layer aggregation and high-capacity Ethernet fabric designs. Its 2.0T classification indicates a device intended for substantial aggregate switching, while the multilayer-switch description suggests that traffic-policy functions may be important in addition to basic frame forwarding. A spine design must still account for exact port mapping, buffering, routing or switching software, management interfaces, and thermal performance. Those implementation details are not included in the verified distributor snippets and should be checked against the exact Broadcom documentation.
Cloud Network Interconnect
BCM56873A0KFSBG can be evaluated for cloud network interconnect equipment requiring dense 100GbE aggregation. Its 20-port configuration may simplify chassis planning compared with lower-port-count switching devices, while the multilayer-switch classification can support managed traffic handling in cloud-facing infrastructure. Suitability depends on the target traffic profile and system architecture, including latency, oversubscription, queueing, routing or switching control, redundancy, and telemetry. No verified data confirms a specific cloud certification or software-support commitment, so the part should be treated as a hardware platform candidate pending Broadcom documentation and design validation.
High-Performance Computing Interconnect
For high-performance computing and AI infrastructure, BCM56873A0KFSBG can be considered where many 100GbE links must converge into a high-throughput switching fabric. The 2.0T class may align with bandwidth-intensive east-west traffic, provided the system can meet the switch's exact SerDes, power, thermal, and packet-processing requirements. The verified data does not provide latency, buffer size, forwarding mode, error-rate, or synchronization specifications. Engineers should therefore avoid assuming compatibility with a particular GPU, NIC, or fabric control plane until the complete interface and software documentation is reviewed.
Storage Network Switching
BCM56873A0KFSBG may be considered for storage networking equipment that uses 100GbE links for high-volume east-west data movement. Its 20-port configuration can support a concentrated switching front end for distributed storage, backup, and data-processing systems. The design must verify congestion behavior, queueing, latency, lossless networking behavior, and traffic-management features because those values are not included in the supplied verified data. A storage network also requires careful validation of cable, optical-module, and NIC interoperability. The target should not be treated as a universal storage switch without the exact Broadcom product and software documentation.
Telecom and Carrier Ethernet Aggregation
The 20 × 100GbE interface count and multilayer-switch positioning make BCM56873A0KFSBG a candidate for telecom or carrier-Ethernet aggregation equipment with high-capacity uplinks. Such systems may use the device in transport, routing, or service-edge architectures, but the exact supported protocols and feature licenses are not present in the verified search data. Before selection, engineers should confirm Ethernet protocol support, service mapping, timing, redundancy, management, and long-term software maintenance from the manufacturer. The package and electrical design must also be validated against carrier-grade temperature,EMC, and reliability requirements where applicable.
工程参考数据： BCM56873A0KFSBG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | BCM56771A0KFSBG |
|---|---|---|
| Brand | Broadcom | Broadcom |
关键差异点
- High aggregate switching class （对比 BCM56771A0KFSBG)
- Dense 100GbE port configuration （对比 BCM56771A0KFSBG)
- Supplier availability visibility （对比 BCM56771A0KFSBG)
设计说明
Do not treat the 2.0T, 20 × 100GbE description as proof that a candidate switch is replaceable. Before layout or procurement substitution, compare the exact ball map, power rails, SerDes lanes, reference clocks, reset behavior, management interfaces, and software dependencies. The supplied data identifies BCM56771A0KFSBG only as a comparison lead, not as a verified drop-in replacement.
Obtain the official Broadcom package drawing and reference schematic before committing a board layout. The verified data confirms only that the component is a Broadcom BGA and does not provide ball count, ball pitch, pad geometry, or pin assignments. High-speed Ethernet switch designs require controlled-length routing, suitable return paths, and exact power and ground-plane construction.
Use the manufacturer datasheet to establish power dissipation, junction-temperature limits, thermal resistance, and airflow requirements. These values are absent from the verified distributor snippets. In a 20-port 100GbE switching platform, board-level thermal analysis should include the switch, power-conversion components, optical modules or cages, connectors, and surrounding circuitry under worst-case traffic and ambient conditions.
Validate every high-speed interface against the exact Broadcom electrical and timing requirements. The supplied data does not specify SerDes lane rates, insertion-loss budgets, equalization, reference clocks, or connector and transceiver requirements. PCB design should therefore follow the released reference design and use controlled impedance, continuous reference planes, appropriate via transitions, and compliance testing before production.
合规信息
The verified ICS-100 distributor snippet states ROHS3 Compliant. No other compliance declarations were supplied.
